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SPC564A70L7CFAY

STMicroelectronics

SPC564A70L7CFAY by STMicroelectronics

SPC564A70L7CFAY by STMicroelectronics is a 32-bit microcontroller with 22-bit address bus width, 16-bit external data bus width, and max clock frequency of 40 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed processing such as automotive engine control units.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,819 parts In-Stock

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Anansix

USA . 1,092 parts In-Stock

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Digiode

USA . 1,055 parts In-Stock

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1,055

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Distributors (Availability)

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AZTECH Wire

Italy . 711 parts In-Stock

1+ parts

$9.270

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711

$9.270

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IDEA Electronic Components Group

UK . 2,274 parts In-Stock

1+ parts

$72.523

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$65.270

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2,274

$72.523

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$65.270

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MKK Technologies

India . 1,591 parts In-Stock

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$136.374

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1,591

$136.374

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DigiPath Technology Company

USA . 1,591 parts In-Stock

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$136.374

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1,591

$136.374

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Component Stockers USA

USA . 486 parts In-Stock

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$235.850

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486

$235.850

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QUARKTWIN TECHNOLOGY LTD

USA . 10,193 parts In-Stock

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Microchip USA

USA . 3,162 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 968 parts In-Stock

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968

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Perfect Parts

USA . 448 parts In-Stock

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448

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Parana Technologies

USA . 283 parts In-Stock

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$86.712

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283

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$86.712

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Overview

Unleash the power of innovation with the SPC564A70L7CFAY by STMicroelectronics. As a leader in microcontroller technology, STMicroelectronics delivers top-quality products that redefine industry standards. Ideal for a wide range of applications, this microcontroller offers unparalleled value and benefits to customers seeking high performance and reliability. Experience the advantages of cutting-edge technology with the SPC564A70L7CFAY and take your projects to new heights.

Feature Benefit Bullets

Surface Mount: YES

Makes it easy to mount on PCBs, saving space and making it suitable for compact designs.

Maximum Supply Voltage: 5.25 V

Can handle higher voltages, providing versatility in different power supply setups.

Address Bus Width: 22

Allows for addressing of up to 2^22 memory locations, offering flexibility in memory configurations.

Package Shape: SQUARE

Square shape enables efficient use of space on PCBs and facilitates easier layout designs.

Bit Size: 32

32-bit architecture provides enhanced processing power and capability for handling complex tasks.

No. of Terminals: 176

A higher number of terminals offers more connectivity options and interfaces for external devices.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This package style allows for high-density mounting with fine pitch for efficient use of PCB space.

Minimum Supply Voltage: 4.75 V

Can operate at lower voltages, increasing energy efficiency and compatibility with different power sources.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, essential for sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels improve data transfer efficiency by allowing data to be transferred directly between peripherals and memory without CPU intervention.

Terminal Position: QUAD

Quad terminal position provides a balanced layout for consistent signal paths and easier PCB routing.

Width: 24 mm

Compact width allows for space-saving integration in small form factor devices.

External Data Bus Width: 16

16-bit external data bus width supports fast data transfer rates and efficient communication with external devices.

Maximum Clock Frequency: 40 MHz

High clock frequency enables fast processing speeds and real-time responsiveness in applications.

Length: 24 mm

Compact length complements the width for overall space-efficient design and integration.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, ensuring optimized performance and compatibility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated and noise-sensitive devices.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of inspection during manufacturing and assembly processes.

Nominal Supply Voltage: 5 V

Stable 5V nominal supply voltage is commonly used in many electronic systems, ensuring compatibility with existing designs.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of digital signals for applications such as motor control and LED dimming.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and compact PCB layouts.

Speed: 150 rpm

High speed of 150 rpm facilitates rapid data processing and response times in real-time applications.

Technical Specifications

Microcontrollers SPC564A70L7CFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

16

Length:

24 mm

No. of Terminals:

176

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

150 rpm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Trade Compliance

SPC564A70L7CFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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