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SPC564A70B4CFAY

STMicroelectronics

SPC564A70B4CFAY by STMicroelectronics

STMicroelectronics SPC564A70B4CFAY microcontroller features 32-bit architecture, 22-bit address bus, and 16-bit external data bus. With a max clock frequency of 40 MHz, it is suitable for applications requiring high-speed processing such as automotive control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,170 parts In-Stock

1+ parts

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8,170

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Digiode

USA . 1,902 parts In-Stock

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1,902

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Anansix

USA . 649 parts In-Stock

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649

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 46 parts In-Stock

1+ parts

$17.260

100+ parts

-

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46

$17.260

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Microchip USA

USA . 2,467 parts In-Stock

1+ parts

$24.500

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2,467

$24.500

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IDEA Electronic Components Group

UK . 2,241 parts In-Stock

1+ parts

$37.586

100+ parts

-

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$33.827

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2,241

$37.586

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$33.827

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MKK Technologies

India . 272 parts In-Stock

1+ parts

$70.677

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272

$70.677

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DigiPath Technology Company

USA . 272 parts In-Stock

1+ parts

$70.677

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272

$70.677

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Corphita

USA . 3,144 parts In-Stock

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3,144

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Parana Technologies

USA . 2,161 parts In-Stock

1+ parts

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$44.939

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2,161

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$44.939

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Vigor

Singapore . 1,066 parts In-Stock

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1,066

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Overview

Unlock the potential of your electronic projects with the SPC564A70B4CFAY microcontroller by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics offers top-notch quality and reliability in their products. This versatile microcontroller is perfect for a wide range of applications, providing customers with unmatched value and performance. Experience seamless integration, advanced features, and cutting-edge technology with the SPC564A70B4CFAY. Elevate your projects to new heights with this innovative solution.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for efficient manufacturing processes and compact design, making it suitable for small devices and applications where space is limited.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage tolerance provides flexibility and reliability in various power supply situations.

Address Bus Width: 22

The wide address bus width of 22 allows for larger memory addressability and complex data processing capabilities.

Package Shape: SQUARE

Square package shape makes it easier to mount the microcontroller on a PCB and provides a more uniform footprint for efficient layout design.

Bit Size: 32

32-bit architecture enables high-performance computing and processing capabilities suitable for a wide range of applications.

No. of Terminals: 324

Having a large number of terminals provides versatility in connecting external components and peripherals, making it a versatile microcontroller.

Package Style (Meter): GRID ARRAY

Grid array package style offers better thermal performance, mechanical strength, and high-density design, making it suitable for demanding applications.

Minimum Supply Voltage: 4.75 V

Higher minimum supply voltage tolerance ensures operational stability even in varied power supply conditions.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, making it suitable for applications requiring sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels enhance data transfer speed and efficiency by offloading data transfer tasks from the CPU, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and routing, simplifying the design process and reducing signal interference.

Width: 23 mm

Compact width size makes it suitable for space-constrained designs and compact devices while offering high performance.

External Data Bus Width: 16

16-bit external data bus width facilitates efficient data transfer between the microcontroller and external peripherals, enhancing overall system performance.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency provides fast processing speed and improved performance capabilities, suitable for applications requiring real-time processing.

Length: 23 mm

Compact length size complements the width dimension, making it suitable for compact and space-saving design implementations.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, this product offers dedicated features and capabilities tailored for control and processing tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliability, making it suitable for battery-operated devices and power-efficient applications.

Terminal Form: BALL

Ball terminal form provides reliable and efficient soldering connections, ensuring secure physical and electrical connections on the PCB.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5V ensures consistent and reliable operation across different operating conditions, enhancing system reliability.

PWM Channels: YES

Integrated PWM channels enable precise control of connected devices such as motors, LEDs, and other peripherals, making it suitable for applications requiring precise pulse-width modulation.

Terminal Pitch: 1 mm

Fine terminal pitch of 1mm allows for high-density mounting on PCBs, enabling compact design layouts and efficient use of board space.

Speed: 150 rpm

Operating speed of 150 rpm provides fast response times and processing capabilities, suitable for applications requiring quick data processing and control tasks.

Technical Specifications

Microcontrollers SPC564A70B4CFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

16

Length:

23 mm

No. of Terminals:

324

PWM Channels:

YES

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

150 rpm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

SPC564A70B4CFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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