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SPC563M64L7COBY

STMicroelectronics

SPC563M64L7COBY by STMicroelectronics

SPC563M64L7COBY by STMicroelectronics is a 32-bit automotive microcontroller with a max supply voltage of 5.25V and operates b/w -40 °C to 125°C. It features 176 terminals, supports ADC and PWM channels, making it ideal for automotive applications. Its robust design ensures reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,899 parts In-Stock

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7,899

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Digiode

USA . 4,467 parts In-Stock

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4,467

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Anansix

USA . 589 parts In-Stock

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589

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Distributors (Availability)

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AZTECH Wire

Italy . 392 parts In-Stock

1+ parts

$8.460

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-

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392

$8.460

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Vigor

Singapore . 2,480 parts In-Stock

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$10.420

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2,480

$10.420

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IDEA Electronic Components Group

UK . 684 parts In-Stock

1+ parts

$43.976

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-

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$39.578

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684

$43.976

-

$39.578

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Advanced Electronics

New Zealand . 99 parts In-Stock

1+ parts

$64.224

100+ parts

$58.444

1k+ parts

$52.664

10k+ parts

-

99

$64.224

$58.444

$52.664

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MKK Technologies

India . 1,417 parts In-Stock

1+ parts

$82.694

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1,417

$82.694

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DigiPath Technology Company

USA . 1,417 parts In-Stock

1+ parts

$82.694

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1,417

$82.694

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QUARKTWIN TECHNOLOGY LTD

USA . 11,032 parts In-Stock

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11,032

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Microchip USA

USA . 10,268 parts In-Stock

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10,268

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Parana Technologies

USA . 1,420 parts In-Stock

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$52.580

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1,420

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$52.580

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Corphita

USA . 1,003 parts In-Stock

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1,003

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Overview

Unlock the potential of your projects with the SPC563M64L7COBY from STMicroelectronics, a leader in high-performance microcontrollers. Designed for automotive applications, this robust MCU ensures reliability under extreme conditions, delivering exceptional processing power with low power consumption. Benefit from its advanced features like ADC and DMA channels, enabling seamless integration into complex systems. Choose STMicroelectronics for unmatched quality and innovation that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and easier automated assembly, which is beneficial for modern electronic products.

Maximum Supply Voltage: 5.25 V

A maximum supply voltage of 5.25 V ensures compatibility with standard voltage regulators, enhancing system reliability.

Address Bus Width: 32

A wider address bus allows for more memory addressing, which can lead to increased performance in memory-intensive applications.

Package Shape: SQUARE

The square package shape contributes to a uniform design, facilitating easier integration onto PCBs.

Bit Size: 32

A 32-bit architecture enables the microcontroller to handle more data and instructions simultaneously, improving processing efficiency.

Power Supplies (V): 1.2, 3.3, 5

Supporting multiple voltage levels allows for flexibility in various applications and compatibility with different components.

No. of Terminals: 176

A higher number of terminals provides increased connectivity options, allowing for more peripherals and I/O operations.

Package Style (Meter): FLATPACK

The flatpack style is conducive to low-profile designs, making it beneficial for space-constrained applications.

Minimum Supply Voltage: 4.5 V

With a low minimum supply voltage, this microcontroller can operate efficiently in battery-powered systems.

Maximum Operating Temperature: 125 °C

The high-temperature rating ensures reliability and performance in demanding environments, such as automotive applications.

Minimum Operating Temperature: -40 °C

Operating in extreme cold temperatures makes this microcontroller ideal for applications in harsh climates.

ADC Channels: YES

Integrated ADC channels facilitate real-time data acquisition from analog sensors, enhancing the microcontroller's versatility.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfers between memory and peripherals, reducing CPU load.

Terminal Position: QUAD

Quad terminal positioning enhances soldering and provides better thermal management capabilities.

ROM Words: 1572864

A substantial ROM size enables extensive application code storage, allowing for more complex functionalities.

Maximum Seated Height: 1.6 mm

The low height is advantageous for minimizing the overall height profile of assembled PCBs.

Width: 24 mm

The standardized width helps in easy mounting on PCBs with existing designs.

External Data Bus Width: 64

A wide external data bus improves data throughput and overall system performance when interfacing with external devices.

Maximum Clock Frequency: 80 MHz

With a high clock frequency, this microcontroller delivers quick processing speeds, making it suitable for high-performance applications.

Length: 24 mm

The standard length is ideal for fitting into typical PCB layouts without requiring extensive modification.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, it ensures reliability and compliance with industry standards.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates multiple functionalities into a single chip, reducing overall system cost and complexity.

RAM Bytes: 96256

A considerable amount of RAM supports complex applications requiring more data handling and processing capabilities.

Technology: CMOS

CMOS technology provides low power consumption, making it ideal for battery-operated and energy-efficient devices.

Terminal Form: GULL WING

Gull wing terminals offer enhanced soldering reliability and ease of handling during PCB assembly.

Maximum Supply Current: 195 mA

The current specifications allow for strong performance while maintaining power efficiency, ideal for portable electronics.

Nominal Supply Voltage: 5 V

Operating at a common nominal voltage simplifies power supply design and integration into existing systems.

PWM Channels: YES

Integrated PWM channels support advanced motor control and signal modulation, essential for automation and robotics.

ROM Programmability: FLASH

The ability to program the ROM in flash enables easy updates and modifications to software without hardware changes.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density PCB layouts, enabling advanced and compact designs.

Speed: 64 rpm

The specified speed establishes performance capabilities relevant for applications requiring precise control or monitoring.

No. of I/O Lines: 80

A high number of I/O lines provides great flexibility in designing systems with numerous peripherals and interfaces.

Technical Specifications

Microcontrollers SPC563M64L7COBY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

No. of I/O Lines:

80

No. of Terminals:

176

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3,5

Qualification:

Not Qualified

RAM Bytes:

96256

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

195 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Trade Compliance

SPC563M64L7COBY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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