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SPC563M64L7COAY

STMicroelectronics

SPC563M64L7COAY by STMicroelectronics

SPC563M64L7COAY by STMicroelectronics is a 32-bit microcontroller designed for automotive applications, featuring a max supply voltage of 5.25V and operating temp range from -40 °C to 125°C. It supports up to 80 MHz clock speed, with 176 terminals and ADC/DMA channels. Ideal for high-performance tasks, it offers robust functionality in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,732 parts In-Stock

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7,732

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Sensible Micro Corp

USA . 1,779 parts In-Stock

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1,779

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Digiode

USA . 1,043 parts In-Stock

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1,043

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Anansix

USA . 556 parts In-Stock

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556

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Distributors (Availability)

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Vigor

Singapore . 1,904 parts In-Stock

1+ parts

$10.940

100+ parts

-

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1,904

$10.940

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AZTECH Wire

Italy . 836 parts In-Stock

1+ parts

$11.010

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-

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836

$11.010

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IDEA Electronic Components Group

UK . 630 parts In-Stock

1+ parts

$48.799

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-

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$43.919

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-

630

$48.799

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$43.919

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MKK Technologies

India . 997 parts In-Stock

1+ parts

$91.763

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997

$91.763

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DigiPath Technology Company

USA . 997 parts In-Stock

1+ parts

$91.763

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997

$91.763

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Component Stockers USA

USA . 207 parts In-Stock

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$193.520

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207

$193.520

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QUARKTWIN TECHNOLOGY LTD

USA . 24,144 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Microchip USA

USA . 3,002 parts In-Stock

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3,002

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Parana Technologies

USA . 2,238 parts In-Stock

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$58.346

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2,238

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$58.346

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Corphita

USA . 1,354 parts In-Stock

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1,354

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Overview

Unlock the full potential of your projects with the SPC563M64L7COAY microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. This robust 32-bit MCU offers exceptional performance and reliability, making it ideal for automotive applications and beyond. With advanced features like multiple ADC and DMA channels, it ensures seamless operation in demanding environments. Elevate your designs while benefiting from ST's commitment to quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction provides a durable and lightweight design, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact circuit designs and higher component density, which is ideal for modern electronics.

Maximum Supply Voltage: 5.25 V

This flexibility in supply voltage allows the microcontroller to operate in various environments and applications.

Address Bus Width: 32

A 32-bit address bus width enables a larger addressable memory space, enhancing the capability for complex applications.

Package Shape: SQUARE

The square shape facilitates easy integration into PCB designs without special orientation requirements.

Bit Size: 32

A 32-bit microcontroller supports advanced computing and greater processing power for intricate tasks.

Power Supplies (V): 1.2, 3.3, 5

Multiple power supply options provide flexibility for various application needs and help in power management.

No. of Terminals: 176

With 176 terminals, this microcontroller offers extensive connectivity options for peripherals and components.

Package Style (Meter): FLATPACK

Flatpack style supports efficient heat dissipation and space-saving designs on circuit boards.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V allows the device to operate efficiently in a range of low voltage scenarios.

Maximum Operating Temperature: 125 °C

Operating at high temperatures makes this microcontroller suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The ability to function in extreme cold enables reliable performance in harsh environments.

Terminal Finish: TIN

Tin terminal finishing enhances solderability, ensuring reliable connections during assembly.

ADC Channels: YES

Inclusion of ADC channels allows for direct interfacing with analog signals, improving versatility.

DMA Channels: YES

DMA channels enable efficient data handling without CPU intervention, improving performance in data-intensive applications.

Terminal Position: QUAD

Quad terminal positioning makes routing on a PCB easier, facilitating better design practices.

ROM Words: 1572864

A large ROM capacity allows for substantial program storage, beneficial for complex applications.

Maximum Seated Height: 1.6 mm

Low seated height enables compact design, making it suitable for small form-factor devices.

Width: 24 mm

A width of 24 mm allows compatibility with standard PCB layouts and design tools.

External Data Bus Width: 64

A 64-bit external data bus width facilitates high data throughput, improving performance in data processing tasks.

Maximum Clock Frequency: 80 MHz

A high clock frequency supports faster operations and can handle demanding applications efficiently.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures reliability during the assembly process, minimizing the risk of thermal damage.

Peak Reflow Temperature: 260 °C

Good thermal tolerance during assembly contributes to durability and reliability of the microcontroller.

Length: 24 mm

Consistent lengths allow for standardization in designs, making it easier to integrate into existing systems.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade guarantees reliable performance in varying automotive environments.

Peripheral IC Type: MICROCONTROLLER

As a specialized microcontroller, it optimizes control and processing tasks, suitable for embedded applications.

RAM Bytes: 96256

Significant RAM size supports multitasking and complex algorithms, enhancing operational capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high integration, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals ease PCB assembly and improve mechanical stability of the components.

Maximum Supply Current: 195 mA

A reasonably high supply current facilitates robust performance across demanding applications.

Nominal Supply Voltage: 5 V

A standard nominal voltage simplifies power supply design, making integration easier.

PWM Channels: YES

PWM channels enable efficient control of motors and actuators, enhancing functionality in control applications.

ROM Programmability: FLASH

Flash programmability simplifies firmware updates, making maintenance easier and enhancing product longevity.

Terminal Pitch: 0.5 mm

Small terminal pitch leads to more compact design and increased component density on PCB.

Moisture Sensitivity Level (MSL): 3

MSL level 3 ensures adequate protection during handling and assembly, decreasing the risk of damage due to moisture absorption.

Speed: 80 rpm

An operational speed of 80 rpm signifies adequate performance for control and automation processes.

No. of I/O Lines: 80

80 I/O lines provide extensive options for interfacing with sensors, displays, and other peripherals.

Technical Specifications

Microcontrollers SPC563M64L7COAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e3

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

80

No. of Terminals:

176

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3,5

Qualification:

Not Qualified

RAM Bytes:

96256

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

195 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

SPC563M64L7COAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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