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SPC560P60L3CEFAY

STMicroelectronics

SPC560P60L3CEFAY by STMicroelectronics

STMicroelectronics SPC560P60L3CEFAY microcontroller features 32-bit address and external data bus width, with 40 MHz clock frequency. Ideal for applications requiring ADC and DMA channels, it has 65 I/O lines and operates at a speed of 64 rpm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,549 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,549

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Anansix

USA . 731 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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731

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Digiode

USA . 80 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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80

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 7,850 parts In-Stock

1+ parts

$6.620

100+ parts

-

1k+ parts

-

10k+ parts

-

7,850

$6.620

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-

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AZTECH Wire

Italy . 1,065 parts In-Stock

1+ parts

$17.420

100+ parts

-

1k+ parts

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10k+ parts

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1,065

$17.420

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-

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Microchip USA

USA . 2,638 parts In-Stock

1+ parts

$22.634

100+ parts

-

1k+ parts

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2,638

$22.634

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-

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IDEA Electronic Components Group

UK . 26 parts In-Stock

1+ parts

$56.323

100+ parts

-

1k+ parts

$50.691

10k+ parts

-

26

$56.323

-

$50.691

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MKK Technologies

India . 1,774 parts In-Stock

1+ parts

$105.912

100+ parts

-

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10k+ parts

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1,774

$105.912

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DigiPath Technology Company

USA . 1,774 parts In-Stock

1+ parts

$105.912

100+ parts

-

1k+ parts

-

10k+ parts

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1,774

$105.912

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-

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Parana Technologies

USA . 2,256 parts In-Stock

1+ parts

-

100+ parts

$67.343

1k+ parts

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2,256

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$67.343

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Corphita

USA . 1,394 parts In-Stock

1+ parts

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1,394

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Overview

Unleash the power of innovation with the SPC560P60L3CEFAY microcontroller by STMicroelectronics. As a leader in the industry, STMicroelectronics ensures top-notch quality and reliability in all their products. The SPC560P60L3CEFAY is perfect for a variety of applications thanks to its advanced features and high performance. Experience seamless operation and unparalleled efficiency with this microcontroller, offering customers unmatched value and benefits. Upgrade your projects with the SPC560P60L3CEFAY and take your designs to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering, making the product suitable for automated assembly processes.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this microcontroller can handle higher voltages, providing flexibility in power supply options.

Address Bus Width: 32

A 32-bit address bus allows for large memory addressing, enabling the microcontroller to access a larger memory space for complex applications.

Package Shape: SQUARE

The square package shape allows for easier placement on a PCB, maximizing space efficiency in design layouts.

Bit Size: 32

With a 32-bit architecture, this microcontroller can process larger chunks of data at once, leading to faster and more efficient operations.

No. of Terminals: 100

Having 100 terminals provides plenty of connectivity options for interfacing with external components and peripherals, making it versatile for various applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style offers compact size, low profile height, and fine pitch for high-density mounting, ideal for space-constrained designs.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5V ensures reliable operation even with lower voltage inputs, enhancing the product's compatibility with different power sources.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows the microcontroller to interface with analog sensors and signals, expanding its capabilities for diverse applications.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency by enabling peripherals to access memory independently, reducing processor overhead and enhancing system performance.

Terminal Position: QUAD

Quad terminal position facilitates easier soldering and connection to the PCB, enhancing reliability and efficiency in assembly processes.

Width: 14 mm

With a width of 14mm, this microcontroller is compact and space-efficient, suitable for designs requiring a small footprint.

External Data Bus Width: 32

A 32-bit external data bus width allows for high-speed data transfer between the microcontroller and external devices, improving overall system performance.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40MHz enables fast processing speeds, making the microcontroller suitable for applications that require high computational performance.

Length: 14 mm

With a length of 14mm, this microcontroller offers a compact form factor, enabling integration into space-constrained designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripherals integrated, it offers efficient and optimized performance for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable for long-term operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates surface mounting and soldering, ensuring secure connections and reliable operation in a variety of environments.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V provides stable and consistent power to the microcontroller, ensuring reliable performance under varying operating conditions.

PWM Channels: YES

PWM (Pulse Width Modulation) channels allow for precise control of connected devices, making the microcontroller suitable for applications requiring accurate output control.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this microcontroller offers high-density mounting capabilities, allowing for compact and space-efficient PCB designs.

Speed: 64 rpm

Operating at a speed of 64 rpm, this microcontroller can efficiently perform tasks requiring precise timing and control, making it suitable for motor control applications.

No. of I/O Lines: 65

With 65 input/output lines, the microcontroller can interface with a wide range of external devices and peripherals, enhancing its versatility for different applications.

Technical Specifications

Microcontrollers SPC560P60L3CEFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC560P60L3CEFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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