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SPC560P54L5BEABR

STMicroelectronics

SPC560P54L5BEABR by STMicroelectronics

STMicroelectronics SPC560P54L5BEABR is a 32-bit microcontroller with 3.6V max supply voltage, 40MHz clock frequency, and 106 I/O lines. Ideal for applications requiring ADC and DMA channels, it features a low-profile flatpack package with gull wing terminals at 0.5mm pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,680 parts In-Stock

1+ parts

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3,680

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Anansix

USA . 2,873 parts In-Stock

1+ parts

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2,873

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Digiode

USA . 2,741 parts In-Stock

1+ parts

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2,741

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 306 parts In-Stock

1+ parts

$9.350

100+ parts

-

1k+ parts

-

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306

$9.350

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Microchip USA

USA . 2,798 parts In-Stock

1+ parts

$12.289

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-

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2,798

$12.289

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IDEA Electronic Components Group

UK . 1,952 parts In-Stock

1+ parts

$48.712

100+ parts

-

1k+ parts

$43.841

10k+ parts

-

1,952

$48.712

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$43.841

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MKK Technologies

India . 2,240 parts In-Stock

1+ parts

$91.600

100+ parts

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2,240

$91.600

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DigiPath Technology Company

USA . 2,240 parts In-Stock

1+ parts

$91.600

100+ parts

-

1k+ parts

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2,240

$91.600

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 6,234 parts In-Stock

1+ parts

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6,234

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Corphita

USA . 3,505 parts In-Stock

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3,505

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Parana Technologies

USA . 1,886 parts In-Stock

1+ parts

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100+ parts

$58.243

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1,886

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$58.243

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Vigor

Singapore . 1,590 parts In-Stock

1+ parts

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1,590

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Overview

Unleash the power of innovation with the SPC560P54L5BEABR microcontroller by STMicroelectronics. This cutting-edge device boasts top-notch quality and reliability, thanks to its renowned manufacturer. With a wide range of applications in mind, this microcontroller offers unmatched value and benefits to customers looking for seamless integration and high performance. Say goodbye to limitations and hello to endless possibilities with the SPC560P54L5BEABR.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, making this microcontroller a convenient choice for assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power options and compatibility with various components in a circuit.

Address Bus Width: 32

A 32-bit address bus width allows for a larger memory address space, enabling the microcontroller to handle complex tasks and store more data.

Package Shape: SQUARE

The square package shape is space-efficient and easy to integrate into compact designs.

Bit Size: 32

A 32-bit microcontroller offers high processing power and efficiency, making it suitable for advanced applications.

No. of Terminals: 144

With 144 terminals, this microcontroller allows for versatile connectivity with other components and peripherals in a circuit.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package styles make the microcontroller suitable for applications where space is limited and precise connections are required.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage helps in reducing power consumption and supports energy-efficient designs.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals to digital data, increasing its versatility in sensor interfacing and signal processing.

DMA Channels: YES

DMA channels allow for direct memory access, improving data transfer rates and freeing up the CPU for other tasks, enhancing the microcontroller's overall performance.

Terminal Position: QUAD

The quad terminal position layout provides a balanced distribution of connections, aiding in efficient routing and signal integrity.

Width: 20 mm

The compact 20mm width makes this microcontroller suitable for applications where space is limited.

External Data Bus Width: 32

A 32-bit external data bus width allows for high-speed data transfer between the microcontroller and external memory or peripherals.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency of 40 MHz provides fast processing speeds, making the microcontroller suitable for applications requiring real-time data processing.

Length: 20 mm

The 20mm length contributes to the overall compactness of the microcontroller, making it suitable for small form factor designs.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller using Reduced Instruction Set Computing (RISC) architecture offers high performance and efficiency in executing instructions, making it a reliable choice for embedded systems.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and reliable operation characteristics, making this microcontroller suitable for battery-powered applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable solder connections during circuit board assembly, ensuring stable operation of the microcontroller.

Nominal Supply Voltage: 3 V

The nominal supply voltage specification ensures compatibility with standard voltage levels in electronic systems, simplifying power supply design.

PWM Channels: YES

The availability of Pulse Width Modulation (PWM) channels enables precise control of analog signals, making this microcontroller suitable for applications such as motor control and lighting.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm ensures close proximity and efficient routing of connections, enabling compact and reliable circuit board designs.

Speed: 64 rpm

With a speed of 64 revolutions per minute (rpm), this microcontroller can efficiently process instructions and data at a high rate, suitable for time-sensitive applications.

No. of I/O Lines: 106

The 106 I/O lines provide ample connectivity options for interfacing with external devices, sensors, and peripherals, enhancing the flexibility and functionality of the microcontroller.

Technical Specifications

Microcontrollers SPC560P54L5BEABR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

20 mm

No. of I/O Lines:

106

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC560P54L5BEABR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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