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SPC560P50L5CEFBR

STMicroelectronics

SPC560P50L5CEFBR by STMicroelectronics

SPC560P50L5CEFBR from STMicroelectronics is a 32-bit automotive microcontroller featuring a 40 MHz max clock frequency, 144 terminals, and -40 °C to 125 °C operating temp range. It supports CAN/LIN connectivity and includes multiple ADC and PWM channels for versatile applications. Ideal for automotive control systems, it ensures reliability with its robust design.

Median Price

$6.946

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 85 parts In-Stock

1+ parts

$6.946

100+ parts

$3.264

1k+ parts

-

10k+ parts

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85

$6.946

$3.264

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-

Vyrian

USA . 8,032 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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8,032

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-

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Digiode

USA . 2,976 parts In-Stock

1+ parts

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2,976

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Anansix

USA . 2,192 parts In-Stock

1+ parts

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2,192

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Dan-Mar Components

USA . 85 parts In-Stock

1+ parts

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85

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,049 parts In-Stock

1+ parts

$54.514

100+ parts

-

1k+ parts

$49.062

10k+ parts

-

2,049

$54.514

-

$49.062

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MKK Technologies

India . 1,669 parts In-Stock

1+ parts

$102.509

100+ parts

-

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10k+ parts

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1,669

$102.509

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DigiPath Technology Company

USA . 1,669 parts In-Stock

1+ parts

$102.509

100+ parts

-

1k+ parts

-

10k+ parts

-

1,669

$102.509

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Microchip USA

USA . 3,537 parts In-Stock

1+ parts

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3,537

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Corphita

USA . 1,998 parts In-Stock

1+ parts

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1,998

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Parana Technologies

USA . 1,509 parts In-Stock

1+ parts

-

100+ parts

$65.179

1k+ parts

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1,509

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$65.179

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Perfect Parts

USA . 557 parts In-Stock

1+ parts

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557

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Overview

Unlock your innovation potential with the SPC560P50L5CEFBR from STMicroelectronics—your trusted partner in cutting-edge microcontroller solutions. Designed for automotive applications, this robust 32-bit powerhouse excels in performance and reliability, operating seamlessly in extreme temperatures from -40 °C to 125 °C. With rich features like multiple communication interfaces and advanced peripherals, it empowers developers to create efficient, high-quality systems that enhance safety and efficiency, making your projects not just feasible, but exceptional.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and is ideal for modern PCB layouts, enhancing manufacturability.

Address Bus Width: 32

A 32-bit address bus facilitates access to a larger memory space, allowing for more complex applications.

Package Shape: SQUARE

The square package shape maximizes space efficiency on PCB, promoting better layout options.

Bit Size: 32

A 32-bit architecture supports advanced processing capabilities, suitable for high-performance applications.

No. of Terminals: 144

With 144 terminals, it provides ample connectivity options for interfacing with various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low-profile and fine pitch design reduces the overall height of components, allowing for innovative and space-constrained designs.

Maximum Operating Temperature: 125 °C

Operating at high temperatures ensures reliability in automotive and industrial applications.

CPU Family: SPC56

Part of the SPC56 family, known for its robust performance in automotive control applications.

No. of External Interrupts: 32

A high number of external interrupts allows for responsive and real-time processing, critical for responsive automation systems.

Minimum Operating Temperature: -40 °C

Wide temperature range makes it suitable for extreme environments, especially in automotive applications.

ADC Channels: YES

Integrated ADC channels allow for efficient data acquisition from sensors, making it ideal for control systems.

DMA Channels: YES

The inclusion of DMA channels enhances data transfer efficiency, freeing CPU resources for other processing tasks.

Terminal Position: QUAD

Quad terminal position offers enhanced connectivity options and simplifies routing on the PCB.

ROM Words: 524288

A large ROM allows for extensive firmware storage, enabling complex software applications.

Width: 20 mm

Compact width supports space-efficient designs, facilitating integration into smaller devices.

Data EEPROM Size: 64K

64K of EEPROM allows for reliable data storage, useful for configuration settings in embedded systems.

Boundary Scan: YES

Boundary scan feature aids in testing and debugging, ensuring product reliability and ease of maintenance.

External Data Bus Width: 32

The 32-bit data bus allows for powerful data processing, accommodating demanding applications.

Peripherals: DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

A rich set of integrated peripherals enhances functionality, promoting versatility in applications.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz supports fast processing speeds, crucial for real-time applications.

Length: 20 mm

Short length allows for more design flexibility and compact device integration.

Temperature Grade: AUTOMOTIVE

Specifically graded for automotive use, ensuring reliability and performance under varying environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction execution, optimizing performance for embedded applications.

RAM Bytes: 40960

A significant amount of RAM supports complex data handling, beneficial for multitasking applications.

Technology: CMOS

CMOS technology offers low power consumption combined with high performance, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, enhancing manufacturability.

Analog To Digital Converters: 13-Ch 10-Bit (2)

Two sets of 10-bit ADC channels provide versatile analog input options, essential for interfacing with sensors.

Nominal Supply Voltage: 5 V

Operating at a common 5V supply makes it compatible with many systems and reduces design complexity.

No. of DMA Channels: 16

With 16 DMA channels, it enhances data handling capabilities, promoting efficient operation in modern applications.

PWM Channels: YES

The presence of PWM channels allows for precise control of motors and other devices, proving advantageous in control applications.

Connectivity: CAN, LIN(2), SPI(4)

Multi-protocol connectivity ensures compatibility with various networks, enhancing versatility in communication.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, supporting long-term product evolution.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports high-density designs, allowing for more connections in a smaller space.

Format: FIXED POINT

Fixed-point format enhances performance for numerical applications, simplifying mathematical operations in embedded systems.

Speed: 60 rpm

Capable of maintaining a speed of 60 rpm, making it suitable for applications involving motion control.

On Chip Program ROM Width: 8

An 8-bit wide program ROM allows for efficient instruction processing and better memory organization.

No. of I/O Lines: 108

108 I/O lines provide extensive interfacing options, making the microcontroller highly adaptable to various applications.

Technical Specifications

Microcontrollers SPC560P50L5CEFBR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

NO

No. of DMA Channels:

16

No. of External Interrupts:

32

No. of I/O Lines:

108

No. of Serial I/Os:

0

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144(UNSPEC)

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

40960

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

60 rpm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN, LIN(2), SPI(4)

Peripherals:

DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

Analog To Digital Convertors:

13-Ch 10-Bit (2)

Trade Compliance

SPC560P50L5CEFBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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