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SPC560P50L5BEFBR

STMicroelectronics

SPC560P50L5BEFBR by STMicroelectronics

SPC560P50L5BEFBR by STMicroelectronics is a 32-bit microcontroller with 3.3V power supply, 144 terminals, and 524288 ROM words. It features ADC and DMA channels, operates in industrial temperature range (-40 to 105 °C), and has a max clock frequency of 16 MHz. Ideal for applications requiring high-speed processing and extensive I/O capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,169 parts In-Stock

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5,169

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Digiode

USA . 2,494 parts In-Stock

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2,494

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Anansix

USA . 2,415 parts In-Stock

1+ parts

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2,415

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,482 parts In-Stock

1+ parts

$11.685

100+ parts

-

1k+ parts

-

10k+ parts

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2,482

$11.685

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AZTECH Wire

Italy . 1,011 parts In-Stock

1+ parts

$12.770

100+ parts

-

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10k+ parts

-

1,011

$12.770

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-

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IDEA Electronic Components Group

UK . 632 parts In-Stock

1+ parts

$18.106

100+ parts

-

1k+ parts

$16.295

10k+ parts

-

632

$18.106

-

$16.295

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MKK Technologies

India . 565 parts In-Stock

1+ parts

$34.046

100+ parts

-

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565

$34.046

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DigiPath Technology Company

USA . 565 parts In-Stock

1+ parts

$34.046

100+ parts

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10k+ parts

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565

$34.046

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Corphita

USA . 4,389 parts In-Stock

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4,389

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Vigor

Singapore . 1,127 parts In-Stock

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1,127

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Parana Technologies

USA . 553 parts In-Stock

1+ parts

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$21.648

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553

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$21.648

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Overview

Experience the power of the SPC560P50L5BEFBR microcontroller by STMicroelectronics, a leading manufacturer known for quality and innovation. Ideal for a wide range of applications, this versatile device offers unmatched value and benefits to customers. With advanced features and reliable performance, this product is designed to meet your needs with precision and efficiency. Upgrade your projects with the exceptional capabilities of the SPC560P50L5BEFBR and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 3.465 V

Provides a wide operating range for flexibility in various applications.

Address Bus Width: 32

Enables the microcontroller to access a large memory space for data processing and storage.

Package Shape: SQUARE

The square shape allows for a compact design, optimizing space on the circuit board.

Bit Size: 32

A 32-bit architecture provides high computational power and performance for complex tasks.

Power Supplies (V): 3.3

Operates on a standard voltage, making it compatible with common power sources.

No. of Terminals: 144

Plenty of terminals provide ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK

Flatpack style makes it easy to mount and secure on a circuit board.

Minimum Supply Voltage: 2.97 V

A low minimum supply voltage ensures efficient power consumption and extended battery life.

Maximum Operating Temperature: 105 °C

Withstands high temperatures, suitable for industrial and extreme environments.

Minimum Operating Temperature: -40 °C

Capable of operating in cold conditions without performance degradation.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and ensures reliable electrical connections.

ADC Channels: YES

Integrated ADC allows for analog signal conversion, enabling sensor interfacing and data acquisition.

DMA Channels: YES

DMA channels improve data transfer efficiency and offload the CPU for more processing tasks.

Terminal Position: QUAD

Quad terminal position simplifies soldering and PCB assembly.

ROM Words: 524288

Large ROM size accommodates program storage, firmware updates, and data logging.

Width: 22 mm

Compact width allows for space-efficient board layout and integration in tight spaces.

External Data Bus Width: 32

Wide external data bus enables high-speed data transfer and processing capabilities.

Maximum Clock Frequency: 16 MHz

Operates at a high clock frequency for quick execution of instructions and tasks.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperatures for a specified duration, essential for manufacturing processes.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during soldering without damage.

Length: 22 mm

Compact length for space-saving integration in compact electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, capable of operating reliably in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient and fast processing, ideal for real-time applications.

RAM Bytes: 40960

A large RAM size facilitates data storage and manipulation, improving overall system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing energy efficiency.

Terminal Form: GULL WING

Gull-wing terminals are suitable for surface mounting, ensuring secure connections.

Maximum Supply Current: 89 mA

Low supply current consumption for efficient power management and prolonged battery life.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance under varying load conditions.

PWM Channels: YES

Integrated PWM channels enable precise control of analog signals and motor speed regulation.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware, improving flexibility and scalability.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density packaging, suitable for compact circuit board design.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring proper handling during storage and assembly.

Speed: 64 rpm

Operating speed of 64 rpm ensures quick data processing and response times in applications.

No. of I/O Lines: 108

Plenty of I/O lines for connecting peripherals, sensors, and external devices, enhancing system versatility.

Technical Specifications

Microcontrollers SPC560P50L5BEFBR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

22 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

108

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

40960

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

89 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

22 mm

Peripheral IC Type:

Trade Compliance

SPC560P50L5BEFBR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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