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SPC560P50L5BEABY

STMicroelectronics

SPC560P50L5BEABY by STMicroelectronics

SPC560P50L5BEABY by STMicroelectronics is a 32-bit microcontroller designed for industrial applications, featuring a max supply voltage of 3.465V and operating temp range from -40 °C to 105 °C. It supports ADC and PWM channels, making it ideal for automation systems. With a compact flatpack design and 144 terminals, it ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,747 parts In-Stock

1+ parts

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5,747

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Anansix

USA . 1,046 parts In-Stock

1+ parts

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-

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1,046

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Digiode

USA . 785 parts In-Stock

1+ parts

-

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-

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785

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,760 parts In-Stock

1+ parts

$6.490

100+ parts

-

1k+ parts

-

10k+ parts

-

1,760

$6.490

-

-

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AZTECH Wire

Italy . 986 parts In-Stock

1+ parts

$11.860

100+ parts

-

1k+ parts

-

10k+ parts

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986

$11.860

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Microchip USA

USA . 2,978 parts In-Stock

1+ parts

$22.232

100+ parts

-

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2,978

$22.232

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IDEA Electronic Components Group

UK . 1,671 parts In-Stock

1+ parts

$60.082

100+ parts

-

1k+ parts

$54.073

10k+ parts

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1,671

$60.082

-

$54.073

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MKK Technologies

India . 993 parts In-Stock

1+ parts

$112.979

100+ parts

-

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993

$112.979

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DigiPath Technology Company

USA . 993 parts In-Stock

1+ parts

$112.979

100+ parts

-

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993

$112.979

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Corphita

USA . 3,794 parts In-Stock

1+ parts

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3,794

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Parana Technologies

USA . 1,408 parts In-Stock

1+ parts

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100+ parts

$71.837

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1,408

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$71.837

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Overview

Unlock the potential of your projects with the SPC560P50L5BEABY microcontroller from STMicroelectronics! Renowned for its quality and innovation, STMicroelectronics offers a robust solution designed to enhance performance across various applications like automotive systems, industrial automation, and smart devices. With its exceptional temperature range and reliable power efficiency, this microcontroller is your key to creating advanced, energy-efficient products that stand out in today’s competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robustness and protection against environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into various devices, saving board space.

Maximum Supply Voltage: 3.465 V

A high maximum supply voltage allows compatibility with a wider range of power supply configurations.

Address Bus Width: 32

A 32-bit address bus width enables access to large amounts of memory, supporting complex applications and multitasking.

Package Shape: SQUARE

The square package shape facilitates uniform thermal distribution and efficient use of PCB space.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle more data per clock cycle, improving performance for demanding applications.

No. of Terminals: 144

A higher number of terminals allows for extensive connectivity options and interaction with various peripherals.

Package Style (Meter): FLATPACK

Flatpack style enhances the thermal performance and is ideal for tight spaces in electronic designs.

Minimum Supply Voltage: 2.97 V

The low minimum supply voltage contributes to energy efficiency, making it suitable for battery-powered applications.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature rating ensures reliable performance in extreme environments.

Minimum Operating Temperature: -40 °C

This microcontroller is rated for low temperatures, making it a strong candidate for cold climate applications.

ADC Channels: YES

The inclusion of ADC channels allows for the direct reading of analog signals, facilitating applications in sensing and measurement.

DMA Channels: YES

DMA support enables efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning allows for better electrical connectivity and ease of soldering.

Width: 22 mm

A compact width makes it easier to fit into design layouts without taking up excessive board space.

External Data Bus Width: 32

A 32-bit external data bus width enhances communication speed and efficiency with external devices.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz enables fast processing speed, suitable for time-critical applications.

Length: 22 mm

A compact length facilitates space-efficient designs in various electronic products.

Temperature Grade: INDUSTRIAL

Industrial temperature grade assures reliability and performance in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction processing, enhancing performance in embedded applications.

Technology: CMOS

CMOS technology offers low power consumption while maintaining high performance, ideal for portable applications.

Terminal Form: GULL WING

Gull wing terminal form enhances solder joint reliability and simplifies assembly processes.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is common for modern electronics, ensuring compatibility with various devices.

PWM Channels: YES

PWM channel support allows for efficient control over motors and other devices, broadening application possibilities.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and modification of the microcontroller's behavior.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm allows for higher density connections on PCBs, making it suitable for compact designs.

Speed: 64 rpm

A speed of 64 rpm suggests efficient operation for applications such as motor control.

No. of I/O Lines: 108

With 108 I/O lines, this microcontroller can interface with a variety of external components, offering versatility in applications.

Technical Specifications

Microcontrollers SPC560P50L5BEABY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

Length:

22 mm

No. of I/O Lines:

108

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

ROM Programmability:

FLASH

Speed:

64 rpm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

22 mm

Peripheral IC Type:

Trade Compliance

SPC560P50L5BEABY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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