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SPC560P50L3CEFBY

STMicroelectronics

SPC560P50L3CEFBY by STMicroelectronics

SPC560P50L3CEFBY by STMicroelectronics is a 32-bit automotive microcontroller with a max temp of 125 °C and 100 terminals. It features 25 external interrupts, 16 DMA channels, and supports CAN/LIN connectivity. Ideal for automotive applications requiring robust performance and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,792 parts In-Stock

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6,792

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Digiode

USA . 4,807 parts In-Stock

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4,807

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Anansix

USA . 440 parts In-Stock

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440

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 4,753 parts In-Stock

1+ parts

$5.380

100+ parts

-

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-

10k+ parts

-

4,753

$5.380

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-

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Microchip USA

USA . 3,057 parts In-Stock

1+ parts

$18.327

100+ parts

-

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3,057

$18.327

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AZTECH Wire

Italy . 487 parts In-Stock

1+ parts

$18.580

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-

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487

$18.580

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IDEA Electronic Components Group

UK . 187 parts In-Stock

1+ parts

$74.022

100+ parts

-

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$66.620

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-

187

$74.022

-

$66.620

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MKK Technologies

India . 1,717 parts In-Stock

1+ parts

$139.194

100+ parts

-

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1,717

$139.194

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DigiPath Technology Company

USA . 1,717 parts In-Stock

1+ parts

$139.194

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1,717

$139.194

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Kepictronics

USA . 2,700 parts In-Stock

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2,700

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Parana Technologies

USA . 1,177 parts In-Stock

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$88.505

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1,177

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$88.505

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 706 parts In-Stock

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706

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A-Z Elektronik GmbH

Germany . 206 parts In-Stock

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206

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Corphita

USA . 175 parts In-Stock

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175

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Overview

Unlock the future of automotive innovation with the SPC560P50L3CEFBY microcontroller from STMicroelectronics. Renowned for their excellence, STMicroelectronics delivers a powerhouse solution that combines reliability and advanced performance in extreme temperatures. Ideal for automotive applications, this versatile microcontroller enhances system efficiency, ensuring seamless connectivity and superior control. Elevate your projects with unmatched quality and unleash the potential of cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity, making it suitable for various environments.

Surface Mount: YES

Being surface mount allows for compact designs and is ideal for modern PCB layouts, saving space.

Address Bus Width: 32

A 32-bit address bus width supports a large address space, facilitating the handling of complex applications.

Package Shape: SQUARE

The square shape optimizes space on the PCB, allowing for efficient layout and soldering.

Bit Size: 32

A 32-bit architecture enhances processing capabilities, enabling faster and more efficient computations.

No. of Terminals: 100

With 100 terminals, this microcontroller offers extensive connectivity options for peripherals and I/O.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This low-profile flatpack style is excellent for space-constrained applications, facilitating easier integration.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating ensures reliability in demanding environments, especially in automotive applications.

CPU Family: SPC56

The SPC56 family is tailored for automotive applications, providing specialized functionalities required in this domain.

No. of External Interrupts: 25

Having 25 external interrupts allows for responsive handling of real-time events, enhancing the controller's flexibility.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature expands its use to extreme environments, critical for automotive and industrial applications.

ADC Channels: YES

Integrated ADC channels facilitate real-time signal monitoring and processing, crucial for a variety of applications.

DMA Channels: YES

DMA support enhances data transfer efficiency, allowing the processor to focus on core tasks while handling data movements.

Terminal Position: QUAD

The quad terminal position simplifies PCB design and increases manufacturability by allowing better soldering techniques.

ROM Words: 524288

A large ROM capacity supports complex firmware and application code, enabling robust functionality and features.

Width: 14 mm

A compact width ensures compatibility with space-restricted designs, making it easier to integrate into various systems.

Data EEPROM Size: 64K

The 64K data EEPROM allows for significant non-volatile data storage, essential for configurations and state retention.

Boundary Scan: YES

Boundary scan capability enhances debugging and testing, ensuring increased reliability and quicker time to market.

External Data Bus Width: 32

A 32-bit external data bus supports high data throughput, which is essential for performance-intensive applications.

Peripherals: DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

An extensive array of peripherals provides versatility for various applications, reducing the need for additional components.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz ensures high processing speed for demanding applications, enhancing overall performance.

Length: 14 mm

A compact length allows for easy integration in tight spaces, promoting design flexibility.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, this temperature grade ensures reliability under harsh operational conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The choice of RISC architecture optimizes performance and efficiency, making it suitable for resource-constrained environments.

RAM Bytes: 40960

With 40 KB of RAM, it supports complex data processing and execution, enhancing application performance.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, ideal for battery-operated and energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide good mechanical strength, ensuring reliability in connections.

Analog To Digital Converters: 13-Ch 10-Bit (2)

The inclusion of multiple ADC channels enhances flexibility in measurement tasks, suitable for various sensor inputs.

Nominal Supply Voltage: 5 V

A standard 5V supply voltage makes it compatible with a wide range of devices and easy to integrate into existing systems.

No. of DMA Channels: 16

Having 16 DMA channels allows for high-performance data transfer, enhancing overall system efficiency.

PWM Channels: YES

Integrated PWM channels offer advanced control capabilities for motors and other actuators, enhancing application versatility.

Connectivity: CAN, LIN(2), SPI(4)

Diverse connectivity options enable communication with numerous peripherals and integration into various automotive networks.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, enhancing long-term usability and flexibility.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch supports modern component layouts, facilitating high-density PCB designs.

Format: FIXED POINT

The fixed-point format is efficient for mathematical operations commonly used in embedded applications, saving on processing time.

Speed: 60 rpm

A speed of 60 rpm is suitable for various control applications, particularly in automotive systems requiring precise measurements.

On Chip Program ROM Width: 8

An 8-bit program ROM width enables effective coding and execution of programs, optimizing performance for varied applications.

No. of I/O Lines: 67

67 I/O lines provide extensive interfacing options, supporting complex applications and enabling connectivity with numerous devices.

Technical Specifications

Microcontrollers SPC560P50L3CEFBY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

NO

No. of DMA Channels:

16

No. of External Interrupts:

25

No. of I/O Lines:

67

No. of Serial I/Os:

0

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100(UNSPEC)

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

40960

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

60 rpm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN, LIN(2), SPI(4)

Peripherals:

DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

Analog To Digital Convertors:

13-Ch 10-Bit (2)

Trade Compliance

SPC560P50L3CEFBY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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