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SPC560P44L5CEFAR

STMicroelectronics

SPC560P44L5CEFAR by STMicroelectronics

SPC560P44L5CEFAR from STMicroelectronics is a 32-bit automotive microcontroller with a max temp of 125 °C and 144 terminals. It features 16 DMA channels, 13 ADCs, and supports CAN/LIN connectivity. Ideal for automotive applications requiring robust performance and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,771 parts In-Stock

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8,771

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Anansix

USA . 2,527 parts In-Stock

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2,527

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Digiode

USA . 1,049 parts In-Stock

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1,049

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Distributors (Availability)

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Microchip USA

USA . 1,318 parts In-Stock

1+ parts

$7.412

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-

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1,318

$7.412

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AZTECH Wire

Italy . 781 parts In-Stock

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$16.210

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781

$16.210

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IDEA Electronic Components Group

UK . 169 parts In-Stock

1+ parts

$37.246

100+ parts

-

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$33.522

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169

$37.246

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$33.522

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MKK Technologies

India . 1,150 parts In-Stock

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$70.039

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1,150

$70.039

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DigiPath Technology Company

USA . 1,150 parts In-Stock

1+ parts

$70.039

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1,150

$70.039

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Corphita

USA . 3,986 parts In-Stock

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3,986

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Vigor

Singapore . 2,897 parts In-Stock

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2,897

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Parana Technologies

USA . 864 parts In-Stock

1+ parts

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$44.534

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864

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$44.534

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Overview

Unlock the power of innovation with the SPC560P44L5CEFAR microcontroller from STMicroelectronics, a leader in semiconductor solutions. Designed for automotive and industrial applications, this high-quality chip excels in durability and performance, operating seamlessly in extreme temperatures. With its advanced features, including 32 external interrupts and robust connectivity options, it delivers unmatched efficiency and reliability. Elevate your projects with STMicroelectronics' commitment to excellence and experience the future of smart technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and reliability, making the microcontroller suitable for automotive and various industrial applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact designs, maximizing space efficiency in PCBs.

Address Bus Width: 32

A 32-bit address bus width enables access to a large memory range, supporting complex applications and algorithms.

Package Shape: SQUARE

The square package shape offers balanced design for layout and heat dissipation, contributing to stable performance.

Bit Size: 32

The 32-bit architecture facilitates higher processing power and efficiency in handling data-intensive applications.

No. of Terminals: 144

With 144 terminals, this microcontroller provides extensive connectivity options for various peripherals and interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design is suitable for high-density applications, ensuring a compact footprint while maintaining performance.

Maximum Operating Temperature: 125 °C

High maximum operating temperature indicates robustness, making it ideal for harsh environments typically found in automotive settings.

CPU Family: SPC56

Part of the SPC56 family, this microcontroller is designed for high-performance automotive applications, ensuring reliability and efficiency.

No. of External Interrupts: 32

Having 32 external interrupts allows for responsive interactions with various sensors and devices, enhancing system flexibility.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures functionality in extreme conditions, essential for automotive applications.

ADC Channels: YES

Inclusion of ADC channels allows for analog-to-digital conversions, making it versatile for sensing and control applications.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency, reducing CPU load for faster operation.

Terminal Position: QUAD

Quad terminal positioning enhances soldering and connection reliability, leading to more robust PCB designs.

ROM Words: 393216

With 393216 ROM words, it has ample storage for program code and firmware, accommodating complex applications.

Width: 20 mm

A compact width of 20 mm allows for space-saving designs in your applications without sacrificing capabilities.

Data EEPROM Size: 64K

64K data EEPROM size is beneficial for storing configuration settings and user data, enhancing operational flexibility.

Boundary Scan: YES

Boundary scan capability facilitates easier testing and debugging, ensuring the reliability of soldered connections.

External Data Bus Width: 32

A 32-bit external data bus width allows for high-speed data transfer, making it suitable for real-time applications.

Peripherals: DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

A rich set of peripherals supports diverse applications from motor control to real-time monitoring, enhancing overall system utility.

Maximum Clock Frequency: 40 MHz

A 40 MHz clock frequency ensures quick processing capabilities, suitable for high-performance tasks.

Length: 20 mm

The 20 mm length along with its width allows for efficient PCB layout while maintaining performance specifications.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, ensuring reliability and longevity in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it provides efficient instruction processing, leading to better performance for various applications.

RAM Bytes: 32768

With 32768 bytes of RAM, it can handle moderate to complex applications efficiently without memory constraints.

Technology: CMOS

CMOS technology offers lower power consumption, which is crucial for energy-efficient applications.

Terminal Form: GULL WING

Gull wing terminal form enhances the ease of assembly and ensures reliable connections in various setups.

Analog To Digital Convertors: 13-Ch 10-Bit (2)

Having dual 10-bit 13-channel ADCs facilitates multiple analog readings simultaneously, ideal for automotive sensing applications.

Nominal Supply Voltage: 3 V

A lower nominal supply voltage enables use in energy-sensitive applications, increasing energy efficiency.

No. of DMA Channels: 16

With 16 DMA channels, it allows for efficient data management and processing without burdening the CPU.

PWM Channels: YES

Support for PWM channels is essential for accurate control of motors and other actuators.

Connectivity: CAN, LIN(2), SPI(4)

Multiple connectivity options including CAN and LIN make it highly versatile for automotive communication protocols.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating firmware and applications, enhancing adaptability over the product’s life cycle.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for compact layouts while ensuring reliable electrical connections.

Format: FIXED POINT

Fixed point format allows for efficient arithmetic operations, which is advantageous in control systems.

Speed: 60 rpm

A designated operational speed of 60 rpm indicates suitability for applications involving motors and control systems.

On Chip Program ROM Width: 8

An 8-bit ROM width supports compact program code while aiding versatile programming options.

No. of I/O Lines: 108

With 108 I/O lines, this microcontroller can interact with a wide range of external devices and sensors, adding versatility to the application.

Technical Specifications

Microcontrollers SPC560P44L5CEFAR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

NO

No. of DMA Channels:

16

No. of External Interrupts:

32

No. of I/O Lines:

108

No. of Serial I/Os:

0

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144(UNSPEC)

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

60 rpm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN, LIN(2), SPI(4)

Peripherals:

DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

Analog To Digital Convertors:

13-Ch 10-Bit (2)

Trade Compliance

SPC560P44L5CEFAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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