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SPC560D40L1C3E0Y

STMicroelectronics

SPC560D40L1C3E0Y by STMicroelectronics

STMicroelectronics SPC560D40L1C3E0Y is a 32-bit microcontroller with 262144 ROM words and 16384 RAM bytes. Ideal for automotive applications, it offers 45 I/O lines, 16 DMA channels, and operates at temperatures ranging from -40 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,638 parts In-Stock

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3,638

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Vyrian

USA . 2,687 parts In-Stock

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2,687

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Anansix

USA . 2,329 parts In-Stock

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2,329

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Cyclops Electronics Ltd

UK . 184 parts In-Stock

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184

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,041 parts In-Stock

1+ parts

$4.659

100+ parts

-

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1,041

$4.659

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AZTECH Wire

Italy . 256 parts In-Stock

1+ parts

$19.020

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256

$19.020

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Ampacity Inc.

Singapore . 341 parts In-Stock

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$35.000

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341

$35.000

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IDEA Electronic Components Group

UK . 1,992 parts In-Stock

1+ parts

$70.344

100+ parts

-

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$63.310

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1,992

$70.344

-

$63.310

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MKK Technologies

India . 851 parts In-Stock

1+ parts

$132.278

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851

$132.278

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DigiPath Technology Company

USA . 851 parts In-Stock

1+ parts

$132.278

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851

$132.278

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Vigor

Singapore . 3,125 parts In-Stock

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Corphita

USA . 2,651 parts In-Stock

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2,651

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Parana Technologies

USA . 2,257 parts In-Stock

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$84.107

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2,257

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$84.107

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Argo Parts USA

USA . 1,292 parts In-Stock

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Continental Prestige Electronics

USA . 654 parts In-Stock

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654

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Bastille Electronics

Australia . 17 parts In-Stock

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Overview

Experience unmatched performance and reliability with the SPC560D40L1C3E0Y microcontroller from industry leader STMicroelectronics. Designed for automotive applications, this cutting-edge device offers a seamless integration of advanced features such as ADC channels, DMA channels, PWM channels, and more. With its low power mode and high clock frequency, this microcontroller provides exceptional value and efficiency to customers looking for a reliable solution for their automotive projects. Trust in STMicroelectronics to deliver top-quality products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good physical protection and insulation for the microcontroller, making it durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and enabling automated assembly.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6V ensures compatibility with typical power sources and provides a safe operating range.

Package Shape: SQUARE

Square package shape facilitates easy placement on the PCB and efficient use of space in electronic designs.

Bit Size: 32

32-bit architecture enables higher processing power and performance compared to lower bit sizes, suitable for a wide range of applications.

No. of Terminals: 64

Having 64 terminals provides flexibility in connecting peripherals and external components, allowing for versatile system configurations.

Minimum Supply Voltage: 3 V

With a minimum supply voltage of 3V, the microcontroller can operate efficiently and reliably within a specified voltage range.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125°C makes the microcontroller suitable for various industrial and automotive applications that may experience high temperatures.

CPU Family: SPC56

Belonging to the SPC56 CPU family ensures compatibility with existing software and tools, simplifying the development process.

ADC Channels: YES

Having ADC channels allows the microcontroller to convert analog signals to digital data, essential for interfacing with sensors and other analog devices.

DMA Channels: YES

DMA channels enable direct memory access for efficient data transfer, reducing the workload on the CPU and improving overall system performance.

ROM Words: 262144

With 262144 ROM words, the microcontroller can store a large amount of program code, data, and configurations, making it versatile for various applications.

Maximum Seated Height: 1.6 mm

Low profile design with a maximum seated height of 1.6mm saves space and enables slim electronic devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various built-in peripherals ensures efficient and high-speed operation suitable for real-time processing.

RAM Bytes: 16384

With 16384 bytes of RAM, the microcontroller can efficiently store and access data during program execution, improving overall system performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with modern semiconductor processes, ensuring efficient operation.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the microcontroller and the surrounding circuitry, improving reliability and reducing development time.

Maximum Clock Frequency: 16 MHz

Operating at a maximum clock frequency of 16MHz provides high-speed processing capability suitable for various real-time applications.

Temperature Grade: AUTOMOTIVE

Designed and certified for automotive-grade temperature range ensures reliable operation in challenging environments common in automotive applications.

No. of I/O Lines: 45

Having 45 I/O lines allows for versatile connectivity with external devices, sensors, and peripherals, enabling complex input/output configurations.

Technical Specifications

Microcontrollers SPC560D40L1C3E0Y attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 5 V

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

SPC56

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

45

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

SPC560D40L1C3E0Y Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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