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SPC560D30L1B4E0X

STMicroelectronics

SPC560D30L1B4E0X by STMicroelectronics

STMicroelectronics SPC560D30L1B4E0X is a 32-bit microcontroller with 131072 ROM words, 12288 RAM bytes, and 16 MHz clock frequency. Ideal for industrial applications requiring low power mode, it features ADC and DMA channels, along with PWM support for precise control.

Median Price

$4.611

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 990 parts In-Stock

1+ parts

$6.200

100+ parts

$3.830

1k+ parts

$2.920

10k+ parts

-

990

$6.200

$3.830

$2.920

-

EBV Elektronik

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.022

10k+ parts

$2.962

1,000

-

-

$3.022

$2.962

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,745 parts In-Stock

1+ parts

$5.415

100+ parts

-

1k+ parts

-

10k+ parts

-

3,745

$5.415

-

-

-

Vyrian

USA . 4,262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,262

-

-

-

-

Anansix

USA . 1,140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,140

-

-

-

-

ComSIT Distribution GmbH

Germany . 65 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

65

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,617 parts In-Stock

1+ parts

$5.130

100+ parts

-

1k+ parts

-

10k+ parts

-

4,617

$5.130

-

-

-

Component Stockers USA

USA . 1,190 parts In-Stock

1+ parts

$6.110

100+ parts

$4.580

1k+ parts

$3.440

10k+ parts

-

1,190

$6.110

$4.580

$3.440

-

Vigor

Singapore . 97 parts In-Stock

1+ parts

$6.230

100+ parts

-

1k+ parts

-

10k+ parts

-

97

$6.230

-

-

-

Microchip USA

USA . 3,173 parts In-Stock

1+ parts

$25.526

100+ parts

-

1k+ parts

-

10k+ parts

-

3,173

$25.526

-

-

-

IDEA Electronic Components Group

UK . 2,277 parts In-Stock

1+ parts

$53.188

100+ parts

-

1k+ parts

$47.869

10k+ parts

-

2,277

$53.188

-

$47.869

-

MKK Technologies

India . 2,161 parts In-Stock

1+ parts

$100.016

100+ parts

-

1k+ parts

-

10k+ parts

-

2,161

$100.016

-

-

-

DigiPath Technology Company

USA . 2,161 parts In-Stock

1+ parts

$100.016

100+ parts

-

1k+ parts

-

10k+ parts

-

2,161

$100.016

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

RC Electronics

USA . 7,107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,107

-

-

-

-

Kepictronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,000

-

-

-

-

Futuretech Components

Singapore . 1,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,980

-

-

-

-

Parana Technologies

USA . 1,624 parts In-Stock

1+ parts

-

100+ parts

$63.594

1k+ parts

-

10k+ parts

-

1,624

-

$63.594

-

-

A-Z Elektronik GmbH

Germany . 183 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

183

-

-

-

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Overview

Experience the cutting-edge technology of the SPC560D30L1B4E0X microcontroller by STMicroelectronics, a trusted manufacturer known for quality and innovation. Ideal for a wide range of applications, this powerful 32-bit microcontroller offers customers unparalleled value with its high performance, low power consumption, and robust features like ADC and DMA channels. With a compact design and industrial-grade temperature range, the SPC560D30L1B4E0X is the perfect choice for your next project, delivering reliability and efficiency in one package. Elevate your designs with the superior capabilities of this microcontroller and unlock endless possibilities for your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller resistant to physical damage and suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs and is versatile for different power supply configurations.

Package Shape: SQUARE

The square shape of the package provides a compact form factor, making it easy to integrate into various electronic devices.

Bit Size: 32

A 32-bit architecture offers higher performance and efficiency compared to lower bit sizes, making this microcontroller suitable for demanding applications.

No. of Terminals: 64

Having 64 terminals allows for the microcontroller to interface with a larger number of external components, increasing its versatility and functionality.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures enables this microcontroller to function reliably in harsh environments with extreme cold conditions.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to accurately convert analog signals to digital data, making it suitable for applications involving sensor interfacing.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce CPU load, enhancing the performance of the microcontroller in data-intensive applications.

ROM Words: 131072

With a large ROM size, this microcontroller can store a significant amount of program data, enabling complex applications to be implemented without external storage.

RAM Bytes: 12288

A generous amount of RAM ensures that the microcontroller can efficiently handle and process data during operation, supporting multitasking and memory-intensive tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture in the peripheral IC type results in faster and more efficient instruction execution, improving overall system performance.

Technical Specifications

Microcontrollers SPC560D30L1B4E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 5 V

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

SPC56

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

45

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

12288

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

SPC560D30L1B4E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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