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SPC560B60L7B6E0X

STMicroelectronics

SPC560B60L7B6E0X by STMicroelectronics

SPC560B60L7B6E0X by STMicroelectronics is a 32-bit microcontroller with 176 terminals, 64K data EEPROM, and 1048576 ROM words. It operates at up to 16 MHz, has ADC and DMA channels, and offers various peripherals like PWM(64) and RTC. Ideal for industrial applications requiring high-speed processing and extensive I/O connectivity with CAN, I2C, LIN, SCI, IRDA, and SPI interfaces.

Median Price

$11.699

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$11.699

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$11.699

-

-

-

Cyclops Electronics Ltd

UK . 13,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,500

-

-

-

-

Vyrian

USA . 8,429 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,429

-

-

-

-

Digiode

USA . 2,555 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,555

-

-

-

-

Anansix

USA . 1,197 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,197

-

-

-

-

ComSIT Distribution GmbH

Germany . 375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

375

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 9,655 parts In-Stock

1+ parts

$8.300

100+ parts

-

1k+ parts

-

10k+ parts

-

9,655

$8.300

-

-

-

Ampacity Inc.

Singapore . 345 parts In-Stock

1+ parts

$9.000

100+ parts

-

1k+ parts

-

10k+ parts

-

345

$9.000

-

-

-

Continental Prestige Electronics

USA . 6,347 parts In-Stock

1+ parts

$11.699

100+ parts

-

1k+ parts

-

10k+ parts

$11.465

6,347

$11.699

-

-

$11.465

AZTECH Wire

Italy . 551 parts In-Stock

1+ parts

$13.091

100+ parts

-

1k+ parts

-

10k+ parts

-

551

$13.091

-

-

-

Semicontronic

India . 1,080 parts In-Stock

1+ parts

$30.000

100+ parts

$29.250

1k+ parts

$29.100

10k+ parts

-

1,080

$30.000

$29.250

$29.100

-

Microchip USA

USA . 1,744 parts In-Stock

1+ parts

$37.961

100+ parts

-

1k+ parts

-

10k+ parts

-

1,744

$37.961

-

-

-

Aztec Data Supply Inc.

USA . 262 parts In-Stock

1+ parts

$50.310

100+ parts

-

1k+ parts

-

10k+ parts

-

262

$50.310

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$53.449

100+ parts

$48.639

1k+ parts

$43.828

10k+ parts

-

1,000

$53.449

$48.639

$43.828

-

Corohmni

South Africa . 931 parts In-Stock

1+ parts

$54.561

100+ parts

-

1k+ parts

-

10k+ parts

-

931

$54.561

-

-

-

IDEA Electronic Components Group

UK . 2,076 parts In-Stock

1+ parts

$67.676

100+ parts

-

1k+ parts

$60.909

10k+ parts

-

2,076

$67.676

-

$60.909

-

MKK Technologies

India . 1,320 parts In-Stock

1+ parts

$127.261

100+ parts

-

1k+ parts

-

10k+ parts

-

1,320

$127.261

-

-

-

DigiPath Technology Company

USA . 1,320 parts In-Stock

1+ parts

$127.261

100+ parts

-

1k+ parts

-

10k+ parts

-

1,320

$127.261

-

-

-

Component Connect

USA . 31,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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31,525

-

-

-

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Lixinc

USA . 8,610 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,610

-

-

-

-

Argo Parts USA

USA . 3,622 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,622

-

-

-

-

RC Electronics

USA . 1,861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,861

-

-

-

-

Corphita

USA . 1,463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,463

-

-

-

-

Parana Technologies

USA . 785 parts In-Stock

1+ parts

-

100+ parts

$80.917

1k+ parts

-

10k+ parts

-

785

-

$80.917

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$11.465

1k+ parts

$11.114

10k+ parts

$10.880

100

-

$11.465

$11.114

$10.880

Overview

Discover the superior quality and cutting-edge technology of the SPC560B60L7B6E0X microcontroller by STMicroelectronics. With a wide range of applications in various industries, this innovative product offers unmatched value and benefits to customers. From its advanced peripherals to its efficient data EEPROM size, this microcontroller provides exceptional performance and reliability. Trust in STMicroelectronics, a renowned manufacturer known for delivering top-notch products, and elevate your projects with the SPC560B60L7B6E0X.

Feature Benefit Bullets

Body Material:

PLASTIC/EPOXY – This material offers durability and heat resistance, making the product reliable for long-term use.

Surface Mount:

YES – Allows for easy and secure mounting on PCBs, simplifying the assembly process.

Supply Voltage:

3.6 V – Provides a wide voltage range for flexibility in various applications.

Package Shape:

SQUARE – Helps optimize space utilization on the PCB, suitable for compact designs.

Bit Size:

32 – Offers high computational power and performance for complex tasks.

No. of Terminals:

176 – Provides ample connectivity options for interfacing with other components.

Package Style:

FLATPACK, LOW PROFILE, FINE PITCH – Enables a slim and compact form factor, ideal for space-constrained applications.

Operating Temperature:

40 to 105 °C – Ensures reliable operation in extreme temperature conditions.

ADC Channels:

YES – Integrated analog-to-digital converters facilitate sensor interfacing and data acquisition.

DMA Channels:

YES – Direct Memory Access channels improve data transfer efficiency for high-speed applications.

Terminal Position:

QUAD – Offers a standardized terminal layout for easy integration and soldering.

ROM Words:

1048576 – Large memory capacity for storing program and data, suitable for complex algorithms.

Seated Height:

1.6 mm – Low profile design enables installation in slim devices or tight spaces.

Width:

24 mm – Compact width for space-efficient PCB layout and compact product design.

Data EEPROM Size:

64K – Sufficient data storage for storing configuration settings and user data.

Peripherals:

Various peripherals including DMA, PWM, RTC, and timers enhance the product's functionality and versatility.

Clock Frequency:

16 MHz – High clock speed for fast and efficient processing of instructions.

Length:

24 mm – Compact length for space-saving PCB layout and product miniaturization.

Temperature Grade:

INDUSTRIAL – Designed for reliable operation in industrial environments with harsh conditions.

Peripheral IC Type:

MICROCONTROLLER – Integrated microcontroller offers all-in-one processing and control capabilities.

RAM Bytes:

81920 – Large RAM capacity for data storage and efficient multitasking.

Technology:

CMOS – Energy-efficient technology for prolonged battery life and low power consumption.

Terminal Form:

GULL WING – Easy soldering and robust connection for reliable performance.

Analog To Digital Convertors:

48-Ch 10-Bit, 24-Ch 12-Bit – Offers a wide range of analog inputs and resolutions for diverse sensor interfacing needs.

Nominal Supply Voltage:

3.3 V – Standard supply voltage for compatibility with common power sources.

PWM Channels:

YES – Integrated Pulse Width Modulation channels for precise control of connected devices.

Connectivity:

Various connectivity options including CAN, I2C, IRDA, LIN, SCI, and SPI for versatile communication interfaces.

ROM Programmability:

FLASH – Allows for easy and fast reprogramming of the ROM for firmware updates and customization.

Terminal Pitch:

0.5 mm – Fine pitch spacing for compact PCB design and high-density routing.

Speed:

64 rpm – Supports high-speed operation for time-critical applications.

On Chip Program ROM Width:

8 – Efficient program storage width for optimized memory utilization.

No. of I/O Lines:

149 – Abundant Input/Output lines for versatile interfacing and connectivity options.

Technical Specifications

Microcontrollers SPC560B60L7B6E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 5 V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

No. of I/O Lines:

149

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

81920

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(6), I2C, IRDA, LIN(10), SCI(10), SPI(6)

Peripherals:

DMA(16), POR, PWM(64), RTC, TIMER(64), WDT

Analog To Digital Convertors:

48-Ch 10-Bit, 24-Ch 12-Bit

Trade Compliance

SPC560B60L7B6E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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