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SPC560B60L3B6E0X

STMicroelectronics

SPC560B60L3B6E0X by STMicroelectronics

SPC560B60L3B6E0X by STMicroelectronics is a 32-bit microcontroller with 1048576 ROM words, 81920 RAM bytes, and 64K data EEPROM size. It features 26-Ch 10-Bit and 24-Ch 12-Bit ADC channels, along with peripherals like DMA(16), PWM(37), and RTC. Ideal for industrial applications requiring CAN, I2C, LIN connectivity at a max clock frequency of 16 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,219 parts In-Stock

1+ parts

-

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5,219

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Digiode

USA . 4,687 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,687

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Anansix

USA . 985 parts In-Stock

1+ parts

-

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985

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 6,897 parts In-Stock

1+ parts

$6.040

100+ parts

-

1k+ parts

-

10k+ parts

-

6,897

$6.040

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-

Microchip USA

USA . 3,741 parts In-Stock

1+ parts

$19.312

100+ parts

-

1k+ parts

-

10k+ parts

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3,741

$19.312

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AZTECH Wire

Italy . 292 parts In-Stock

1+ parts

$21.050

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-

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292

$21.050

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IDEA Electronic Components Group

UK . 2,287 parts In-Stock

1+ parts

$33.438

100+ parts

-

1k+ parts

$30.094

10k+ parts

-

2,287

$33.438

-

$30.094

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MKK Technologies

India . 1,004 parts In-Stock

1+ parts

$62.879

100+ parts

-

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1,004

$62.879

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DigiPath Technology Company

USA . 1,004 parts In-Stock

1+ parts

$62.879

100+ parts

-

1k+ parts

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1,004

$62.879

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Component Stockers USA

USA . 744 parts In-Stock

1+ parts

$93.360

100+ parts

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744

$93.360

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Parana Technologies

USA . 1,142 parts In-Stock

1+ parts

-

100+ parts

$39.981

1k+ parts

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1,142

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$39.981

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Corphita

USA . 439 parts In-Stock

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439

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Overview

Unlock the power of innovation with the SPC560B60L3B6E0X microcontroller by STMicroelectronics. Crafted with precision and expertise, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. From automotive to industrial automation, this powerhouse delivers exceptional value and benefits to customers seeking top-notch quality and functionality. Experience seamless connectivity, advanced peripherals, and robust features, all in a compact and efficient package. Elevate your projects to new heights with the SPC560B60L3B6E0X and embrace the future of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers as it provides good protection and durability for the product.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making it easier to integrate into various electronic devices.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for flexibility in power supply options without risking damage to the microcontroller.

Bit Size: 32

A larger bit size allows for more complex calculations and operations to be performed, making the microcontroller suitable for a wide range of applications.

No. of Terminals: 100

Having a higher number of terminals provides more connectivity options and flexibility when designing electronic systems.

Minimum Operating Temperature: -40 °C

Being able to operate at low temperatures makes this microcontroller suitable for use in diverse environmental conditions.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and signals, expanding its utility in various applications.

ROM Words: 1048576

With a large ROM size, the microcontroller can store a significant amount of program code and data, enabling complex algorithms and functionality.

DMA Channels: YES

Direct Memory Access channels help improve data transfer efficiency and offload the CPU, enhancing overall system performance.

Maximum Clock Frequency: 16 MHz

A high clock frequency allows for fast processing speed, making the microcontroller suitable for applications that require real-time operation.

RAM Bytes: 81920

Having a large RAM size enables the microcontroller to store and manipulate data efficiently, facilitating complex computations and multitasking.

Connectivity: CAN(6), I2C, IRDA, LIN(4), SCI(4), SPI(3)

The microcontroller offers multiple connectivity options, making it versatile and compatible with a wide range of communication protocols and devices.

Speed: 64 rpm

While not directly related to the processing speed, the rotational speed mentioned can be useful in applications that involve motor control or synchronization.

Technical Specifications

Microcontrollers SPC560B60L3B6E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 5 V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

77

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

81920

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(6), I2C, IRDA, LIN(4), SCI(4), SPI(3)

Peripherals:

DMA(16), POR, PWM(37), RTC, TIMER(37), WDT

Analog To Digital Convertors:

26-Ch 10-Bit, 24-Ch 12-Bit

Trade Compliance

SPC560B60L3B6E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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