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M95256-RCS6TP/A

STMicroelectronics

M95256-RCS6TP/A by STMicroelectronics

M95256-RCS6TP/A by STMicroelectronics is a 32Kx8 EEPROM with a max clock frequency of 2 MHz and operates b/w 1.8V to 5.5V. Its compact design features an industrial temp range (-40 °C to 85 °C) and supports hardware/software write protection, ideal for embedded applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,287 parts In-Stock

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7,287

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Digiode

USA . 3,913 parts In-Stock

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3,913

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Anansix

USA . 1,205 parts In-Stock

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1,205

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 172 parts In-Stock

1+ parts

$2.153

100+ parts

-

1k+ parts

$1.938

10k+ parts

-

172

$2.153

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$1.938

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MKK Technologies

India . 1,179 parts In-Stock

1+ parts

$4.048

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1,179

$4.048

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DigiPath Technology Company

USA . 1,179 parts In-Stock

1+ parts

$4.048

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1,179

$4.048

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Microchip USA

USA . 139 parts In-Stock

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$5.709

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139

$5.709

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AZTECH Wire

Italy . 719 parts In-Stock

1+ parts

$14.600

100+ parts

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719

$14.600

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Corphita

USA . 3,163 parts In-Stock

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3,163

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Parana Technologies

USA . 1,573 parts In-Stock

1+ parts

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$2.574

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1,573

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$2.574

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Overview

Unlock the potential of your designs with the M95256-RCS6TP/A EEPROM from STMicroelectronics, a renowned leader in innovative semiconductor solutions. This high-performance memory chip offers unmatched reliability and flexibility for a wide range of applications, from automotive to industrial control. With its robust durability and advanced features, every project benefits from enhanced data retention and fast access speeds, ensuring you stay ahead in today’s competitive landscape. Elevate your electronics with STMicroelectronics—where quality meets innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various environments.

Surface Mount: YES

Surface mount technology allows for compact circuit design, making it suitable for space-constrained applications.

Package Shape: RECTANGULAR

A rectangular shape is optimal for efficient use of board space, facilitating easier integration into existing designs.

Operating Mode: SYNCHRONOUS

Synchronous operation enables faster data transfer rates, improving overall performance.

Nominal Supply Voltage / Vsup: 2.5 V

A nominal supply voltage of 2.5 V increases compatibility with modern low-power systems.

Power Supplies (V): 2/5

Supports a range of power supply options (2 V to 5 V), offering flexibility in various applications.

No. of Terminals: 8

With 8 terminals, the device provides a robust connection while maintaining a compact layout.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The very thin profile and fine pitch design enhance density and reduce the footprint on the PCB.

Maximum Operating Temperature: 85 °C

Capable of operating at temperatures up to 85 °C, this EEPROM is suitable for industrial applications.

Organization: 32KX8

The 32Kx8 organization provides a substantial amount of memory for storing data entries efficiently.

Minimum Operating Temperature: -40 °C

Operating as low as -40 °C ensures performance in harsh environments and cold climates.

Terminal Position: BOTTOM

Bottom terminal position helps in optimizing board space and improving thermal performance.

Write Protection: HARDWARE/SOFTWARE

Hardware/software write protection safeguards critical data, ensuring reliability in applications where data integrity is vital.

Maximum Seated Height: 0.65 mm

A maximum seated height of 0.65 mm allows for a very low-profile design, perfect for portable devices.

Maximum Clock Frequency (fCLK): 2 MHz

A clock frequency of up to 2 MHz supports high-speed operations, enhancing data access performance.

Width: 1.785 mm

Compact width enables easy integration into various device designs without space conflicts.

Minimum Supply Voltage (Vsup): 1.8 V

Operating at a minimum supply voltage of 1.8 V makes this EEPROM ideal for low-power applications.

Length: 1.97 mm

Short length contributes to a compact package design, facilitating space optimization on PCBs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures compliance with rigorous environmental standards, suitable for industrial use.

Technology: CMOS

CMOS technology allows for low power consumption and high performance, ideal for battery-operated devices.

Parallel or Serial: SERIAL

Using a serial interface simplifies connections and reduces pin count, making it easier to integrate into designs.

Terminal Form: BALL

Ball terminal form enhances soldering reliability and reduces the risk of physical damage during assembly.

Maximum Supply Current: 3 mA

Low maximum supply current contributes to overall energy efficiency, making it suitable for power-sensitive applications.

No. of Words: 32768 words

The capacity of 32,768 words ensures ample space for various applications, accommodating high data storage requirements.

Memory Width: 8

An 8-bit memory width aligns with common data types, ensuring compatibility with a wide range of systems.

Minimum Data Retention Time: 40 years

A minimum data retention time of 40 years ensures long-term data integrity, making it suitable for archival applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density layouts, essential for modern electronic devices.

No. of Words Code: 32K

Support for 32K words ensures sufficient storage for complex applications while maintaining a compact design.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V offers flexibility in operating ranges, making it versatile for various systems.

Endurance: 1000000 Write/Erase Cycles

Endurance of 1,000,000 write/erase cycles supports extensive data rewriting, ideal for applications requiring frequent updates.

Serial Bus Type: SPI

The SPI serial bus type offers high-speed data transfer capabilities, making it suitable for demanding applications.

Maximum Write Cycle Time (tWC): 5 ms

Quick write cycle time of 5 ms enhances responsiveness in applications where real-time updates are critical.

Memory Density: 262144 bit

A memory density of 262,144 bits provides substantial storage capacity without increasing the chip size.

Memory IC Type: EEPROM

As an EEPROM, it allows for electrically erasable programmable memory, offering flexibility in data management.

Maximum Standby Current: 0.000003 Amp

Extremely low standby current promotes energy efficiency in devices, extending battery life and reducing power costs.

Technical Specifications

EEPROM M95256-RCS6TP/A attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B8

Length:

1.97 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,3X5,17/10

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.65 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000003 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.785 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95256-RCS6TP/A Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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