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M95256-BN3TP

STMicroelectronics

M95256-BN3TP by STMicroelectronics

M95256-BN3TP by STMicroelectronics is a 32Kx8 EEPROM with a max clock frequency of 5 MHz, operating in synchronous mode. It supports automotive applications with a temp range of -40 °C to 125 °C and operates at 4.5V to 5.5V supply voltage. Its dual terminal design ensures reliable performance in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,509 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,509

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-

-

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Vyrian

USA . 3,307 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,307

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Anansix

USA . 1,274 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,274

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 416 parts In-Stock

1+ parts

$1.863

100+ parts

-

1k+ parts

$1.677

10k+ parts

-

416

$1.863

-

$1.677

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MKK Technologies

India . 2,066 parts In-Stock

1+ parts

$3.503

100+ parts

-

1k+ parts

-

10k+ parts

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2,066

$3.503

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DigiPath Technology Company

USA . 2,066 parts In-Stock

1+ parts

$3.503

100+ parts

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1k+ parts

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10k+ parts

-

2,066

$3.503

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Parana Technologies

USA . 1,404 parts In-Stock

1+ parts

-

100+ parts

$2.228

1k+ parts

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10k+ parts

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1,404

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$2.228

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Corphita

USA . 272 parts In-Stock

1+ parts

-

100+ parts

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272

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Overview

Unlock unparalleled reliability and performance with the M95256-BN3TP EEPROM from STMicroelectronics, a leader in the semiconductor industry. Engineered for automotive applications, this high-quality memory solution ensures robust data storage even under extreme conditions. Enjoy seamless integration and fast access speeds, empowering your designs with efficiency and longevity. Trust STMicroelectronics to deliver innovation that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and resistance to environmental factors, making this EEPROM reliable for various applications.

Package Shape: RECTANGULAR

A rectangular package shape provides efficient use of PCB space, which is ideal for compact designs.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer rates, improving overall system performance.

Nominal Supply Voltage (Vsup): 5V

Operating at a standard 5V supply voltage makes it compatible with a wide range of electronic systems.

Number of Terminals: 8

With 8 terminals, this EEPROM supports simpler circuit designs while maintaining functionality.

Package Style (Meter): IN-LINE

The in-line package style permits easier soldering and placement on PCBs, facilitating assembly.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature enhances reliability in extreme conditions, making it suitable for automotive and industrial applications.

Organization: 32KX8

This organization allows for efficient data management, optimizing the storage capacity in various applications.

Minimum Operating Temperature: -40 °C

The capability to operate in low temperatures indicates robustness, particularly valuable in harsh environments.

Terminal Finish: Matte Tin (Sn)

Matte tin provides excellent solderability and oxidation resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position enhances flexibility in PCB layouts, making it easier to integrate into various designs.

Maximum Seated Height: 5.33 mm

A compact seated height allows for space-saving designs while maintaining high performance.

Maximum Clock Frequency (fCLK): 5 MHz

A maximum clock frequency of 5 MHz offers a good balance between speed and power consumption for efficient operation.

Width: 7.62 mm

Its narrow width is advantageous for tight board layouts and density optimization.

Minimum Supply Voltage (Vsup): 4.5 V

Supports operation at a minimum voltage, ensuring compatibility with a variety of power sources.

Length: 9.27 mm

The short length facilitates easier integration into compact designs and reduces overall footprint.

Temperature Grade: AUTOMOTIVE

Designed with automotive-grade specifications, ensuring reliability and performance in vehicular applications.

Technology: CMOS

CMOS technology enhances speed and power efficiency, making it suitable for battery-operated devices.

Parallel or Serial: SERIAL

Serial connectivity simplifies wiring and reduces pin count, making it easier for integration.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical strength and reliability in various mounting conditions.

Number of Words: 32768 words

A substantial word count supports complex applications requiring significant data storage.

Memory Width: 8

An 8-bit memory width makes it compatible with common microcontrollers and digital systems.

Terminal Pitch: 2.54 mm

A standard terminal pitch aids in ease of integration with typical PCB layouts, reducing design complexity.

Number of Words Code: 32K

The 32K word capacity allows for diverse application use cases, from simple data storage to complex tasks.

Maximum Supply Voltage (Vsup): 5.5 V

The support for a maximum supply voltage ensures compatibility with a range of power supply options.

Serial Bus Type: SPI

Using the SPI bus facilitates high-speed communication, benefiting applications that require fast data transfers.

Maximum Write Cycle Time (tWC): 5 ms

A short write cycle time enhances efficiency in applications that frequently update data.

Memory Density: 262144 bit

High memory density supports extensive data storage, catering to modern demands for storage capacity.

Memory IC Type: EEPROM

Being an EEPROM allows for non-volatile memory storage, ensuring data retention without power.

Technical Specifications

EEPROM M95256-BN3TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

5 MHz

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.27 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

SPI

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

M95256-BN3TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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