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M95080-RMN6P

STMicroelectronics

M95080-RMN6P by STMicroelectronics

M95080-RMN6P from STMicroelectronics is a 1Kx8 EEPROM with a max clock frequency of 5 MHz and operates in a temp range of -40 °C to 85 °C. It features both hardware/software write protection and supports SPI for efficient data transfer. Ideal for industrial applications requiring reliable memory storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,663 parts In-Stock

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3,663

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Anansix

USA . 2,572 parts In-Stock

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2,572

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Vyrian

USA . 2,241 parts In-Stock

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2,241

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IDEA Electronic Components Group

UK . 2,304 parts In-Stock

1+ parts

$4.169

100+ parts

-

1k+ parts

$3.752

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2,304

$4.169

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$3.752

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MKK Technologies

India . 1,184 parts In-Stock

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$7.840

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1,184

$7.840

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DigiPath Technology Company

USA . 1,184 parts In-Stock

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$7.840

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1,184

$7.840

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AZTECH Wire

Italy . 774 parts In-Stock

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$8.610

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774

$8.610

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Microchip USA

USA . 468 parts In-Stock

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$19.618

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468

$19.618

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A-Z Elektronik GmbH

Germany . 7,394 parts In-Stock

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7,394

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Alle Elektronik GmbH

Germany . 4,929 parts In-Stock

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4,929

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Corphita

USA . 1,609 parts In-Stock

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1,609

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Parana Technologies

USA . 298 parts In-Stock

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$4.985

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298

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$4.985

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Overview

Unlock unparalleled reliability and performance with the M95080-RMN6P EEPROM from STMicroelectronics. Crafted for industrial applications, this high-quality memory solution boasts robust endurance and a wide operating temperature range, ensuring seamless operation in demanding environments. Enjoy peace of mind with hardware and software write protection features while benefiting from easy integration thanks to its compact design. Elevate your projects with a trusted brand that prioritizes excellence and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and durability, making the EEPROM suitable for diverse applications.

Surface Mount: YES

Surface mount design allows for compact PCB layouts, saving space in electronic devices.

Package Shape: RECTANGULAR

The rectangular shape optimizes board space and provides a reliable mounting interface.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances the speed and efficiency of data transfer.

Nominal Supply Voltage / Vsup: 5 V

Operates at a commonly used voltage, simplifying integration into existing designs.

Power Supplies (V): 2/5

Flexible power supply options make it adaptable for various applications.

No. of Terminals: 8

A moderate number of terminals strikes a balance between complexity and functionality.

Package Style (Meter): SMALL OUTLINE

The small outline style reduces footprint and facilitates high-density PCB designs.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications that may require operation in warmer environments.

Organization: 1KX8

Organized memory efficiently accommodates 1024 words, offering ample data storage.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments, increasing use case versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish ensures excellent electrical performance and longevity against corrosion.

Terminal Position: DUAL

Dual terminal positions offer flexibility in design and layout for PCB placement.

Write Protection: HARDWARE/SOFTWARE

Enhanced security options help protect data from accidental overwrites and unauthorized access.

Maximum Seated Height: 1.75 mm

Low profile design aids in achieving compact device designs while maintaining performance.

Maximum Clock Frequency (fCLK): 5 MHz

A high clock frequency allows for quick data access, improving overall system performance.

Width: 3.9 mm

Slim width allows for flexible component placement on the PCB.

Minimum Supply Voltage (Vsup): 1.8 V

Can operate at lower voltages, making it suitable for energy-efficient designs.

Length: 4.9 mm

Compact length contributes to versatile applications with limited space.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications ensures reliability under demanding conditions.

Technology: CMOS

CMOS technology provides low power consumption, extending battery life in portable devices.

Parallel or Serial: SERIAL

Serial communication simplifies connection and reduces pin count requirements.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and assembly processes.

Maximum Supply Current: 1 mA

Low current requirements enhance energy efficiency, suitable for low-power applications.

No. of Words: 1024 words

Generous memory size allows for a variety of data storage needs.

Memory Width: 8

An 8-bit memory width allows efficient handling of data in standard formats.

Minimum Data Retention Time: 40

Long data retention time ensures critical data is preserved for extended periods.

Terminal Pitch: 1.27 mm

Standard terminal pitch simplifies assembly and compatibility with typical PCB designs.

No. of Words Code: 1K

1K words code means ample memory space for various applications.

Maximum Supply Voltage (Vsup): 5.5 V

Wide supply voltage range provides flexibility in system design.

Endurance: 1000000 Write/Erase Cycles

High endurance ensures durability and longevity in applications with frequent data updates.

Serial Bus Type: SPI

SPI bus compatibility ensures fast communication speeds and ease of integration.

Maximum Write Cycle Time (tWC): 5 ms

Quick write cycle time enhances performance in write-heavy applications.

Memory Density: 8192 bit

High memory density optimally utilizes space while providing abundant storage capacity.

Memory IC Type: EEPROM

EEPROM technology is ideal for applications requiring non-volatile storage that can be rewritten.

Maximum Standby Current: 0.0000005 Amp

Extremely low standby current supports energy-saving designs, ideal for battery-operated devices.

Technical Specifications

EEPROM M95080-RMN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

5 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95080-RMN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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