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M95040-MN6TP

STMicroelectronics

M95040-MN6TP by STMicroelectronics

M95040-MN6TP by STMicroelectronics is a 512x8-bit EEPROM with a 5V supply, ideal for industrial applications. It features asynchronous operation, SPI serial bus type, and supports up to 1M write/erase cycles. Its compact SOIC package ensures efficient space utilization in designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,586 parts In-Stock

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5,586

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Anansix

USA . 2,597 parts In-Stock

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2,597

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Digiode

USA . 2,394 parts In-Stock

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2,394

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,888 parts In-Stock

1+ parts

$2.076

100+ parts

-

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$1.868

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1,888

$2.076

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$1.868

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MKK Technologies

India . 417 parts In-Stock

1+ parts

$3.903

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417

$3.903

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DigiPath Technology Company

USA . 417 parts In-Stock

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$3.903

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417

$3.903

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AZTECH Wire

Italy . 810 parts In-Stock

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$19.030

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810

$19.030

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A-Z Elektronik GmbH

Germany . 6,027 parts In-Stock

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6,027

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Microchip USA

USA . 4,907 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,018 parts In-Stock

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Corphita

USA . 2,291 parts In-Stock

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2,291

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Parana Technologies

USA . 504 parts In-Stock

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$2.482

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504

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$2.482

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Overview

Unlock the potential of your projects with the M95040-MN6TP EEPROM from STMicroelectronics, a trusted leader in innovative semiconductor solutions. Designed for reliability and versatility, this compact memory chip excels in diverse applications—from consumer electronics to industrial automation. With robust write protection features and impressive endurance, it ensures data integrity even under extreme conditions. Experience enhanced performance and peace of mind with ST's commitment to quality and excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that provides protection against environmental factors, ensuring longevity.

Surface Mount: YES

Allows for efficient use of PCB space and supports high-density designs.

Package Shape: RECTANGULAR

Standard shape that facilitates easy manufacturing and integration into various applications.

Operating Mode: ASYNCHRONOUS

Allows for flexible operation without the need for a clock signal, simplifying system design.

Nominal Supply Voltage / Vsup: 5V

Common supply voltage compatible with a wide range of systems and eliminates the need for additional voltage regulators.

Power Supplies (V): 5

Ensures consistent performance across various applications by using standard power supplies.

No. of Terminals: 8

Sufficient number of terminals for versatile connection options while maintaining simplicity.

Package Style (Meter): SMALL OUTLINE

Compact design suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

Supports applications in high-temperature environments, ideal for industrial uses.

Organization: 512X8

Efficient memory organization that allows for streamlined data handling.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold, making it suitable for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Offers excellent solderability and corrosion resistance, enhancing reliability.

Terminal Position: DUAL

Facilitates better layout options on PCBs, optimizing design flexibility.

Write Protection: HARDWARE/SOFTWARE

Provides robust data protection mechanisms, ensuring data integrity during operation.

Maximum Seated Height: 1.75 mm

Low profile design ideal for devices where space is critical.

Maximum Clock Frequency (fCLK): 10 MHz

Fast operation speed enables quick data access, enhancing overall system performance.

Width: 3.9 mm

Narrow width aids in fitting within compact device footprints.

Minimum Supply Voltage (Vsup): 4.5 V

Flexibility in operation with lower voltage requirements, compatible with battery applications.

Maximum Time At Peak Reflow Temperature: 30s

Compatible with standard soldering processes, ensuring reliable assembly.

Peak Reflow Temperature: 260 °C

Can withstand high temperatures during the manufacturing process without damage.

Length: 4.9 mm

Compact length promotes easier integration into devices with limited space.

Temperature Grade: INDUSTRIAL

Designed for reliable performance in industrial environments, offering durability.

Technology: CMOS

Low power consumption and high-speed performance, making it energy efficient.

Parallel or Serial: SERIAL

Serial communication simplifies connections and reduces pin count.

Terminal Form: GULL WING

Facilitates easy soldering and ensures a robust physical connection.

Maximum Supply Current: 5 mA

Low supply current aids in energy-efficient designs, ideal for battery-powered devices.

No. of Words: 512 words

Balanced memory capacity suitable for a variety of applications.

Memory Width: 8

Efficient data width for handling bytes, streamlining data processes.

Minimum Data Retention Time: 40 years

Long data retention time ensures reliability for applications requiring lasting storage.

Terminal Pitch: 1.27 mm

Standard pitch allows for compatibility with existing PCB designs.

No. of Words Code: 512

Highlights the memory structure, providing an accessible coding format for developers.

Maximum Supply Voltage (Vsup): 5.5 V

Compatibility with a range of supply voltages enhances design flexibility.

Endurance: 1,000,000 Write/Erase Cycles

High endurance makes it suitable for applications with frequent write and erase operations.

Serial Bus Type: SPI

SPI interface provides fast communication and is widely used in embedded applications.

Maximum Write Cycle Time (tWC): 5 ms

Quick writing capability ensures high performance in data-sensitive applications.

Memory Density: 4096 bit

Sufficient density for diverse memory storage needs, suitable for various use cases.

Memory IC Type: EEPROM

Versatile EEPROM type memory provides non-volatile storage for critical applications.

Maximum Standby Current: 0.000002 Amp

Extremely low standby consumption enhances battery life in portable devices.

Technical Specifications

EEPROM M95040-MN6TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

10 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95040-MN6TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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