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M95010-RMN6P

STMicroelectronics

M95010-RMN6P by STMicroelectronics

M95010-RMN6P by STMicroelectronics is a 1024-bit EEPROM with a synchronous SPI interface, ideal for industrial applications. It operates b/w 1.8V and 5.5V, supports up to 1M write/erase cycles, and withstands temperatures from -40 °C to 85 °C. Its compact SOIC-8 package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,360 parts In-Stock

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8,360

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Digiode

USA . 3,044 parts In-Stock

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3,044

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Anansix

USA . 2,869 parts In-Stock

1+ parts

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2,869

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ComSIT Distribution GmbH

Germany . 1,200 parts In-Stock

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1,200

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ComSIT USA

USA . 1,200 parts In-Stock

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1,200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 40 parts In-Stock

1+ parts

$3.275

100+ parts

-

1k+ parts

$2.948

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40

$3.275

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$2.948

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Microchip USA

USA . 372 parts In-Stock

1+ parts

$5.849

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372

$5.849

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MKK Technologies

India . 1,394 parts In-Stock

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$6.159

100+ parts

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1,394

$6.159

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DigiPath Technology Company

USA . 1,394 parts In-Stock

1+ parts

$6.159

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1,394

$6.159

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AZTECH Wire

Italy . 982 parts In-Stock

1+ parts

$18.860

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982

$18.860

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Component Stockers USA

USA . 798 parts In-Stock

1+ parts

$99.990

100+ parts

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798

$99.990

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Corphita

USA . 2,600 parts In-Stock

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2,600

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Parana Technologies

USA . 896 parts In-Stock

1+ parts

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100+ parts

$3.916

1k+ parts

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896

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$3.916

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Overview

Elevate your projects with the M95010-RMN6P EEPROM from STMicroelectronics, a trusted leader in semiconductor innovation. Designed for reliability and efficiency, this compact memory solution excels in diverse applications from consumer electronics to industrial automation. Enjoy peace of mind with robust write protection features, outstanding endurance, and a wide operating temperature range, ensuring optimal performance under any conditions. Transform your designs with unmatched quality and advanced technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body enhances durability and makes it suitable for a variety of applications.

Surface Mount: YES

Surface mount compatibility allows for compact designs, making it ideal for modern electronic assemblies.

Package Shape: RECTANGULAR

The rectangular shape facilitates space-efficient layout and integration in circuit designs.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures faster data transfer speeds, improving overall performance in applications.

Nominal Supply Voltage / Vsup: 2.5 V

Operating at a nominal supply voltage of 2.5 V promotes energy efficiency while maintaining reliable operation.

Power Supplies (V): 2/5

Support for a wide power supply range (2V to 5V) offers flexibility for integration into various systems.

No. of Terminals: 8

With 8 terminals, this EEPROM is well-equipped for versatile connectivity in space-constrained designs.

Package Style (Meter): SMALL OUTLINE

Small outline package style aids in minimizing the footprint on PCB, making it ideal for compact electronic products.

Maximum Operating Temperature: 85 °C

The capability to operate at temperatures up to 85 °C ensures reliability in industrial environments.

Organization: 128X8

This memory organization supports efficient data handling, making it suitable for applications requiring compact data storage.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C allows for use in extreme conditions, enhancing its reliability in diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent solderability and enhances the longevity of the connections.

Terminal Position: DUAL

Dual terminal positioning provides stability and reliability during mounting, reducing potential failure points.

Write Protection: HARDWARE/SOFTWARE

The dual write protection mechanism enhances data integrity, providing security against accidental overwrites.

Maximum Seated Height: 1.75 mm

The low seated height accommodates integration in low-profile designs, fitting in tight spaces.

Maximum Clock Frequency (fCLK): 5 MHz

A 5 MHz clock frequency maximizes data throughput, making it suitable for high-speed applications.

Width: 3.9 mm

Compact width allows for flexibility in PCB layout and helps in minimizing overall device size.

Minimum Supply Voltage (Vsup): 1.8 V

A minimum operating voltage of 1.8 V supports low power designs, making it energy-efficient.

Maximum Time At Peak Reflow Temperature: 40 s

The ability to withstand longer peak reflow times improves compatibility with modern soldering processes.

Peak Reflow Temperature: 260 °C

High reflow peak temperature ensures compatibility with lead-free soldering processes, suitable for environmentally friendly applications.

Length: 4.9 mm

The compact length helps maintain device portability without sacrificing performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees performance in challenging environments, making it suitable for critical applications.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, making it efficient for embedded systems.

Parallel or Serial: SERIAL

Serial communication reduces pin counts, enhancing board space utilization and simplifying design.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and reliability for surface mount assembly.

Maximum Supply Current: 1 mA

Low maximum supply current contributes to overall energy efficiency, making it suitable for battery-operated devices.

No. of Words: 128 words

Supporting 128 words allows for adequate storage for various applications, striking a balance between capacity and size.

Memory Width: 8

An 8-bit memory width enables efficient data storage and retrieval, essential for many electronic applications.

Minimum Data Retention Time: 40 years

With a minimum data retention time of 40 years, this EEPROM assures long-term data storage stability.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch provides compatibility with various circuit designs while ensuring adequate spacing.

No. of Words Code: 128

The configuration of 128 words offers sufficient memory organization for small-scale applications.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in powering applications without risking damage.

Endurance: 1,000,000 Write/Erase Cycles

An endurance of 1,000,000 write/erase cycles ensures long-lasting performance, perfect for demanding applications.

Serial Bus Type: SPI

The support for SPI bus type allows for high-speed communication, ideal for fast data transfer requirements.

Maximum Write Cycle Time (tWC): 5 ms

A maximum write cycle time of 5 ms enables efficient data updates, enhancing the responsiveness of applications.

Memory Density: 1024 bit

With a memory density of 1024 bits, it provides appropriate storage for simple applications, balancing performance and space.

Memory IC Type: EEPROM

As an EEPROM type, it offers non-volatile memory capabilities, ideal for storing crucial configuration data.

Maximum Standby Current: 0.0005 Amps

The extremely low standby current ensures energy efficiency, making it ideal for power-sensitive applications.

Technical Specifications

EEPROM M95010-RMN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

5 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95010-RMN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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