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M93C76-WMN6P

STMicroelectronics

M93C76-WMN6P by STMicroelectronics

M93C76-WMN6P by STMicroelectronics is a 512x16 EEPROM with a synchronous operating mode and a max clock frequency of 2 MHz. It operates b/w 2.5V to 5.5V, making it ideal for industrial applications requiring reliable data retention at extreme temperatures. With software write protection and endurance of 1M cycles, it's perfect for embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,174 parts In-Stock

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2,174

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Anansix

USA . 2,002 parts In-Stock

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2,002

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Digiode

USA . 936 parts In-Stock

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936

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 31 parts In-Stock

1+ parts

$2.262

100+ parts

-

1k+ parts

$2.036

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31

$2.262

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$2.036

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MKK Technologies

India . 1,717 parts In-Stock

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$4.254

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$4.254

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DigiPath Technology Company

USA . 1,717 parts In-Stock

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$4.254

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1,717

$4.254

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Microchip USA

USA . 385 parts In-Stock

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$9.279

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385

$9.279

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AZTECH Wire

Italy . 788 parts In-Stock

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$10.950

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788

$10.950

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Component Stockers USA

USA . 487 parts In-Stock

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$99.990

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487

$99.990

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Corphita

USA . 3,702 parts In-Stock

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3,702

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Kepictronics

USA . 1,900 parts In-Stock

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1,900

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Parana Technologies

USA . 174 parts In-Stock

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$2.705

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174

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$2.705

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Overview

Unlock the potential of your applications with STMicroelectronics' M93C76-WMN6P EEPROM. Renowned for exceptional reliability and performance, this memory solution excels in diverse fields like automotive, industrial, and consumer electronics. Its compact design ensures seamless integration while offering robust data retention and endurance. Experience the advantages of high-speed synchronous operations and software write protection, delivering peace of mind and unmatched value for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material provides protection against environmental factors, ensuring reliability and longevity.

Surface Mount: YES

Facilitates efficient space utilization on printed circuit boards, making it ideal for compact designs.

Package Shape: RECTANGULAR

Rectangular shape allows for easier placement in circuit layouts, enhancing design flexibility.

Operating Mode: SYNCHRONOUS

Enables faster data transfer speeds, improving overall system performance.

Nominal Supply Voltage / Vsup: 5V

Standard voltage level for many applications, making it easily integrable with existing systems.

Power Supplies: 3/5V

Versatile power supply options increase compatibility with various devices and applications.

No. of Terminals: 8

Adequate number of terminals for reliable connections and signal integrity in a small footprint.

Package Style (Meter): SMALL OUTLINE

Compact form factor reduces space requirements on PCBs, enabling more efficient designs.

Alternate Memory Width: 8

Provides flexibility in data handling and compatibility with different system architectures.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where operational temperature ranges can be extreme.

Organization: 512X16

Sufficient memory organization to support a variety of applications requiring consistent data storage.

Minimum Operating Temperature: -40 °C

Designed for harsh environments, ensuring reliable operation in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish guarantees excellent conductivity and resistance to corrosion.

Terminal Position: DUAL

Optimizes space and layout design, simplifying integration into various applications.

Write Protection: SOFTWARE

Software-based write protection enhances data security and minimizes accidental alterations.

Maximum Seated Height: 1.75 mm

Low profile design reduces overall device height, making it particularly effective for compact assemblies.

Maximum Clock Frequency (fCLK): 2 MHz

Allows for fast data transfer rates, improving performance for data-intensive applications.

Width: 3.9 mm

Slim dimensions support efficient PCB layouts and cramped environments.

Minimum Supply Voltage (Vsup): 2.5V

Lower voltage operation increases energy efficiency and expands application ranges.

Length: 4.9 mm

Compact length aids in fitting into smaller electronic devices or designs.

Temperature Grade: INDUSTRIAL

Specifically designed for industrial applications, ensuring durability and reliability under stress.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, ideal for modern applications.

Parallel or Serial: SERIAL

Serial communication simplifies connections and can reduce the number of required I/O pins.

Terminal Form: GULL WING

Gull-wing terminals improve solder joint strength and enhance reliability for surface-mount technology.

Maximum Supply Current: 1.5 mA

Low supply current leads to power efficiency, beneficial for battery-operated devices.

No. of Words: 512 words

Offers a substantial amount of memory storage for various applications without being excessive.

Memory Width: 16

Enables efficient data handling for applications requiring wide data paths.

Minimum Data Retention Time: 40 years

Long retention time ensures data integrity for crucial applications over extended periods.

Terminal Pitch: 1.27 mm

Standard pitch allows for compatibility with common PCB designs.

No. of Words Code: 512

Code organization ensures effective data management and easy access.

Maximum Supply Voltage (Vsup): 5.5V

High maximum supply voltage supports a wide range of application needs.

Endurance: 1000000 Write/Erase Cycles

High endurance value ensures longevity and reliability for frequent data updates.

Serial Bus Type: MICROWIRE

Compatibility with MICROWIRE allows for straightforward integration into existing designs.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time enhances the speed of operations in data-intensive applications.

Memory Density: 8192 bit

Provides ample memory density for a variety of applications, from basic to more complex tasks.

Memory IC Type: EEPROM

EEPROM technology allows for non-volatile data storage, making it suitable for critical data retention.

Maximum Standby Current: 0.00001 Amp

Ultra-low standby current maintains energy efficiency, crucial for battery-operated devices.

Technical Specifications

EEPROM M93C76-WMN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.00001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

1.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

SOFTWARE

Trade Compliance

M93C76-WMN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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