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M93C56-WMN6T

STMicroelectronics

M93C56-WMN6T by STMicroelectronics

M93C56-WMN6T by STMicroelectronics is a 2048-bit EEPROM with 128x16 organization, operating at up to 2 MHz clock frequency. It features software write protection and MICROWIRE serial bus type, suitable for industrial temperature grade applications. With a small outline package style and low standby current of 0.000005A, it offers reliable non-volatile memory storage solutions.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 97,500 parts In-Stock

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97,500

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Cyclops Electronics Ltd

UK . 40,000 parts In-Stock

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Bristol Electronics

USA . 17,307 parts In-Stock

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Dan-Mar Components

USA . 17,307 parts In-Stock

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17,307

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Vyrian

USA . 7,374 parts In-Stock

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Digiode

USA . 4,301 parts In-Stock

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Prism Electronics

USA . 2,840 parts In-Stock

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2,840

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ACDS - Activité Composants Distribution Service

France . 2,500 parts In-Stock

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2,500

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Elcom Components

USA . 1,838 parts In-Stock

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Anansix

USA . 424 parts In-Stock

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Connector Distribution Corp

USA . 26 parts In-Stock

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Right Parts Inc.

USA . 26 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 82 parts In-Stock

1+ parts

$2.668

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-

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$2.401

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82

$2.668

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$2.401

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MKK Technologies

India . 2,170 parts In-Stock

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$5.017

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$5.017

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DigiPath Technology Company

USA . 2,170 parts In-Stock

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$5.017

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$5.017

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AZTECH Wire

Italy . 342 parts In-Stock

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$17.450

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342

$17.450

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Microchip USA

USA . 490 parts In-Stock

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$130.706

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Kepictronics

USA . 22,685 parts In-Stock

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Authorized Procurement Solutions

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Lixinc

USA . 19,254 parts In-Stock

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Perfect Parts

USA . 6,357 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,709 parts In-Stock

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Infinite Electronics LLP (Excess)

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Assy Fe

Spain . 2,500 parts In-Stock

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Parana Technologies

USA . 2,171 parts In-Stock

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$3.190

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Alle Elektronik GmbH

Germany . 1,806 parts In-Stock

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Corphita

USA . 89 parts In-Stock

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Overview

Unlock endless possibilities with the M93C56-WMN6T by STMicroelectronics, a top-tier EEPROM designed to deliver reliable performance and unmatched quality. Crafted with precision and expertise, this compact memory solution offers seamless integration and exceptional durability, making it ideal for industrial applications. Experience lightning-fast data access, robust write protection, and unparalleled endurance with this cutting-edge technology. Elevate your projects with the superior value and innovative features of the M93C56-WMN6T, setting new standards in efficiency and reliability. Step into the future of memory solutions with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the EEPROM, making it suitable for various applications.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and control, enhancing the overall performance of the EEPROM.

Memory Density: 2048 bit

With a high memory density, this EEPROM can store a large amount of data efficiently.

Endurance: 1000000 Write/Erase Cycles

The high endurance level ensures a long lifespan for the EEPROM, making it reliable for frequent read/write operations.

Serial Bus Type: MICROWIRE

Using Microwire serial bus communication protocol provides fast and efficient data transfer, contributing to the overall performance of the EEPROM.

Technical Specifications

EEPROM M93C56-WMN6T attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

SOFTWARE

Trade Compliance

M93C56-WMN6T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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