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M93C56-RDS6TG

STMicroelectronics

M93C56-RDS6TG by STMicroelectronics

M93C56-RDS6TG by STMicroelectronics is a 2048-bit EEPROM with a 1 MHz max clock frequency, operating b/w -40 °C to 85°C. It features software write protection and supports dual terminals in a compact SOIC package. Ideal for industrial applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,016 parts In-Stock

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Anansix

USA . 1,438 parts In-Stock

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1,438

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Digiode

USA . 218 parts In-Stock

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218

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 220 parts In-Stock

1+ parts

$4.176

100+ parts

-

1k+ parts

$3.758

10k+ parts

-

220

$4.176

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$3.758

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$5.377

100+ parts

$5.323

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$5.108

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3,000

$5.377

$5.323

$5.108

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MKK Technologies

India . 244 parts In-Stock

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$7.852

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244

$7.852

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DigiPath Technology Company

USA . 244 parts In-Stock

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$7.852

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244

$7.852

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AZTECH Wire

Italy . 185 parts In-Stock

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$16.040

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185

$16.040

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Microchip USA

USA . 5,809 parts In-Stock

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Corphita

USA . 4,201 parts In-Stock

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Parana Technologies

USA . 856 parts In-Stock

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$4.993

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$4.993

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Overview

Unlock unparalleled reliability and performance with the M93C56-RDS6TG EEPROM from STMicroelectronics. Renowned for its commitment to quality, STMicroelectronics ensures your applications run smoothly, even in extreme conditions. This versatile memory solution is perfect for industrial controls, automotive systems, and consumer electronics, offering exceptional data retention and endurance. Experience peace of mind knowing you have a trusted partner powering your innovations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable construction ensures reliability in various applications.

Surface Mount: YES

Enables compact designs and easy integration into modern PCBs.

Package Shape: SQUARE

Optimizes space utilization on the circuit board.

Operating Mode: SYNCHRONOUS

Supports efficient data transfer and communication with minimal latency.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage level makes it compatible with a wide range of systems.

Power Supplies (V): 2/5

Flexibility in power supply options enhances application versatility.

No. of Terminals: 8

Sufficient connections facilitate integration into various circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact form factor is ideal for space-constrained applications.

Alternate Memory Width: 8

Provides flexibility in data handling and enhances compatibility.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with higher thermal demands.

Organization: 128X16

Enables efficient memory organization for various data storage needs.

Minimum Operating Temperature: -40 °C

Offers high reliability for extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Ensures excellent conductivity and resistance to corrosion.

Terminal Position: DUAL

Allows for versatile layout options in PCB design.

Write Protection: SOFTWARE

Enhances data integrity and security with software-controlled access.

Maximum Seated Height: 1.1 mm

Low profile design contributes to compact circuit designs.

Maximum Clock Frequency (fCLK): 1 MHz

Supports faster data processing and improved performance.

Width: 3 mm

Compact width facilitates integration into small devices.

Minimum Supply Voltage (Vsup): 1.8 V

Allows operation in low-power systems, enhancing energy efficiency.

Length: 3 mm

Small dimensions further promote space-saving designs.

Temperature Grade: INDUSTRIAL

Designed for reliable operation in demanding industrial environments.

Technology: CMOS

Offers low power consumption while maintaining high performance.

Parallel or Serial: SERIAL

Efficient data communication with reduced pin count.

Terminal Form: GULL WING

Facilitates reliable soldering and enhances connectivity.

Maximum Supply Current: 2 mA

Low power consumption makes it suitable for battery-operated devices.

No. of Words: 128 words

Offers sufficient memory capacity for a variety of applications.

Memory Width: 16

Allows for efficient data storage and retrieval.

Minimum Data Retention Time: 40

Ensures data integrity and longevity during power outages.

Terminal Pitch: 0.65 mm

Fine pitch allows for high-density mounting on PCBs.

No. of Words Code: 128

Facilitates efficient coding and retrieval of stored data.

Maximum Supply Voltage (Vsup): 5.5 V

Compatibility with standard voltage levels enhances application range.

Endurance: 1000000 Write/Erase Cycles

High endurance ensures long lifespan and reduces replacement frequency.

Serial Bus Type: MICROWIRE

Enables simple and effective communication with host devices.

Maximum Write Cycle Time (tWC): 10 ms

Fast write cycle supports efficient data updates and minimizes delays.

Memory Density: 2048 bit

Provides adequate storage capacity for essential data needs.

Memory IC Type: EEPROM

Suitable for applications requiring non-volatile memory and data retention.

Maximum Standby Current: 0.000002 Amp

Extremely low standby current enhances energy efficiency in idle states.

Technical Specifications

EEPROM M93C56-RDS6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

SOFTWARE

Trade Compliance

M93C56-RDS6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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