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M93C56-RDS6G

STMicroelectronics

M93C56-RDS6G by STMicroelectronics

M93C56-RDS6G by STMicroelectronics is a 2048-bit EEPROM with a 1 MHz max clock frequency, operating b/w -40 °C to 85°C. It features software write protection and supports dual terminals in a compact SOIC package. Ideal for industrial applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,804 parts In-Stock

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6,804

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Anansix

USA . 1,728 parts In-Stock

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1,728

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Digiode

USA . 1,375 parts In-Stock

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1,375

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 663 parts In-Stock

1+ parts

$5.319

100+ parts

-

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$4.787

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663

$5.319

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$4.787

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MKK Technologies

India . 2,201 parts In-Stock

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$10.001

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$10.001

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DigiPath Technology Company

USA . 2,201 parts In-Stock

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$10.001

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2,201

$10.001

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AZTECH Wire

Italy . 1,132 parts In-Stock

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$18.760

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1,132

$18.760

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QUARKTWIN TECHNOLOGY LTD

USA . 19,088 parts In-Stock

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19,088

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Microchip USA

USA . 5,085 parts In-Stock

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Corphita

USA . 2,674 parts In-Stock

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2,674

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Parana Technologies

USA . 1,333 parts In-Stock

1+ parts

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$6.359

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1,333

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$6.359

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Overview

Elevate your designs with the M93C56-RDS6G EEPROM from STMicroelectronics, a trusted leader in semiconductor innovation. This compact and robust memory solution offers exceptional reliability and performance across diverse applications, from consumer electronics to industrial automation. With features like software write protection and a wide operating temperature range, it provides unmatched flexibility and endurance, ensuring your products stand out in quality and longevity. Embrace the future with STMicroelectronics—where superior technology meets value-driven solutions!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures long-lasting performance and reliability in various environmental conditions.

Surface Mount: YES

Facilitates easy and compact integration into modern circuit designs, saving space on the PCB.

Package Shape: SQUARE

Compact and uniform shape optimizes space usage and improves layout consistency on the board.

Operating Mode: SYNCHRONOUS

Provides reliable and fast data transfer, improving overall system performance.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage level for compatibility with various electronic devices and systems.

Power Supplies (V): 2/5

Flexible operating voltage range allows for integration into different applications, enhancing versatility.

No. of Terminals: 8

Adequate terminals ensure necessary connectivity while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile design enables high-density mounting and efficient space utilization on PCBs.

Alternate Memory Width: 8

Allows for flexible data handling, providing versatility in application-specific implementations.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications, ensuring stability and reliability in high-temperature environments.

Organization: 128X16

Organized memory structure allows for efficient data access and management.

Minimum Operating Temperature: -40 °C

Ideal for use in extreme temperature conditions, providing reliable performance in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality finish enhances connection reliability and ensures durability against corrosion.

Terminal Position: DUAL

Facilitates easier soldering and better electrical performance in various board layouts.

Write Protection: SOFTWARE

Software-based write protection enhances data integrity and security against unintended modifications.

Maximum Seated Height: 1.1 mm

Low height ensures compatibility with low-profile designs, suitable for compact electronic devices.

Maximum Clock Frequency (fCLK): 1 MHz

Adequate clock frequency allows for fast data transactions, improving overall system efficiency.

Width: 3 mm

Compact width supports smaller PCB designs, making it ideal for space-constrained applications.

Minimum Supply Voltage (Vsup): 1.8 V

Flexible minimum voltage allows for low-power applications, enhancing energy efficiency.

Length: 3 mm

Small dimensions enable density in design, making it suitable for compact devices.

Temperature Grade: INDUSTRIAL

Engineered for industrial applications, ensuring reliability and longevity in demanding conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, attracting diverse applications.

Parallel or Serial: SERIAL

Serial interface simplifies connections, useful in systems where I/O pin availability is limited.

Terminal Form: GULL WING

Gull wing design facilitates easy soldering and aligns well with automated assembly processes.

Maximum Supply Current: 2 mA

Low supply current enhances energy efficiency, crucial for battery-operated devices.

No. of Words: 128 words

Provides adequate memory capacity for various applications, supporting small to medium data storage needs.

Memory Width: 16

Wider memory width allows for faster data processing, increasing overall system performance.

Minimum Data Retention Time: 40

Long retention time ensures data stability, critical for preserving information over extended periods.

Terminal Pitch: 0.65 mm

Tight terminal pitch supports higher density layouts, essential for modern compact electronic devices.

No. of Words Code: 128

Specifies word configuration directly, making it easier for engineers to assess memory sufficiency.

Maximum Supply Voltage (Vsup): 5.5 V

Broad supply voltage range allows compatibility with various systems, enhancing design flexibility.

Endurance: 1000000 Write/Erase Cycles

High endurance levels make this product suitable for frequent writing applications, prolonging device life.

Serial Bus Type: MICROWIRE

Compatibility with Microwire allows for efficient communication with microcontrollers, simplifying system integration.

Maximum Write Cycle Time (tWC): 10 ms

Fast write cycle times facilitate quicker updates, essential for time-sensitive applications.

Memory Density: 2048 bit

Adequate memory density supports various applications, ensuring flexibility for data storage needs.

Memory IC Type: EEPROM

EEPROM technology enables non-volatile memory storage, retaining data without power.

Maximum Standby Current: 0.000002 Amp

Extremely low standby current significantly reduces overall power consumption in idle states.

Technical Specifications

EEPROM M93C56-RDS6G attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

SOFTWARE

Trade Compliance

M93C56-RDS6G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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