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M93C56-MN6P

STMicroelectronics

M93C56-MN6P by STMicroelectronics

M93C56-MN6P by STMicroelectronics is a 2048-bit EEPROM with a 5V supply, featuring software write protection and a max clock frequency of 2 MHz. It operates in temperatures from -40 °C to 85°C, making it ideal for industrial applications. Its compact SOIC package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,065 parts In-Stock

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4,065

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Digiode

USA . 3,519 parts In-Stock

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3,519

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Anansix

USA . 1,748 parts In-Stock

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1,748

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,819 parts In-Stock

1+ parts

$3.797

100+ parts

-

1k+ parts

$3.417

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1,819

$3.797

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$3.417

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MKK Technologies

India . 197 parts In-Stock

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$7.140

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197

$7.140

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DigiPath Technology Company

USA . 197 parts In-Stock

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$7.140

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197

$7.140

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AZTECH Wire

Italy . 751 parts In-Stock

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$16.490

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751

$16.490

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Microchip USA

USA . 329 parts In-Stock

1+ parts

$51.635

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329

$51.635

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Corphita

USA . 4,883 parts In-Stock

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4,883

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Parana Technologies

USA . 1,849 parts In-Stock

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$4.540

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1,849

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$4.540

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Overview

Unlock innovation with the M93C56-MN6P EEPROM from STMicroelectronics, a trusted leader in semiconductor technology. This compact, reliable memory solution seamlessly integrates into various applications, offering exceptional endurance and write protection for your data. With its wide operating temperature range and low power consumption, it’s perfect for industrial and consumer electronics alike. Elevate your projects with ST's commitment to quality, ensuring your designs stand out with performance and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy provides robust protection against physical and environmental damage.

Surface Mount: YES

Surface mount technology allows for compact circuit designs, making this EEPROM suitable for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the PCB, fitting easily into various layouts.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer rates, enhancing overall performance in high-speed applications.

Nominal Supply Voltage / Vsup: 5V

A nominal supply voltage of 5V is common and easily supported by many power systems, ensuring broad compatibility.

Power Supplies (V): 5V

Operating with standard 5V power supplies simplifies design considerations and reduces component count.

No. of Terminals: 8

The 8-terminal configuration provides a balance between functionality and space efficiency.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for compact applications and allows for high-density circuit designs.

Alternate Memory Width: 8

An alternate memory width of 8 bits supports a variety of data configurations, giving more flexibility to designers.

Maximum Operating Temperature: 85 °C

This temperature rating ensures reliable operation in industrial environments where heat may be a concern.

Organization: 128X16

The 128x16 organization allows for efficient memory utilization, suitable for many embedded applications.

Minimum Operating Temperature: -40 °C

Operating temperatures as low as -40 °C make this EEPROM suitable for harsh environments and demanding applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish reduces contact resistance and enhances the reliability of electrical connections.

Terminal Position: DUAL

The dual terminal position simplifies PCB layout, facilitating easier integration into existing designs.

Write Protection: SOFTWARE

Software-based write protection enhances data integrity and security in critical applications.

Maximum Seated Height: 1.75 mm

Low seated height allows for more compact designs, making it versatile for various applications.

Maximum Clock Frequency (fCLK): 2 MHz

A maximum clock frequency of 2 MHz enables fast read/write operations, ideal for time-sensitive applications.

Width: 3.9 mm

A compact width makes it easy to integrate into tight space requirements on circuit boards.

Minimum Supply Voltage (Vsup): 4.5 V

Flexibility to operate at a minimum supply voltage of 4.5V extends its usability in various power supply contexts.

Length: 4.9 mm

Short length enables efficient use of real estate on the PCB, which is critical in miniaturized devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade certifies reliability and durability for demanding applications in challenging environments.

Technology: CMOS

CMOS technology enhances power efficiency, making this EEPROM ideal for battery-operated devices.

Parallel or Serial: SERIAL

Serial interface simplifies communication, making it easier to integrate with microcontrollers and other devices.

Terminal Form: GULL WING

Gull-wing terminals facilitate automated assembly and reliable soldering, ensuring quality and efficiency in production.

Maximum Supply Current: 2 mA

Low maximum supply current improves power efficiency, crucial for battery-powered applications.

No. of Words: 128 words

With 128 words of storage, this EEPROM provides ample space for storing configuration and operational data.

Memory Width: 16

A memory width of 16 bits allows efficient data handling and is suitable for a wide range of applications.

Minimum Data Retention Time: 40 years

An extended data retention time ensures that critical data remains intact over long periods without power.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for easier soldering and connection on modern PCBs.

No. of Words Code: 128

This specification confirms the product's data capacity, making it straightforward for design implementation.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V ensures that it can function well within typical operational tolerances.

Endurance: 1,000,000 Write/Erase Cycles

High endurance means this EEPROM can handle frequent data changes, making it suitable for applications that require regular updates.

Serial Bus Type: MICROWIRE

The Microwire serial bus type enables quick and efficient data transfers to and from the memory, enhancing overall system performance.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time allows for responsive systems, improving the user experience during data updates.

Memory Density: 2048 bit

A memory density of 2048 bits ensures that this EEPROM can cater to a variety of storage needs in digital applications.

Memory IC Type: EEPROM

As an EEPROM, this memory chip offers non-volatile storage capability, preserving data even without power.

Maximum Standby Current: 0.000015 Amp

Ultra-low standby current improves overall energy efficiency, which is especially advantageous in battery-operated devices.

Technical Specifications

EEPROM M93C56-MN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000015 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

SOFTWARE

Trade Compliance

M93C56-MN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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