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M93C46-RDS6TG

STMicroelectronics

M93C46-RDS6TG by STMicroelectronics

M93C46-RDS6TG from STMicroelectronics is a 1024-bit EEPROM with a synchronous operating mode and a max clock frequency of 1 MHz. It features software write protection, operates b/w -40 °C to 85 °C, and supports both 2V and 5V power supplies. Ideal for industrial applications requiring reliable data retention and endurance of up to 1 million write/erase cycles.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,911 parts In-Stock

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Digiode

USA . 4,949 parts In-Stock

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4,949

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Anansix

USA . 2,878 parts In-Stock

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2,878

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IDEA Electronic Components Group

UK . 469 parts In-Stock

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$4.537

100+ parts

-

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$4.084

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469

$4.537

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$4.084

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Microchip USA

USA . 356 parts In-Stock

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$7.256

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356

$7.256

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MKK Technologies

India . 717 parts In-Stock

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$8.532

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$8.532

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DigiPath Technology Company

USA . 717 parts In-Stock

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$8.532

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717

$8.532

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AZTECH Wire

Italy . 588 parts In-Stock

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$17.590

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588

$17.590

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Lixinc

USA . 19,882 parts In-Stock

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RC Electronics

USA . 8,955 parts In-Stock

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Corphita

USA . 2,779 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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2,400

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Alle Elektronik GmbH

Germany . 1,600 parts In-Stock

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Parana Technologies

USA . 653 parts In-Stock

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$5.425

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Overview

Unlock exceptional performance and reliability with the M93C46-RDS6TG EEPROM from STMicroelectronics, a leader in innovation and quality. Designed for versatility, this compact memory solution thrives in diverse applications, from industrial automation to consumer electronics. With robust endurance and energy efficiency, it ensures optimal data retention under extreme conditions, providing unmatched value for your projects. Choose STMicroelectronics for superior technology that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection, making the EEPROM suitable for various applications.

Surface Mount: YES

The surface mount design allows for easier integration on PCBs, saving space and enhancing soldering efficiency.

Package Shape: SQUARE

The square package shape simplifies layout design and allows for compact placement on circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures faster data access and communication timing, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 5

A standard nominal supply voltage of 5V ensures compatibility with most electronic systems.

Power Supplies (V): 2/5

Flexible operating voltage options (2V and 5V) provide versatility for different applications.

No. of Terminals: 8

Having 8 terminals allows for adequate connectivity while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style facilitates easier placement on high-density boards, optimizing space.

Alternate Memory Width: 8

Supports an 8-bit alternate memory width, providing flexibility for various data handling operations.

Maximum Operating Temperature: 85 °C

With an operating temperature up to 85 °C, this EEPROM can function reliably in warm environments.

Organization: 64X16

The 64x16 memory organization allows for structured data storage and retrieval, promoting efficient usage.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this EEPROM suitable for harsh and extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures good solderability and resistance to oxidation, enhancing longevity.

Terminal Position: DUAL

Dual terminal positioning allows for easier PCB design and assembly, accommodating varied layout needs.

Write Protection: SOFTWARE

Software-based write protection adds a layer of security against unintentional data overwrites.

Maximum Seated Height: 1.1 mm

A low seated height allows for a sleek design, suitable for space-constrained applications.

Maximum Clock Frequency (fCLK): 1 MHz

A clock frequency of 1 MHz facilitates fast data transfer rates for efficient operation.

Width: 3 mm

A compact width of 3 mm makes this EEPROM ideal for use in small devices and tight spaces.

Minimum Supply Voltage (Vsup): 1.8 V

The ability to operate at a minimum supply voltage of 1.8V allows for lower-power applications.

Length: 3 mm

This length contributes to the overall compact design, which is beneficial for portable and small form factor devices.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grade, this product ensures reliability in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption while maintaining high speed, suitable for battery-powered devices.

Parallel or Serial: SERIAL

Serial interface enables easier connections and fewer pins on the PCB, which is beneficial for compact devices.

Terminal Form: GULL WING

Gull wing terminals allow for easy soldering and good mechanical stability on PCBs.

Maximum Supply Current: 2 mA

Low supply current requirements make this EEPROM energy-efficient, prolonging battery life in portable applications.

No. of Words: 64 words

This memory capacity is suitable for a variety of applications requiring moderate data storage.

Memory Width: 16

A wider memory width of 16 bits allows for more data to be processed at once, enhancing performance.

Minimum Data Retention Time: 40 years

A long data retention time of 40 years ensures that the stored data remains intact for extended periods.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for compatibility with a range of PCB designs and assembly methods.

No. of Words Code: 64

Support for 64 words code gives flexibility for various applications requiring distinct identifiers or settings.

Maximum Supply Voltage (Vsup): 5.5 V

Operating up to a maximum voltage of 5.5V accommodates a range of power supply configurations.

Endurance: 1000000 Write/Erase Cycles

High endurance rating ensures reliability and longevity for applications requiring frequent updates to stored data.

Maximum Write Cycle Time (tWC): 10 ms

A quick write cycle time of 10 ms allows for efficient data updates, improving overall system responsiveness.

Memory Density: 1024 bit

With a density of 1024 bits, this EEPROM can store a useful amount of data in compact applications.

Memory IC Type: EEPROM

As an EEPROM, this IC allows for reprogrammability, making it ideal for applications needing frequent updates.

Maximum Standby Current: 0.000002 Amp

Ultra-low standby current of 2 µA helps to conserve battery life in portable or low-power applications.

Technical Specifications

EEPROM M93C46-RDS6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

SOFTWARE

Trade Compliance

M93C46-RDS6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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