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M93C46-MN6TP

STMicroelectronics

M93C46-MN6TP by STMicroelectronics

M93C46-MN6TP by STMicroelectronics is a 1024-bit EEPROM with a 5V supply, featuring a max clock frequency of 2 MHz and an endurance of 1M write/erase cycles. It operates in synchronous mode and is ideal for industrial applications requiring reliable data storage. Its compact SO8 package ensures efficient surface mounting in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,875 parts In-Stock

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Digiode

USA . 2,853 parts In-Stock

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PC Components Company LLC

USA . 2,309 parts In-Stock

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Bristol Electronics

USA . 2,249 parts In-Stock

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Anansix

USA . 1,776 parts In-Stock

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1,776

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IDEA Electronic Components Group

UK . 667 parts In-Stock

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$3.483

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-

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$3.135

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667

$3.483

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$3.135

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MKK Technologies

India . 757 parts In-Stock

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$6.550

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757

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DigiPath Technology Company

USA . 757 parts In-Stock

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$6.550

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757

$6.550

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AZTECH Wire

Italy . 450 parts In-Stock

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$17.950

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450

$17.950

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Component Stockers USA

USA . 245 parts In-Stock

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$99.990

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245

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 27,443 parts In-Stock

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Lixinc

USA . 12,408 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,150 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,433 parts In-Stock

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Microchip USA

USA . 3,218 parts In-Stock

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Metaverse IC Inc.

Canada . 2,088 parts In-Stock

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Kepictronics

USA . 1,977 parts In-Stock

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1,977

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Parana Technologies

USA . 1,826 parts In-Stock

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$4.165

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1,826

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$4.165

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Corphita

USA . 858 parts In-Stock

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858

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Overview

Unlock unparalleled performance with the M93C46-MN6TP EEPROM from STMicroelectronics, renowned for its cutting-edge technology and reliable manufacturing. This compact, high-quality memory solution is perfect for a wide range of applications, from consumer electronics to industrial systems. With superior write endurance and robust temperature tolerance, it ensures data integrity and longevity, empowering your designs with efficiency and dependability. Experience the difference with STMicroelectronics, where innovation meets quality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology facilitates easy integration into PCBs, allowing for high-density assembly and efficient manufacturing.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB and is compatible with a variety of designs.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances performance by minimizing latency and improving speed during data transactions.

Nominal Supply Voltage / Vsup: 5V

Standard 5V operation allows compatibility with most electronic systems, simplifying design considerations.

Power Supplies (V): 5

Using a single power supply simplifies the circuit design while ensuring reliable operation.

No. of Terminals: 8

The 8-terminal design provides sufficient connectivity while minimizing board space usage.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances space efficiency, making it ideal for compact electronic devices.

Alternate Memory Width: 8

An alternate memory width of 8 bits allows for flexible data handling in various applications.

Maximum Operating Temperature: 85 °C

High operating temperature tolerance makes it suitable for industrial applications that may experience heat variations.

Organization: 64X16

The 64X16 organization allows for efficient data storage and retrieval, making it versatile for different use cases.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliability in extreme environmental conditions, suitable for outdoor and industrial use.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish enhances corrosion resistance and improves the overall reliability of the connections.

Terminal Position: DUAL

Dual terminal position enables flexible mounting options, making it easier to incorporate into various designs.

Write Protection: SOFTWARE

Software-based write protection increases data integrity by preventing accidental overwrites.

Maximum Seated Height: 1.75 mm

Low profile minimizes space requirements while still delivering performance, ideal for compact designs.

Maximum Clock Frequency (fCLK): 2 MHz

Higher clock frequency enables faster data access and processing, improving overall performance.

Width: 3.9 mm

Narrow width allows for space-efficient layouts on PCBs, favoring designs where size is a critical consideration.

Minimum Supply Voltage (Vsup): 4.5V

Minimum supply voltage ensures low power consumption, which is beneficial for battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard soldering processes without damaging the IC.

Peak Reflow Temperature: 260 °C

Resilience to high peak temperatures ensures the EEPROM can endure modern soldering methods.

Length: 4.9 mm

Compact length reduces the overall footprint, enabling integration into smaller electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures performance reliability in harsh environments.

Technology: CMOS

CMOS technology provides low power consumption and high efficiency, extending battery life in portable applications.

Parallel or Serial: SERIAL

Serial communication simplifies connections, allowing for easier integration into various systems.

Terminal Form: GULL WING

Gull-wing terminals facilitate easy soldering and enhance mechanical stability on the PCB.

Maximum Supply Current: 1.5 mA

Low maximum supply current contributes to energy efficiency, making it suitable for battery-powered devices.

No. of Words: 64 words

Provides ample storage capacity for a variety of applications without excessive complexity.

Memory Width: 16

The 16-bit memory width allows for efficient handling of data in applications requiring larger data blocks.

Minimum Data Retention Time: 40 years

Long data retention time guarantees the reliability of stored data over extended periods.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows easy integration with other components and PCBs.

No. of Words Code: 64

Flexibility in word organization makes it suitable for various data storage requirements.

Maximum Supply Voltage (Vsup): 5.5V

Compatibility with a range of voltages facilitates integration into different power supply environments.

Endurance: 1000000 Write/Erase Cycles

High endurance ensures long-term usability, ideal for applications requiring frequent updates.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time enhances responsiveness, making it suitable for real-time applications.

Memory Density: 1024 bit

Adequate memory density allows for efficient data storage while keeping the chip size manageable.

Memory IC Type: EEPROM

EEPROM technology is versatile and reliable for non-volatile memory applications across many industries.

Maximum Standby Current: 0.00005 Amp

Extremely low standby current ensures minimal power usage when the chip is inactive, saving energy.

Technical Specifications

EEPROM M93C46-MN6TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.00005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

1.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

SOFTWARE

Trade Compliance

M93C46-MN6TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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