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M74HC257B1R

STMicroelectronics

M74HC257B1R by STMicroelectronics

STMicroelectronics M74HC257B1R is a 4-function, 2-input multiplexer with 30ns propagation delay at 4.5V supply. Operating b/w -55 to 125 °C, it has a max seated height of 5.1mm and supports a load capacitance of 50pF. Ideal for military-grade applications requiring CMOS technology in an inline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 4,320 parts In-Stock

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Anansix

USA . 2,464 parts In-Stock

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Digiode

USA . 872 parts In-Stock

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R&J Components

USA . 807 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 675 parts In-Stock

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Microchip USA

USA . 491 parts In-Stock

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$3.266

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AZTECH Wire

Italy . 523 parts In-Stock

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$11.040

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IDEA Electronic Components Group

UK . 1,888 parts In-Stock

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$22.987

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$20.688

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Ampacity Inc.

Singapore . 517 parts In-Stock

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$33.000

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MKK Technologies

India . 1,884 parts In-Stock

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$43.226

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DigiPath Technology Company

USA . 1,884 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,128 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,752 parts In-Stock

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Corphita

USA . 3,301 parts In-Stock

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Parana Technologies

USA . 1,606 parts In-Stock

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$27.485

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RC Electronics

USA . 943 parts In-Stock

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Perfect Parts

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Kepictronics

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Overview

Unleash the power of the M74HC257B1R from STMicroelectronics, a top-tier manufacturer known for delivering high-quality components. This versatile multiplexer & demultiplexer offers customers a reliable solution for their applications with its 4 functions, 2 inputs, and fast 30 ns propagation delay. Ideal for military-grade environments, this product boasts a wide operating temperature range of -55 °C to 125°C. With a compact rectangular package style and durable nickel palladium gold terminal finish, the M74HC257B1R provides exceptional value and performance that customers can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and less susceptible to damage during installation or transportation.

Propagation Delay At Nominal Supply: 30 ns

The low propagation delay ensures fast and efficient data transfer, making this multiplexer/demultiplexer a reliable choice for high-speed applications.

No. of Functions: 4

Having 4 functions in one device increases the efficiency of the circuit design, reducing the need for multiple components and simplifying the overall system.

No. of Inputs: 2

With 2 inputs, this multiplexer/demultiplexer can handle data from multiple sources, allowing for versatile data routing and selection capabilities.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures compatibility with a wide range of devices and power sources, making it versatile for different operating environments.

Output Characteristics: 3-STATE

The 3-STATE output allows for tristate logic operation, providing flexibility in controlling the output state and reducing power consumption when the outputs are not actively driving.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, making this multiplexer/demultiplexer efficient and versatile for various applications.

Temperature Grade: MILITARY

Being designed for military-grade applications, this multiplexer/demultiplexer is built to withstand harsh environmental conditions and ensure reliable performance in demanding scenarios.

Technical Specifications

Multiplexer & Demultiplexer M74HC257B1R attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

210 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

M74HC257B1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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