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M24LR64-RMB6T/2

STMicroelectronics

M24LR64-RMB6T/2 by STMicroelectronics

M24LR64-RMB6T/2 by STMicroelectronics is a compact EEPROM with a 65536-bit density, operating b/w 1.8V and 5.5V. It features I2C communication, a max clock frequency of 400kHz, and offers software write protection for reliable data storage. Ideal for industrial applications requiring robust memory solutions in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 22,420 parts In-Stock

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22,420

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Vyrian

USA . 6,857 parts In-Stock

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6,857

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Digiode

USA . 3,992 parts In-Stock

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3,992

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EMSNET

USA . 1,020 parts In-Stock

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1,020

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Anansix

USA . 735 parts In-Stock

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735

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,292 parts In-Stock

1+ parts

$3.081

100+ parts

-

1k+ parts

$2.773

10k+ parts

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1,292

$3.081

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$2.773

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MKK Technologies

India . 1,797 parts In-Stock

1+ parts

$5.794

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1,797

$5.794

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DigiPath Technology Company

USA . 1,797 parts In-Stock

1+ parts

$5.794

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1,797

$5.794

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AZTECH Wire

Italy . 1,012 parts In-Stock

1+ parts

$16.380

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1,012

$16.380

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RC Electronics

USA . 14,400 parts In-Stock

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14,400

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A-Z Elektronik GmbH

Germany . 4,785 parts In-Stock

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4,785

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Corphita

USA . 3,318 parts In-Stock

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3,318

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Alle Elektronik GmbH

Germany . 3,190 parts In-Stock

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Perfect Parts

USA . 1,142 parts In-Stock

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1,142

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Parana Technologies

USA . 959 parts In-Stock

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$3.684

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959

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$3.684

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Overview

Unlock unparalleled reliability and performance with the M24LR64-RMB6T/2 from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile EEPROM is perfect for a wide range of applications, including smart cards, industrial controls, and consumer electronics. With exceptional endurance and low power consumption, it ensures data integrity even in extreme conditions. Trust STMicroelectronics to deliver quality that propels your projects toward success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable construction ensures reliability in various environments.

Surface Mount: YES

Allows for compact design and easy integration into modern circuit boards.

Package Shape: RECTANGULAR

Optimized shape for space-efficient layouts.

Operating Mode: SYNCHRONOUS

Enables faster data transfer rates compared to asynchronous modes.

Nominal Supply Voltage / Vsup: 2.5 V

Provides a balance between power consumption and performance.

Power Supplies (V): 2/5

Flexible voltage range supports diverse application needs.

No. of Terminals: 8

Compact design with sufficient pins for functionality.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Designed for applications requiring space-saving solutions without compromising performance.

Alternate Memory Width: 8

Compatible with various data buses and enhances integration flexibility.

Maximum Operating Temperature: 85 °C

Suitable for high-temperature environments, making it robust for industrial applications.

Organization: 2KX32

Provides a structured way to organize the memory, facilitating efficient data management.

Minimum Operating Temperature: -40 °C

Ensures reliable operation in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Enhances connectivity and prevents corrosion for long-term reliability.

I2C Control Byte: 10100DDR

Standard I2C communication provides compatibility with a wide range of devices.

Terminal Position: DUAL

Facilitates easy mounting and enhances product layout versatility.

Write Protection: SOFTWARE

Allows flexible control over data integrity and security during write operations.

Maximum Seated Height: 0.6 mm

Low profile design is ideal for space-constrained applications.

Maximum Clock Frequency (fCLK): 0.4 MHz

Provides adequate speed for most memory access needs in various applications.

Width: 2 mm

Slim design aids in optimizing PCB space.

Minimum Supply Voltage (Vsup): 1.8 V

Lower voltage operation contributes to reduced power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

Manufacturing-friendly spec helps in assembly and soldering processes.

Peak Reflow Temperature °C: 260

High-temperature tolerance ensures reliability during manufacturing processes.

Length: 3 mm

Compact dimensions make it an excellent choice for space-sensitive designs.

Temperature Grade: INDUSTRIAL

Designed for robustness in industrial applications, ensuring long-term performance.

Technology: CMOS

Offers low power operation and high speed, ideal for battery-operated devices.

Parallel or Serial: SERIAL

Simplifies board design and reduces wiring complexity.

Terminal Form: NO LEAD

Environmentally friendly design and enhances performance in high-frequency applications.

Maximum Supply Current: 0.7 mA

Low current draw extends the lifespan of battery-powered devices.

No. of Words: 2048 words

Generous storage capacity allows for ample data storage in compact applications.

Memory Width: 32

Promotes efficient data handling and enhances device performance.

Minimum Data Retention Time: 40

Ensures data longevity, making it suitable for applications requiring reliable storage.

Terminal Pitch: 0.5 mm

Standard pitch facilitates compatibility with various PCB designs.

No. of Words Code: 2K

Sufficient memory for small to medium-sized applications and embedded systems.

Maximum Supply Voltage (Vsup): 5.5 V

Accommodates higher supply voltages for versatility in various applications.

Endurance: 1000000 Write/Erase Cycles

High endurance enhances reliability and lifespan, ideal for frequent data updates.

Serial Bus Type: I2C

Standardized interface simplifies integration with other devices in the system.

Maximum Write Cycle Time (tWC): 5 ms

Quick writing capability improves overall system responsiveness.

Memory Density: 65536 bit

High density offers substantial storage capacity in a small footprint.

Memory IC Type: EEPROM

Reliable non-volatile memory technology ensures data retention without power.

Maximum Standby Current: 0.00003 Amp

Minimal standby current extends battery life in portable applications.

Technical Specifications

EEPROM M24LR64-RMB6T/2 attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

10100DDR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

32

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.00003 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

.7 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

SOFTWARE

Trade Compliance

M24LR64-RMB6T/2 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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