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M24LR04E-RUW206T/2

STMicroelectronics

M24LR04E-RUW206T/2 by STMicroelectronics

M24LR04E-RUW206T/2 by STMicroelectronics is a 4096-bit EEPROM with I2C serial bus, operating at 2.5V to 5.5V. It features synchronous mode, 128x32 organization, and -40 °C to 85°C temperature range. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact unencased chip package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,680 parts In-Stock

1+ parts

-

100+ parts

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3,680

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Digiode

USA . 2,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,575

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-

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Anansix

USA . 259 parts In-Stock

1+ parts

-

100+ parts

-

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259

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,827 parts In-Stock

1+ parts

$2.648

100+ parts

-

1k+ parts

$2.383

10k+ parts

-

1,827

$2.648

-

$2.383

-

MKK Technologies

India . 966 parts In-Stock

1+ parts

$4.979

100+ parts

-

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-

10k+ parts

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966

$4.979

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DigiPath Technology Company

USA . 966 parts In-Stock

1+ parts

$4.979

100+ parts

-

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10k+ parts

-

966

$4.979

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-

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Corphita

USA . 4,943 parts In-Stock

1+ parts

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4,943

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-

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Parana Technologies

USA . 2,202 parts In-Stock

1+ parts

-

100+ parts

$3.166

1k+ parts

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10k+ parts

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2,202

-

$3.166

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Overview

Unlock the power of data storage with the M24LR04E-RUW206T/2 EEPROM by STMicroelectronics. As a trusted manufacturer in the industry, STMicroelectronics delivers high-quality products that guarantee reliability and performance. This versatile chip is ideal for a wide range of applications, offering seamless integration and efficient operation. With a focus on innovation and cutting-edge technology, this EEPROM provides customers with value, benefits, and advantages that set it apart from the competition. Experience the difference with the M24LR04E-RUW206T/2 and take your projects to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and secure attachment to a circuit board, making installation and integration simple and efficient.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise and coordinated data transfers, leading to efficient communication with other components in a system.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a lower supply voltage of 2.5V helps in reducing power consumption and heat dissipation, making the product energy-efficient.

Package Style (Meter): UNCASED CHIP

The unencased chip design allows for compact and space-saving integration into various electronic devices, ideal for applications where size constraints are a concern.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the EEPROM can withstand harsh environmental conditions, ensuring durability and reliability in various applications.

Organization: 128X32

The 128x32 organization provides a balance between memory density and access speed, offering sufficient storage capacity with efficient data retrieval for optimal performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, enhancing the overall efficiency and reliability of the EEPROM.

Serial Bus Type: I2C

The I2C serial bus type enables easy and straightforward communication with other devices, facilitating seamless data transfer and integration within a system.

Technical Specifications

EEPROM M24LR04E-RUW206T/2 attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

.4 MHz

JESD-30 Code:

X-XUUC-N

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X32

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

M24LR04E-RUW206T/2 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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