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M24LR64E-SB12I/2

STMicroelectronics

M24LR64E-SB12I/2 by STMicroelectronics

M24LR64E-SB12I/2 from STMicroelectronics is a CMOS EEPROM with a 2.5V nominal supply, operating in synchronous mode. It features a memory density of 64Kb and supports I2C serial communication. Ideal for industrial applications, it operates b/w -40 °C to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,663 parts In-Stock

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3,663

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Digiode

USA . 3,636 parts In-Stock

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3,636

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Anansix

USA . 1,594 parts In-Stock

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1,594

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 99 parts In-Stock

1+ parts

$4.741

100+ parts

-

1k+ parts

$4.267

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99

$4.741

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$4.267

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MKK Technologies

India . 7 parts In-Stock

1+ parts

$8.915

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7

$8.915

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DigiPath Technology Company

USA . 7 parts In-Stock

1+ parts

$8.915

100+ parts

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7

$8.915

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Corphita

USA . 4,200 parts In-Stock

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4,200

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Parana Technologies

USA . 1,928 parts In-Stock

1+ parts

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$5.668

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1,928

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$5.668

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Overview

Unlock the potential of your applications with the M24LR64E-SB12I/2 EEPROM from STMicroelectronics! Designed for reliability and performance, this cutting-edge memory solution operates seamlessly in diverse environments, from industrial to consumer electronics. With a robust temperature range and low power consumption, it ensures data integrity and longevity, offering you peace of mind. Experience superior quality and innovation backed by STMicroelectronics' excellence—where every byte counts!

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability enables compact designs and simplified PCB assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer rates, leading to better overall performance.

Nominal Supply Voltage: 2.5 V

Low nominal supply voltage contributes to reduced power consumption, ideal for battery-operated devices.

Package Style: UNCASED CHIP

Uncased chip form allows for flexible mounting options and integration in space-constrained environments.

Alternate Memory Width: 8

Provides versatility for various applications requiring different data widths.

Maximum Operating Temperature: 85 °C

Suitability for industrial environments, ensuring reliable performance under higher thermal conditions.

Organization: 2Kx32

The organized structure enhances access speed and efficiencies in data retrieval and storage.

Minimum Operating Temperature: -40 °C

Wide operational temperature range ensures functionality in extreme environmental conditions.

Terminal Position: UPPER

Upper terminal positioning facilitates easier access during assembly and maintenance operations.

Maximum Clock Frequency: 0.4 MHz

Moderate clock frequency helps maintain data integrity while ensuring stable operation.

Minimum Supply Voltage: 1.8 V

Support for low supply voltage broadens compatibility with modern low-power systems.

Temperature Grade: INDUSTRIAL

Industrial temperature rating makes it suitable for demanding applications and environments.

Technology: CMOS

CMOS technology provides high reliability and low static power consumption.

Parallel or Serial: SERIAL

Serial communication is beneficial for reducing pin count and supporting compact layouts.

Terminal Form: NO LEAD

No lead design reduces the risk of contamination and enhances reliability in harsh environments.

No. of Words: 2048 words

Adequate capacity for a variety of data storage needs, making it suitable for numerous applications.

Memory Width: 32

Larger memory width allows for more data to be processed simultaneously, boosting efficiency.

No. of Words Code: 2K

Provides ample coding space for diverse memory needs in various electronic applications.

Maximum Supply Voltage: 5.5 V

The ability to handle higher supply voltages enhances compatibility with a broader range of devices.

Serial Bus Type: I2C

I2C interface enables easy integration with microcontrollers and establishes a well-supported communication standard.

Maximum Write Cycle Time: 5 ms

Quick write cycles improve performance in applications requiring frequent data updates.

Memory Density: 65536 bit

Sufficient memory density for advanced applications, supporting extensive data storage requirements.

Memory IC Type: EEPROM

EEPROM technology provides the ability to retain data even when power is removed, ensuring data permanence.

Technical Specifications

EEPROM M24LR64E-SB12I/2 attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

.4 MHz

JESD-30 Code:

X-XUUC-N

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX32

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

M24LR64E-SB12I/2 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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