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M24LR16E-RUW20/2

STMicroelectronics

M24LR16E-RUW20/2 by STMicroelectronics

M24LR16E-RUW20/2 by STMicroelectronics is a 16384-bit EEPROM with 512x32 organization, operating at a max clock frequency of 0.4 MHz via I2C serial bus. It has an industrial temperature grade range from -40 °C to 85°C and synchronous operation mode, suitable for various applications requiring non-volatile memory storage in surface-mount configurations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,595 parts In-Stock

1+ parts

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3,595

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Vyrian

USA . 3,272 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,272

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Anansix

USA . 574 parts In-Stock

1+ parts

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100+ parts

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574

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 654 parts In-Stock

1+ parts

$3.994

100+ parts

-

1k+ parts

$3.594

10k+ parts

-

654

$3.994

-

$3.594

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MKK Technologies

India . 2,351 parts In-Stock

1+ parts

$7.510

100+ parts

-

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10k+ parts

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2,351

$7.510

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DigiPath Technology Company

USA . 2,351 parts In-Stock

1+ parts

$7.510

100+ parts

-

1k+ parts

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10k+ parts

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2,351

$7.510

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Corphita

USA . 3,960 parts In-Stock

1+ parts

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3,960

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Parana Technologies

USA . 1,743 parts In-Stock

1+ parts

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100+ parts

$4.775

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1,743

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$4.775

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Overview

Unlock endless possibilities with the M24LR16E-RUW20/2 by STMicroelectronics, a high-quality EEPROM chip designed to provide reliable and efficient data storage solutions. Manufactured by industry leader, STMicroelectronics, this surface mount chip offers synchronous operation, making it ideal for a wide range of applications in industrial settings. With a nominal supply voltage of 2.5V and an operating temperature range of -40 °C to 85°C, this versatile chip boasts a memory density of 16384 bits and a maximum clock frequency of 0.4 MHz. Experience seamless performance and unparalleled value with the M24LR16E-RUW20/2 – the perfect choice for your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and compact installation onto PCBs, making it a convenient choice for small electronic devices with limited space.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and data transfer, making this EEPROM suitable for applications where timing accuracy is crucial.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a low nominal supply voltage of 2.5V helps in reducing power consumption and heat generation, making it energy-efficient and suitable for battery-powered devices.

Package Style (Meter): UNCASED CHIP

The uncased chip package style offers flexibility in mounting options and allows for customized enclosures, making it a versatile choice for various design requirements.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this EEPROM can withstand harsh environmental conditions, making it ideal for industrial applications that require reliable performance under extreme temperatures.

Organization: 512X32

The 512x32 organization provides a high memory capacity with efficient data storage and retrieval, making it suitable for applications that require storing a large amount of data.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable operation even in cold environments, making this EEPROM suitable for a wide range of temperature conditions.

Terminal Position: UPPER

The upper terminal position allows for easy connection and integration into existing circuits, simplifying the installation process and enhancing overall usability.

Maximum Clock Frequency (fCLK): 0.4 MHz

The maximum clock frequency of 0.4 MHz enables fast data transfer and read/write operations, making this EEPROM efficient for applications that require high-speed data processing.

Minimum Supply Voltage (Vsup): 1.8 V

Operating at a minimum supply voltage of 1.8V ensures compatibility with a wide range of power sources, making this EEPROM versatile and suitable for diverse electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification ensures reliable performance in demanding industrial environments, making this EEPROM a robust and trustworthy choice for industrial applications.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and reliable operation, making this EEPROM energy-efficient and suitable for various electronic devices.

Parallel or Serial: SERIAL

The serial interface allows for simplified data transfer and communication with other devices, making this EEPROM easy to integrate into serial bus systems and control networks.

Terminal Form: NO LEAD

The no-lead terminal form ensures reliable electrical connections and soldering during installation, making this EEPROM durable and suitable for long-term use.

No. of Words: 512 words

With a capacity of 512 words, this EEPROM provides ample storage space for data storage and retrieval, making it suitable for applications that require significant memory capacity.

Memory Width: 32

With a memory width of 32 bits, this EEPROM offers efficient data handling and processing capabilities, making it suitable for applications that require data precision and accuracy.

No. of Words Code: 512

The 512 words code allows for versatile programming and data storage options, making this EEPROM adaptable to various data storage and retrieval requirements.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this EEPROM can handle higher power requirements and voltage fluctuations, making it suitable for applications with varying power input levels.

Serial Bus Type: I2C

The I2C serial bus type offers easy integration with other devices and components, making this EEPROM compatible with a wide range of I2C-based systems and applications.

Maximum Write Cycle Time (tWC): 5 ms

The maximum write cycle time of 5ms ensures fast data writing and programming speed, making this EEPROM efficient for applications that require quick data updates and modifications.

Memory Density: 16384 bit

With a memory density of 16384 bits, this EEPROM provides high data storage capacity in a compact form factor, making it suitable for applications that require efficient use of memory space.

Memory IC Type: EEPROM

Being an EEPROM memory IC type, this product offers non-volatile memory storage with fast read/write access, making it reliable and suitable for data storage applications that require persistent data retention.

Technical Specifications

EEPROM M24LR16E-RUW20/2 attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

JESD-30 Code:

X-XUUC-N

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X32

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

M24LR16E-RUW20/2 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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