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M24128-BWDW6T

STMicroelectronics

M24128-BWDW6T by STMicroelectronics

M24128-BWDW6T by STMicroelectronics is a 16Kx8 EEPROM with a synchronous operating mode and I2C interface. It features a wide supply voltage range (2.5V-5.5V), operates in -40 °C to 85°C, and supports 1M write/erase cycles, ideal for industrial applications. Its compact SOIC package ensures efficient space utilization in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,720 parts In-Stock

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5,720

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Digiode

USA . 4,030 parts In-Stock

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4,030

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Anansix

USA . 763 parts In-Stock

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763

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Sogenti Electronics

Canada . 75 parts In-Stock

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75

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,306 parts In-Stock

1+ parts

$3.558

100+ parts

-

1k+ parts

$3.202

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2,306

$3.558

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$3.202

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MKK Technologies

India . 1,967 parts In-Stock

1+ parts

$6.690

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1,967

$6.690

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DigiPath Technology Company

USA . 1,967 parts In-Stock

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$6.690

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1,967

$6.690

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AZTECH Wire

Italy . 576 parts In-Stock

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$10.550

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576

$10.550

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Microchip USA

USA . 298 parts In-Stock

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$10.570

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298

$10.570

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A-Z Elektronik GmbH

Germany . 4,614 parts In-Stock

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4,614

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Kepictronics

USA . 4,000 parts In-Stock

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4,000

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Alle Elektronik GmbH

Germany . 3,076 parts In-Stock

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3,076

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Corphita

USA . 1,297 parts In-Stock

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1,297

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Parana Technologies

USA . 609 parts In-Stock

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$4.254

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609

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$4.254

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Overview

Unlock the potential of your designs with the M24128-BWDW6T EEPROM from STMicroelectronics, a leader in innovation and quality. This compact, reliable memory solution excels in environments demanding durability and efficiency, boasting an impressive endurance for write/erase cycles. Perfect for automotive, industrial, and consumer applications, it ensures seamless data retention and minimal power consumption, empowering your projects with unparalleled performance and peace of mind. Choose STMicroelectronics for excellence that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures protection against environmental factors and provides structural integrity.

Surface Mount: YES

Surface mount technology allows for compact PCB designs and improved assembly efficiency, making it ideal for modern electronic applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, making it suitable for high-density applications.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures faster access times and improved data transfer efficiency compared to asynchronous modes.

Nominal Supply Voltage / Vsup: 5 V

A nominal supply voltage of 5 V provides compatibility with a wide range of standard electronic systems.

Power Supplies (V): 3/5

Flexibility in operating voltage allows for use in both low and standard voltage applications.

No. of Terminals: 8

Eight terminals provide sufficient connectivity for various functions while maintaining a compact design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and shrink pitch package style allow for space-efficient designs, ideal for portable devices.

Maximum Operating Temperature: 85 °C

Operation up to 85 °C makes this EEPROM suitable for industrial applications that require higher temperature resilience.

Organization: 16KX8

The 16Kx8 organization allows for efficient data storage and retrieval, catering to varied application needs.

Minimum Operating Temperature: -40 °C

A wide temperature range, extending down to -40 °C, ensures reliable operation in extreme environments.

Terminal Finish: TIN LEAD

A tin-lead finish enhances solderability and long-term reliability in electronic assemblies.

I2C Control Byte: 1010DDDR

The I2C control byte specification ensures seamless integration with I2C-compatible devices for simple interfacing.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in PCB design and component placement.

Write Protection: HARDWARE

Hardware write protection enhances data security by preventing accidental writes during critical operations.

Maximum Seated Height: 1.2 mm

A low seated height allows for low-profile designs, making it suitable for compact electronic devices.

Maximum Clock Frequency (fCLK): 0.4 MHz

A maximum clock frequency of 0.4 MHz is adequate for many applications, ensuring reliable operation.

Width: 3 mm

The compact width contributes to space-saving designs, especially within space-constrained projects.

Minimum Supply Voltage (Vsup): 2.5 V

Operating at a minimum supply voltage of 2.5 V allows for energy-efficient designs in battery-operated devices.

Length: 4.4 mm

The short length facilitates more compact circuit layouts while optimizing board space.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this EEPROM is designed for enhanced reliability in demanding applications.

Technology: CMOS

CMOS technology ensures lower power consumption, enhancing the energy efficiency of electronic systems.

Parallel or Serial: SERIAL

Serial communication simplifies data transfer compared to parallel interfaces, reducing pin count and increasing reliability.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and ease of assembly for surface-mount applications.

Maximum Supply Current: 5 mA

A maximum supply current of 5 mA ensures low power consumption, thereby extending battery life in portable devices.

No. of Words: 16384 words

With 16,384 words of storage, this EEPROM offers substantial capacity for data storage requirements.

Memory Width: 8

An 8-bit memory width provides flexibility in data handling, suitable for various data types.

Minimum Data Retention Time: 40 years

Long data retention ensures that critical information remains intact even during prolonged power outages.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch is ideal for modern PCB designs, ensuring high density without sacrificing reliability.

No. of Words Code: 16K

A 16K word configuration supports a variety of storage needs in different applications.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to withstand up to 5.5 V makes this EEPROM versatile for different voltage applications.

Endurance: 1000000 Write/Erase Cycles

With an endurance of 1,000,000 cycles, it is well-suited for applications that require frequent data updates.

Serial Bus Type: I2C

I2C serial bus type enhances the device’s compatibility with a wide range of microcontrollers and sensors.

Maximum Write Cycle Time (tWC): 5 ms

A maximum write cycle time of 5 ms allows for efficient data updates in time-sensitive applications.

Memory Density: 131072 bit

The memory density of 131072 bits provides ample storage for applications needing substantial data capacity.

Memory IC Type: EEPROM

As an EEPROM type, it combines non-volatility with the ability to be rewritten, making it highly versatile.

Maximum Standby Current: 0.000005 Amp

Extremely low standby current minimizes power consumption, making it ideal for energy-sensitive applications.

Technical Specifications

EEPROM M24128-BWDW6T attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.4 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24128-BWDW6T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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