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LD3986J29R-E

STMicroelectronics

LD3986J29R-E by STMicroelectronics

LD3986J29R-E by STMicroelectronics is a fixed positive multiple output LDO regulator with a max dropout voltage of 0.1V and operates b/w -40 °C to 125°C. It features two outputs, each providing 2.9V at up to 150mA. Ideal for compact electronic applications requiring stable voltage regulation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,917 parts In-Stock

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4,917

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Vyrian

USA . 3,649 parts In-Stock

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3,649

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Anansix

USA . 2,782 parts In-Stock

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2,782

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 519 parts In-Stock

1+ parts

$5.504

100+ parts

-

1k+ parts

$4.954

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519

$5.504

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$4.954

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MKK Technologies

India . 2,337 parts In-Stock

1+ parts

$10.351

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2,337

$10.351

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DigiPath Technology Company

USA . 2,337 parts In-Stock

1+ parts

$10.351

100+ parts

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2,337

$10.351

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Corphita

USA . 2,619 parts In-Stock

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2,619

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Parana Technologies

USA . 1,615 parts In-Stock

1+ parts

-

100+ parts

$6.581

1k+ parts

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10k+ parts

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1,615

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$6.581

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Overview

Elevate your designs with the LD3986J29R-E from STMicroelectronics—a pinnacle of reliability and efficiency in fixed positive multiple output LDO regulators. Crafted with precision and backed by ST's exceptional quality, this versatile component ensures stable power delivery across various applications—from consumer electronics to industrial systems. Experience unmatched performance, minimal dropout voltage, and resilience in extreme temperatures, empowering you to innovate without limits!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and electrical insulation, making the product reliable for various applications.

Maximum Dropout Voltage-2: 1.1 V

With a relatively low dropout voltage, this regulator offers better efficiency in power management, especially when operating with minimal input-output voltage difference.

Maximum Dropout Voltage-1: 1.1 V

A low dropout voltage enhances operational efficiency, allowing the regulator to maintain its output voltage effectively under varying load conditions.

Surface Mount: YES

Surface mounting enables compact design and ease of integration into modern circuit boards.

Operating Temperature (TJ-Max): 125 °C

High maximum operating temperature indicates suitability for demanding environments, ensuring reliability in a wide range of applications.

Minimum Output Voltage-2: 2.813 V

The specified minimum output voltage ensures the regulator can meet the low voltage requirements for sensitive electronic devices.

Technology: BICMOS

BICMOS technology combines the benefits of Bipolar and CMOS transistors, resulting in high performance with low power consumption.

Nominal Output Voltage-2: 2.9 V

The nominal output voltage is tailored to meet the demands of a variety of electronic components, ensuring compatibility.

Package Shape: SQUARE

A square package shape optimizes space utilization on PCBs and contributes to a stable mounting.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and enhances the mechanical strength of connections.

Operating Temperature (TJ-Min): -40 °C

The wide operating temperature range allows this regulator to function effectively in extreme environmental conditions.

Packing Method: TR

The Tape and Reel (TR) packing method simplifies handling and automates placement in assembly lines.

Minimum Output Voltage-1: 2.813 V

This specification indicates the lowest achievable stable output voltage, which is crucial for low-voltage applications.

Maximum Voltage Tolerance: 3 %

A maximum voltage tolerance of 3% ensures that the output remains within acceptable limits, contributing to system stability.

Nominal Output Voltage-1: 2.9 V

A nominal output voltage of 2.9 V signifies stability and reliability during operation for compatible electronic devices.

No. of Terminals: 8

With 8 terminals, this regulator provides versatile connections to integrate effectively into various circuit designs.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style is advantageous for modern electronics where space-saving and high-density circuit layouts are essential.

Adjustability: FIXED

Fixed adjustability simplifies design and implementation, ensuring consistent output voltage without the need for additional components.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for higher density mounting on PCBs, maximizing available space.

Maximum Line Regulation: 0.0097 %

Exceptional line regulation ensures that output voltage remains remarkably stable with fluctuations in input voltage.

Regulator Type: FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

As a fixed positive multiple output LDO, this regulator delivers stable voltages to multiple outputs, enhancing power management capability.

Terminal Position: BOTTOM

Bottom terminal positioning aids in efficient heat dissipation and allows for a compact layout in PCB designs.

Maximum Seated Height: 0.715 mm

The low seated height contributes to a thinner profile in assembled devices, which is critical for portable applications.

Width: 1.57 mm

A narrow width enables high-density placement on PCBs, making this product ideal for space-constrained applications.

Maximum Load Regulation: 0.0432 %

Excellent load regulation ensures the output voltage remains steady under varying output current loads, maintaining performance.

Maximum Output Voltage-1: 2.987 V

This specification allows the product to serve devices requiring close to 3V operation, depicting a useful range.

Maximum Output Voltage-2: 2.987 V

An equivalent maximum output voltage for both outputs improves system design by providing consistent voltage levels.

Minimum Input Voltage: 2.5 V

The minimum input voltage ensures compatibility with a variety of power sources while maintaining operation.

Maximum Input Voltage: 6 V

The ability to accommodate input voltages up to 6V gives designers flexibility in power supply options.

Maximum Input Voltage Absolute: 6 V

This absolute limit provides assurance regarding the safe operating conditions, reducing the risk of damage.

Maximum Output Current-1: 0.15 A

The capability of delivering 150 mA output current supports a wide range of applications, from consumer electronics to specialized devices.

No. of Outputs: 2

Having two outputs enhances functionality in applications requiring multiple voltage levels from a single component.

Nominal Dropout Voltage-1: 0.05 V

An extremely low nominal dropout voltage ensures high efficiency, especially in battery-operated devices.

Length: 1.57 mm

A short length contributes to a compact footprint, facilitating high-density designs.

Maximum Output Current-2: 0.15 A

This further confirms the regulator's ability to serve multiple loads effectively while maintaining regulated output.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LD3986J29R-E attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.1 V

Nominal Dropout Voltage-1:

.05 V

Maximum Dropout Voltage-2:

.1 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

S-PBGA-B8

Length:

1.57 mm

Maximum Line Regulation:

.0097 %

Maximum Load Regulation:

.0432 %

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

2.987 V

Minimum Output Voltage-1:

2.813 V

Nominal Output Voltage-1:

2.9 V

Maximum Output Voltage-2:

2.987 V

Minimum Output Voltage-2:

2.813 V

Nominal Output Voltage-2:

2.9 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,3X3,20

Package Shape:

SQUARE

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification Status:

Not Qualified

Maximum Seated Height:

.715 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

3 %

Width:

1.57 mm

Trade Compliance

LD3986J29R-E Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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