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LP3996SDX-3333/NOPB

Texas Instruments

LP3996SDX-3333/NOPB by Texas Instruments

LP3996SDX-3333/NOPB by Texas Instruments is a Fixed Positive Multiple Output LDO Regulator with 3.3V nominal output voltage, 0.22V max dropout voltage, and 0.15A max output current. Ideal for applications requiring precise voltage regulation in compact spaces with dual terminals and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,693 parts In-Stock

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Anansix

USA . 2,199 parts In-Stock

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Vyrian

USA . 2,035 parts In-Stock

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2,035

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Distributors (Availability)

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Parana Technologies

USA . 319 parts In-Stock

1+ parts

$5.366

100+ parts

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$6.040

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319

$5.366

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$6.040

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ChromeModa Solutions

Germany . 3,955 parts In-Stock

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$6.029

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$4.944

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$6.029

$4.944

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IDEA Electronic Components Group

UK . 4 parts In-Stock

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$6.029

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$5.426

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4

$6.029

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One Stop Electronics

USA . 609 parts In-Stock

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$11.500

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609

$11.500

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AZTECH Wire

Italy . 518 parts In-Stock

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$14.106

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518

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QUARKTWIN TECHNOLOGY LTD

USA . 3,946 parts In-Stock

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Microchip USA

USA . 3,865 parts In-Stock

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Corphita

USA . 2,995 parts In-Stock

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DigiPath Technology Company

USA . 30 parts In-Stock

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$5.436

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$5.436

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Overview

Upgrade your electronic devices with the LP3996SDX-3333/NOPB by Texas Instruments. With a focus on quality and reliability, Texas Instruments is a trusted manufacturer in the industry. This Fixed Regulator - Positive Multiple Output LDO offers superior performance and efficiency, making it ideal for a variety of applications. Experience the value and benefits that this product brings to your projects, ensuring consistent power delivery and optimal functionality. Trust Texas Instruments to deliver the innovation you need for success.

Feature Benefit Bullets

Maximum Dropout Voltage-1: 2.55 V

With a high maximum dropout voltage, this regulator can maintain a stable output voltage even when the input voltage decreases significantly, ensuring reliable performance.

Surface Mount: YES

The surface mount capability makes installation and integration easier, reducing assembly time and potential errors.

Operating Temperature (TJ-Max): 125 °C

With a high operating temperature limit, this regulator can operate efficiently in harsh environments without overheating.

Nominal Output Voltage-2: 3.3 V

The fixed nominal output voltage of 3.3V is a commonly used voltage level, making this regulator suitable for a wide range of applications.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The compact and efficient package style allows for space-saving integration while also providing effective heat dissipation.

Maximum Output Current-2: 0.3 A

With a high maximum output current, this regulator can power multiple loads simultaneously without overheating or voltage drops.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LP3996SDX-3333/NOPB attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.22 V

Nominal Dropout Voltage-1:

.21 V

Maximum Dropout Voltage-2:

.55 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2 V

JESD-30 Code:

S-XDSO-N10

JESD-609 Code:

e3

Length:

3 mm

Maximum Line Regulation:

.0168 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

10

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.3 A

Maximum Output Voltage-1:

3.423 V

Minimum Output Voltage-1:

3.176 V

Nominal Output Voltage-1:

3.3 V

Maximum Output Voltage-2:

3.423 V

Minimum Output Voltage-2:

3.176 V

Nominal Output Voltage-2:

3.3 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC10,.11,20

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

3 mm

Trade Compliance

LP3996SDX-3333/NOPB Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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