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LD3986J122R-E

STMicroelectronics

LD3986J122R-E by STMicroelectronics

LD3986J122R-E by STMicroelectronics is a fixed positive multiple output LDO regulator with a max dropout voltage of 0.1V and operates b/w -40 °C to 125°C. It features two outputs, each providing 1.22V at up to 150mA. Ideal for compact electronic applications requiring stable voltage regulation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,214 parts In-Stock

1+ parts

-

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2,214

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Vyrian

USA . 2,128 parts In-Stock

1+ parts

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1k+ parts

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2,128

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Digiode

USA . 1,748 parts In-Stock

1+ parts

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1,748

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,216 parts In-Stock

1+ parts

$6.795

100+ parts

-

1k+ parts

$6.116

10k+ parts

-

1,216

$6.795

-

$6.116

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MKK Technologies

India . 520 parts In-Stock

1+ parts

$12.778

100+ parts

-

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10k+ parts

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520

$12.778

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DigiPath Technology Company

USA . 520 parts In-Stock

1+ parts

$12.778

100+ parts

-

1k+ parts

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10k+ parts

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520

$12.778

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Corphita

USA . 2,310 parts In-Stock

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2,310

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Parana Technologies

USA . 560 parts In-Stock

1+ parts

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100+ parts

$8.125

1k+ parts

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560

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$8.125

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Overview

Elevate your designs with the LD3986J122R-E from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. This compact LDO regulator delivers stable, efficient power across multiple outputs, ensuring optimal performance even in demanding environments. With exceptional temperature resilience and minimal dropout voltage, it’s perfect for applications ranging from consumer electronics to industrial systems. Experience reliability and innovation that enhance your products' performance and longevity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components, ensuring long-term reliability.

Maximum Dropout Voltage-2: 1.1 V

A low maximum dropout voltage allows for efficient operation and better performance under varying load conditions.

Maximum Dropout Voltage-1: 1.1 V

Similar to the previous specification, it facilitates low voltage variations, enhancing device stability.

Surface Mount: YES

Surface mount technology enables efficient, compact designs and automated assembly, saving space on PCBs.

Operating Temperature (TJ-Max): 125 °C

High maximum operating temperature ensures reliability in demanding environments without compromising performance.

Minimum Output Voltage-2: 1.1834 V

Provides flexibility in output voltage configurations, catering to diverse applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS transistors, enhancing performance and efficiency.

Nominal Output Voltage-2: 1.22 V

Stable nominal output voltage ensures consistent power delivery for sensitive electronic components.

Package Shape: SQUARE

The square shape offers convenient placement on PCBs and aids in efficient heat dissipation.

Terminal Form: BALL

Ball terminals facilitate better soldering and stable connections, improving overall reliability.

Operating Temperature (TJ-Min): -40 °C

Wide operating temperature range guarantees functionality in harsh environments, increasing versatility.

Packing Method: TR

Tape and reel packing simplifies bulk handling and assembly, streamlining production processes.

Minimum Output Voltage-1: 1.1834 V

Low minimum output voltage enables compatibility with low-power devices.

Maximum Voltage Tolerance: 3 %

A generous voltage tolerance ensures stable performance under varying input conditions, protecting sensitive components.

Nominal Output Voltage-1: 1.22 V

Consistent nominal output voltage supports the reliable function of electronics within specified parameters.

No. of Terminals: 8

An 8-terminal design provides adequate connections for dual outputs, enhancing circuit configurations.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The thin profile and fine pitch allow for high-density layouts, maximizing PCB space efficiency.

Adjustability: FIXED

Fixed output voltage simplifies design requirements, ensuring ease of integration into pre-defined applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch supports compact designs, which is essential in modern electronics.

Maximum Line Regulation: 0.0067 %

Excellent line regulation minimizes output voltage variation in response to changes in input voltage, enhancing reliability.

Regulator Type: FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

Being a fixed positive multiple output LDO offers versatile power options, accommodating multiple components efficiently.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient heat dissipation and compact layout on the PCB.

Maximum Seated Height: 0.715 mm

A low seated height is advantageous for thin profile applications, ensuring compatibility with slim designs.

Width: 1.57 mm

Narrow width aids in flexibility for placement within tight PCB spaces.

Maximum Load Regulation: 0.0182 %

Strong load regulation ensures stable performance regardless of load variations, critical for sensitive circuits.

Maximum Output Voltage-1: 1.2566 V

The high maximum output voltage capability supports various electronic loads effectively.

Minimum Input Voltage: 2.5 V

A minimum input voltage of 2.5 V offers compatibility with a range of power supplies, enhancing application versatility.

Maximum Output Current-1: 0.15 A

Supports sufficient current output for power-hungry applications, making it suitable for various uses.

No. of Outputs: 2

Two outputs provide greater flexibility for circuit designs needing multiple voltage levels.

Nominal Dropout Voltage-1: 0.05 V

This low nominal dropout voltage ensures efficient operation, allowing the regulator to function effectively even with minimal input voltage overhead.

Length: 1.57 mm

A compact length assists in efficient space utilization on modern printed circuit boards.

Maximum Input Voltage: 6 V

A maximum input voltage of 6 V permits usage across a broad range of power supplies, increasing design flexibility.

Maximum Input Voltage Absolute: 6 V

Ensures safe operation within input voltage specifications, preventing damage to the device.

Maximum Output Current-2: 0.15 A

Like the first output, the second output also supports 0.15 A, ensuring ample current for connected devices.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LD3986J122R-E attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.1 V

Nominal Dropout Voltage-1:

.05 V

Maximum Dropout Voltage-2:

.1 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

S-PBGA-B8

Length:

1.57 mm

Maximum Line Regulation:

.0067 %

Maximum Load Regulation:

.0182 %

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

1.2566 V

Minimum Output Voltage-1:

1.1834 V

Nominal Output Voltage-1:

1.22 V

Maximum Output Voltage-2:

1.2566 V

Minimum Output Voltage-2:

1.1834 V

Nominal Output Voltage-2:

1.22 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,3X3,20

Package Shape:

SQUARE

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification Status:

Not Qualified

Maximum Seated Height:

.715 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

3 %

Width:

1.57 mm

Trade Compliance

LD3986J122R-E Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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