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LD3986J3333R

STMicroelectronics

LD3986J3333R by STMicroelectronics

LD3986J3333R from STMicroelectronics is a fixed positive multiple output LDO regulator with a nominal output voltage of 3.3 V and a max dropout voltage of just 0.1 V. It operates in temperatures from -40 °C to 125 °C, making it ideal for various applications. With its compact design and high efficiency, it's perfect for space-constrained electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,456 parts In-Stock

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4,456

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Vyrian

USA . 3,877 parts In-Stock

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3,877

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Anansix

USA . 385 parts In-Stock

1+ parts

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385

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 14 parts In-Stock

1+ parts

$6.638

100+ parts

-

1k+ parts

$5.974

10k+ parts

-

14

$6.638

-

$5.974

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MKK Technologies

India . 1,113 parts In-Stock

1+ parts

$12.482

100+ parts

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10k+ parts

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1,113

$12.482

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DigiPath Technology Company

USA . 1,113 parts In-Stock

1+ parts

$12.482

100+ parts

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1,113

$12.482

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Corphita

USA . 3,892 parts In-Stock

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3,892

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Parana Technologies

USA . 1,216 parts In-Stock

1+ parts

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100+ parts

$7.936

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1,216

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$7.936

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Overview

Elevate your designs with the LD3986J3333R from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality LDO regulator offers exceptional performance and reliability, ensuring stable power across multiple outputs. With its compact design and impressive thermal range, it's perfect for a variety of applications—from consumer electronics to industrial systems. Trust in STMicroelectronics’ expertise for unmatched value, efficiency, and longevity in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and reliability in various environmental conditions.

Maximum Dropout Voltage-2: 1 V

A low dropout voltage allows for efficient operation and maximizes output voltage under varying input conditions.

Maximum Dropout Voltage-1: 1 V

Similar to the above, this value helps to maintain the output voltage even when the input voltage is close to the required output voltage, enhancing performance.

Surface Mount: YES

Surface mount technology enables compact designs and simplifies the assembly process in manufacturing.

Operating Temperature (TJ-Max): 125 °C

A high maximum operating temperature indicates reliability in high-temperature environments, suitable for various applications.

Minimum Output Voltage-2: 3.201 V

This output voltage specification ensures compatibility with a range of electronic devices that require specific voltage levels.

Technology: BICMOS

BICMOS technology combines CMOS and bipolar technologies, optimizing power and performance suitable for low-power applications.

Nominal Output Voltage-2: 3.3 V

The standard output voltage is commonly used in electronics, making it versatile for many devices.

Package Shape: SQUARE

The square shape allows for efficient use of space in compact circuit designs.

Terminal Form: BALL

Ball terminal form contributes to enhanced soldering and thermal performance, ensuring reliable connections.

Operating Temperature (TJ-Min): -40 °C

This low minimum operating temperature expands the product's usability in harsh cold environments.

Packing Method: TR

Through-hole packaging method aids in easier incorporation into various circuit designs.

Minimum Output Voltage-1: 3.201 V

Similar to Output Voltage-2, this ensures compatibility with devices requiring specific voltage inputs.

Maximum Voltage Tolerance: 3 %

A tight voltage tolerance enhances the stability and performance of power distribution circuits.

Nominal Output Voltage-1: 3.3 V

Widely used in electronic devices, providing a reliable power supply for various components.

No. of Terminals: 8

An adequate number of terminals facilitates multiple connections, enhancing circuit functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style is ideal for high-density applications, providing a space-efficient solution.

Adjustability: FIXED

Fixed output voltage simplifies the design process as it eliminates the need for additional external components.

Terminal Pitch: 0.5 mm

Narrow terminal pitch supports finer spacing in compact designs, making it suitable for modern applications.

Maximum Line Regulation: 0.0093 %

Excellent line regulation ensures minimal variation in output voltage, contributing to stable performance.

Regulator Type: FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

Designed to provide fixed multiple outputs, making it versatile for distributing power to multiple components.

Terminal Position: BOTTOM

Bottom terminal positioning allows for a compact layout, facilitating easier integration into printed circuit boards.

Maximum Output Voltage-1: 3.399 V

This output capability ensures sufficient voltage supply for various devices, maintaining operational efficiency.

Maximum Seated Height: 0.715 mm

Low seated height allows for low-profile designs, which is crucial in space-constrained applications.

Width: 1.57 mm

Compact width suits miniaturized electronics, making it ideal for portable devices.

Maximum Input Voltage: 6 V

High input voltage range allows for flexibility in various power supply applications.

Maximum Input Voltage Absolute: 6 V

Ensures maximum input voltage alignment with operational requirements for device safety.

Minimum Input Voltage: 2.5 V

A low minimum input voltage specification increases application versatility, accommodating a broader range of power supplies.

Maximum Output Current-1: 0.15 A

With the ability to provide sufficient current, this regulator is suitable for low to moderate power applications.

No. of Outputs: 2

Having multiple outputs enhances the capability to power multiple components simultaneously.

Nominal Dropout Voltage-1: 0.05 V

Very low dropout voltage enhances efficiency, particularly in battery-powered applications.

Length: 1.57 mm

This compact length is suitable for designs where space is at a premium.

Maximum Output Voltage-2: 3.399 V

Provides adequate voltage for components, ensuring reliable operation within a specified voltage range.

Maximum Load Regulation: 0.04917 %

Excellent load regulation minimizes fluctuations in output voltage with varying load conditions, enhancing performance.

Maximum Output Current-2: 0.15 A

Capable of delivering enough current for two outputs, enhancing its effectiveness in powering multiple components.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LD3986J3333R attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.1 V

Nominal Dropout Voltage-1:

.05 V

Maximum Dropout Voltage-2:

.1 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

S-PBGA-B8

Length:

1.57 mm

Maximum Line Regulation:

.0093 %

Maximum Load Regulation:

.04917 %

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

3.399 V

Minimum Output Voltage-1:

3.201 V

Nominal Output Voltage-1:

3.3 V

Maximum Output Voltage-2:

3.399 V

Minimum Output Voltage-2:

3.201 V

Nominal Output Voltage-2:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,3X3,20

Package Shape:

SQUARE

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Qualification Status:

Not Qualified

Maximum Seated Height:

.715 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Voltage Tolerance:

3 %

Width:

1.57 mm

Trade Compliance

LD3986J3333R Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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