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LD3986J285R-E

STMicroelectronics

LD3986J285R-E by STMicroelectronics

LD3986J285R-E from STMicroelectronics is a fixed positive multiple output LDO regulator, ideal for compact applications. It features a max dropout voltage of 0.1V, operates b/w -40 °C to 125°C, and delivers dual outputs at 2.85V with up to 150mA each. Its thin profile and surface mount design make it suitable for space-constrained environments.

Median Price

-

Lifecycle Status

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3

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1k+

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Digiode

USA . 3,748 parts In-Stock

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Anansix

USA . 1,968 parts In-Stock

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1,968

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Vyrian

USA . 592 parts In-Stock

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592

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IDEA Electronic Components Group

UK . 1,962 parts In-Stock

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$7.573

100+ parts

-

1k+ parts

$6.816

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1,962

$7.573

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$6.816

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MKK Technologies

India . 73 parts In-Stock

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$14.241

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73

$14.241

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DigiPath Technology Company

USA . 73 parts In-Stock

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$14.241

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73

$14.241

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Corphita

USA . 2,814 parts In-Stock

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2,814

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Parana Technologies

USA . 1,654 parts In-Stock

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$9.055

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1,654

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$9.055

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Overview

Elevate your designs with the LD3986J285R-E from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance fixed LDO regulator delivers exceptional voltage stability and efficiency, ensuring reliable power for diverse applications. With outstanding thermal performance and compact packaging, it seamlessly integrates into any project while providing superior reliability and precision. Trust STMicroelectronics to enhance your next breakthrough!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body enhances durability and provides excellent thermal and electrical insulation.

Maximum Dropout Voltage-2: 1 V

A low maximum dropout voltage ensures efficient performance, particularly important for battery-operated devices.

Maximum Dropout Voltage-1: 1 V

This low dropout voltage contributes to better voltage regulation even at low input-to-output voltage differentials.

Surface Mount: YES

Surface mount capability allows for compact designs and automated PCB assembly, reducing production costs.

Operating Temperature (TJ-Max): 125 °C

A high maximum operating temperature rating ensures reliability and stability in demanding environments.

Minimum Output Voltage-2: 2.7645 V

Allows for a stable and reliable output, suitable for various applications requiring specific voltage levels.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS processes, providing low power consumption and high-speed performance.

Nominal Output Voltage-2: 2.85 V

Provides a precise voltage output, making it ideal for systems that require accurate voltage regulation.

Package Shape: SQUARE

A square package shape allows for easier mounting and layout considerations in compact electronic designs.

Terminal Form: BALL

Ball terminals ensure reliable electrical connections and are suitable for high-density applications.

Operating Temperature (TJ-Min): -40 °C

This wide temperature range ensures functionality in extreme conditions, making it versatile for various applications.

Packing Method: TR

Tape and reel packing allows for efficient handling and automation during the manufacturing process.

Minimum Output Voltage-1: 2.7645 V

Consistent minimum output voltage across outputs enhances the product's reliability and performance.

Maximum Voltage Tolerance: 3 %

A tolerance of 3% ensures that the voltage remains within acceptable limits, providing design flexibility.

Nominal Output Voltage-1: 2.85 V

The nominal output voltage ensures reliable performance, meeting the needs of various electronic circuits.

No. of Terminals: 8

Eight terminals provide robust connectivity options and support multiple output configurations.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style enables high-density mounting and is ideal for modern compact designs.

Adjustability: FIXED

Fixed output simplifies design considerations, providing reliable performance without the need for external components.

Terminal Pitch: 0.5 mm

A fine terminal pitch is suitable for high-density layouts, making it ideal for space-constrained applications.

Maximum Line Regulation: 0.0097 %

Low line regulation enhances the consistency of output voltage despite variations in the input voltage.

Regulator Type: FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

This type ensures stable and regulated voltage outputs, critical for powering sensitive electronics.

Terminal Position: BOTTOM

Bottom terminals facilitate efficient heat dissipation and easier integration into designs with limited space.

Maximum Output Voltage-1: 2.9355 V

This maximum output voltage is suitable for various applications, ensuring compatibility with different components.

Maximum Seated Height: 0.715 mm

A low seated height contributes to compact designs, making it ideal for modern electronics where space is premium.

Width: 1.57 mm

A narrow width helps in fitting multiple components in a tight layout, enhancing design efficiency.

Maximum Load Regulation: 0.04246 %

Exceptional load regulation provides stable output voltage, critical for maintaining performance under varying loads.

Maximum Output Voltage-2: 2.9355 V

The dual maximum output voltage options provide flexibility for powering different circuit sections.

Minimum Input Voltage: 2.5 V

Supports operation at low input voltages, making it suitable for battery-powered applications.

Maximum Input Voltage: 6 V

A maximum input voltage of 6V allows for compatibility with a wide range of systems and power sources.

Maximum Input Voltage Absolute: 6 V

The absolute maximum input rating ensures safety and robustness in designs exposed to varying voltages.

Maximum Output Current-1: 0.15 A

This output current rating provides sufficient power for a variety of low to moderate load applications.

No. of Outputs: 2

Having two outputs allows for powering multiple devices from a single LDO, improving overall design efficiency.

Nominal Dropout Voltage-1: 0.05 V

A very low nominal dropout voltage enhances efficiency in voltage regulation, particularly important in battery applications.

Length: 1.57 mm

Compact dimensions allow for flexibility in layout and design, suitable for space-constrained applications.

Maximum Input Voltage: 6 V

This voltage rating plays a crucial role in extending the application range of the LDO in various electronic systems.

Maximum Output Current-2: 0.15 A

Similar to output current-1, this rating allows multiple outputs to service devices requiring moderate current loads.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO LD3986J285R-E attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.1 V

Nominal Dropout Voltage-1:

.05 V

Maximum Dropout Voltage-2:

.1 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

6 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

S-PBGA-B8

Length:

1.57 mm

Maximum Line Regulation:

.0097 %

Maximum Load Regulation:

.04246 %

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

8

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.15 A

Maximum Output Current-2:

.15 A

Maximum Output Voltage-1:

2.9355 V

Minimum Output Voltage-1:

2.7645 V

Nominal Output Voltage-1:

2.85 V

Maximum Output Voltage-2:

2.9355 V

Minimum Output Voltage-2:

2.7645 V

Nominal Output Voltage-2:

2.85 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,3X3,20

Package Shape:

SQUARE

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification Status:

Not Qualified

Maximum Seated Height:

.715 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

3 %

Width:

1.57 mm

Trade Compliance

LD3986J285R-E Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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