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L99H01XPTR

STMicroelectronics

L99H01XPTR by STMicroelectronics

L99H01XPTR by STMicroelectronics is a versatile motion control IC designed for automotive applications. It operates within a supply voltage range of 6-28V and withstands temperatures from -40 °C to 150°C. This compact, surface-mount device features 36 terminals and supports brush DC motor control.

Median Price

$2.370

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 10,000 parts In-Stock

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-

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10,000

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Avnet

USA . 1,000 parts In-Stock

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1,000

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Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 37,310 parts In-Stock

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37,310

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Chip Stock

USA . 15,240 parts In-Stock

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15,240

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TME

Poland . 10,000 parts In-Stock

1+ parts

-

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$2.370

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10,000

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-

$2.370

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Vyrian

USA . 3,536 parts In-Stock

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3,536

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Digiode

USA . 3,364 parts In-Stock

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3,364

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Anansix

USA . 2,353 parts In-Stock

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2,353

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,339 parts In-Stock

1+ parts

$2.697

100+ parts

-

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2,339

$2.697

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IDEA Electronic Components Group

UK . 8 parts In-Stock

1+ parts

$7.608

100+ parts

-

1k+ parts

$6.848

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-

8

$7.608

-

$6.848

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AZTECH Wire

Italy . 586 parts In-Stock

1+ parts

$12.950

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-

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586

$12.950

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MKK Technologies

India . 1,687 parts In-Stock

1+ parts

$14.307

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1,687

$14.307

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DigiPath Technology Company

USA . 1,687 parts In-Stock

1+ parts

$14.307

100+ parts

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1,687

$14.307

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Microchip USA

USA . 2,660 parts In-Stock

1+ parts

$18.180

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2,660

$18.180

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ChipstoGo Electronic ltd

UK . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,993 parts In-Stock

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4,993

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A-Z Elektronik GmbH

Germany . 2,943 parts In-Stock

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2,943

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Alle Elektronik GmbH

Germany . 1,962 parts In-Stock

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1,962

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Parana Technologies

USA . 1,718 parts In-Stock

1+ parts

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100+ parts

$9.097

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1,718

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$9.097

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Component Stockers USA

USA . 1,384 parts In-Stock

1+ parts

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$2.700

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1,384

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$2.700

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Overview

Elevate your motion control solutions with the L99H01XPTR from STMicroelectronics, a trusted leader in semiconductor innovation. Designed for superior performance and reliability, this robust IC excels in automotive applications, ensuring optimal efficiency even in extreme conditions. With its compact form factor and advanced technology, it simplifies integration while delivering exceptional value, giving you the competitive edge in your projects. Discover the power of precision with ST's commitment to quality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This robust material is commonly used in electronics, providing good protection and durability in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs, enabling higher density circuit layouts and reducing manufacturing costs.

Package Shape: RECTANGULAR

A rectangular shape facilitates efficient placement on PCBs and optimizes space usage in device designs.

Nominal Supply Voltage (Vsup): 13 V

A nominal supply voltage of 13 V offers flexibility for a variety of applications while ensuring optimal performance.

Power Supplies (V): 3.3/5, 6/28

Supports multiple voltage ranges for diverse power supply needs, making it suitable for various systems.

No. of Terminals: 36

The 36 terminals provide ample connectivity options, allowing for complex circuit designs and enhanced functionality.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

This packaging style is ideal for automation, improving production efficiency while saving space on the PCB.

Maximum Operating Temperature: 150 °C

High operating temperature tolerance ensures reliability under challenging conditions, making it perfect for automotive applications.

Minimum Operating Temperature: -40 °C

The ability to function in extremely low temperatures broadens application possibilities in harsh environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish reduces oxidation and provides a stable connection, enhancing overall reliability.

Terminal Position: DUAL

Dual terminal positioning allows for flexibility in PCB design, aiding efficient routing and layout.

Maximum Seated Height: 2.45 mm

A low profile reduces overall space requirements in electronic assemblies, making design more compact.

Width: 7.5 mm

Compact width aids in fitting the IC into smaller devices, beneficial for modern electronics.

Other IC type: BRUSH DC MOTOR CONTROLLER

Specifically designed for motor control, optimizing performance in automotive and industrial applications.

Minimum Supply Voltage (Vsup): 6 V

Allows operation from lower voltage sources, increasing compatibility with various power management systems.

Maximum Time At Peak Reflow Temperature (s): 30

Extended peak reflow time helps ensure thorough soldering without damaging the component.

Peak Reflow Temperature °C: 260

A high reflow temperature capability ensures compatibility with modern soldering processes necessary for high-density PCBs.

Length: 10.3 mm

Compact length optimizes PCB layout and design flexibility for compact electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive grade guarantees high performance and reliability in demanding environments typical for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, ideal for efficient motor control.

Terminal Form: GULL WING

Gull wing terminals provide good mechanical strength and ease of visual inspection during assembly.

Terminal Pitch: 0.5 mm

Fine terminal pitch supports higher I/O density, enabling advanced functionalities in compact spaces.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, guiding proper storage and handling, ensuring reliability.

Maximum Supply Voltage (Vsup): 28 V

Ability to handle a high maximum supply voltage enhances compatibility with a wide range of applications.

Technical Specifications

Motion Control ICs L99H01XPTR attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,6/28

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

L99H01XPTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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