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L99H01XP

STMicroelectronics

L99H01XP by STMicroelectronics

L99H01XP by STMicroelectronics is a versatile motion control IC designed for automotive applications. It operates within a supply voltage range of 6-28V and supports temperatures from -40 °C to 150°C. This compact, surface-mount device features 36 terminals and is ideal for brush DC motor control.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 15,700 parts In-Stock

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15,700

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Vyrian

USA . 8,523 parts In-Stock

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8,523

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Digiode

USA . 2,732 parts In-Stock

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2,732

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Anansix

USA . 652 parts In-Stock

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652

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Vigor

Singapore . 1,571 parts In-Stock

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$2.700

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1,571

$2.700

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AZTECH Wire

Italy . 1,156 parts In-Stock

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$8.890

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1,156

$8.890

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Microchip USA

USA . 1,856 parts In-Stock

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$10.476

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1,856

$10.476

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IDEA Electronic Components Group

UK . 2,221 parts In-Stock

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$22.264

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$20.038

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2,221

$22.264

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$20.038

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MKK Technologies

India . 1,039 parts In-Stock

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$41.866

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1,039

$41.866

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DigiPath Technology Company

USA . 1,039 parts In-Stock

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$41.866

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1,039

$41.866

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RC Electronics

USA . 18,000 parts In-Stock

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18,000

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Corphita

USA . 4,091 parts In-Stock

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4,091

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A-Z Elektronik GmbH

Germany . 1,545 parts In-Stock

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1,545

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Alle Elektronik GmbH

Germany . 1,030 parts In-Stock

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1,030

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Parana Technologies

USA . 209 parts In-Stock

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$26.620

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Overview

Unlock unparalleled precision in motion control with the L99H01XP from STMicroelectronics. Renowned for its exceptional quality and reliability, STMicroelectronics empowers your designs with a robust IC that thrives in diverse applications, from automotive to industrial automation. Its sleek, compact form ensures seamless integration while delivering high performance across varying conditions. Elevate your projects with this versatile solution, engineered for excellence and built to last!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a durable and lightweight solution, ensuring longevity and reliability in various applications.

Surface Mount: YES

Surface mount technology allows for smaller PCB designs and is suitable for automated assembly, improving manufacturing efficiency.

Package Shape: RECTANGULAR

The rectangular shape allows for optimal space utilization on PCBs, facilitating compact designs.

Nominal Supply Voltage (Vsup): 13 V

A nominal voltage of 13 V balances good performance with energy efficiency, making it suitable for a wide range of applications.

Power Supplies (V): 3.3/5, 6/28

Supports multiple voltage levels, offering versatility for different applications and accommodating diverse system requirements.

No. of Terminals: 36

The high number of terminals provides ample connectivity options, enhancing the device's functionality and integration capabilities.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design enables high-density mounting, which is ideal for compact electronic devices.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures ensures reliability in extreme environments, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The product's functionality at low temperatures expands its usability in harsh climates and demanding applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin provides good solderability and corrosion resistance, ensuring reliable connections and enhancing the product's longevity.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layouts and efficient routing on the PCB, optimizing design space.

Maximum Seated Height: 2.45 mm

The low seated height helps in maintaining a slim profile, crucial for space-constrained applications.

Width: 7.5 mm

A compact width allows for easier integration into tight spaces within electronic systems.

Other IC type: BRUSH DC MOTOR CONTROLLER

Being a brush DC motor controller enhances control over motor operations, making it a versatile choice for motion control systems.

Minimum Supply Voltage (Vsup): 6 V

A low minimum supply voltage allows the device to be used in low-power applications, increasing versatility.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with modern soldering processes, improving manufacturing yield.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures robust soldering without damaging the IC, supporting reliable assembly processes.

Length: 10.3 mm

The compact length offers flexibility in PCB layout, ensuring that different components can coexist without excessive space requirements.

Temperature Grade: AUTOMOTIVE

Rated for automotive applications, it demonstrates capability and reliability in demanding conditions, suitable for vehicle electronics.

Technology: CMOS

Utilizing CMOS technology allows for low power consumption while maintaining high processing speeds, making it energy efficient.

Terminal Form: GULL WING

Gull wing terminals offer enhanced mechanical stability and ease of soldering, improving assembly process effectiveness.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for dense component placement, which is crucial for compact circuit designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates normal handling precautions, simplifying integration into commercial and industrial applications.

Maximum Supply Voltage (Vsup): 28 V

The high maximum supply voltage supports powerful applications, enhancing the versatility and performance of the device.

Technical Specifications

Motion Control ICs L99H01XP attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,6/28

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

L99H01XP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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