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L9949

STMicroelectronics

L9949 by STMicroelectronics

L9949 by STMicroelectronics is a versatile motion control IC designed for brush DC motor applications. It operates at a nominal voltage of 5V, supports up to 10A output current, and features a compact SO package. Ideal for robotics and automation systems, it enhances performance in space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,908 parts In-Stock

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5,908

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Digiode

USA . 1,229 parts In-Stock

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1,229

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Anansix

USA . 693 parts In-Stock

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693

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Q Components

USA . 220 parts In-Stock

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220

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 471 parts In-Stock

1+ parts

$4.731

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471

$4.731

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IDEA Electronic Components Group

UK . 667 parts In-Stock

1+ parts

$6.138

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$5.524

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667

$6.138

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$5.524

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MKK Technologies

India . 1,425 parts In-Stock

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$11.543

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1,425

$11.543

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DigiPath Technology Company

USA . 1,425 parts In-Stock

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$11.543

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1,425

$11.543

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AZTECH Wire

Italy . 608 parts In-Stock

1+ parts

$19.580

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608

$19.580

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Kepictronics

USA . 27,800 parts In-Stock

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27,800

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Vigor

Singapore . 7,500 parts In-Stock

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7,500

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,566 parts In-Stock

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4,566

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A-Z Elektronik GmbH

Germany . 2,654 parts In-Stock

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2,654

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Alle Elektronik GmbH

Germany . 1,769 parts In-Stock

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1,769

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Parana Technologies

USA . 120 parts In-Stock

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$7.339

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120

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$7.339

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Overview

Elevate your motion control projects with the L9949 from STMicroelectronics, a trusted leader in innovation. This versatile IC simplifies brush DC motor management, ensuring smooth performance with exceptional reliability. Designed for demanding applications, it combines robust quality and efficiency, empowering creators to enhance automation, robotics, and consumer electronics. Experience the benefits of seamless integration and superior durability, making your designs not only smarter but also more efficient!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and thermal stability, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact design, making it ideal for space-constrained applications.

No. of Functions: 3

Having multiple functions integrated into a single IC reduces component count and simplifies the design process.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient use of PCB space and allows for easier routing of traces.

Nominal Supply Voltage (Vsup): 5 V

5 V nominal voltage is common in many applications, ensuring compatibility with a wide range of systems.

Power Supplies (V): 5, 8/16

Support for multiple voltage levels provides flexibility in application designs and enhances compatibility.

No. of Terminals: 20

With 20 terminals, the IC can offer a rich set of functionalities and connections for various applications.

Package Style (Meter): SMALL OUTLINE

Small outline packages conserve board space and are often easier to handle in automated assembly processes.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability and reduces the risk of galvanic corrosion over time.

Terminal Position: DUAL

Dual terminal positioning allows for simplified layout and can improve signal integrity.

Maximum Seated Height: 3.6 mm

The compact height allows for slim designs and fits well in limited vertical spaces.

Width (mm): 11 mm

At 11 mm wide, this IC maintains a balance between size and functionality, making it easier to integrate into designs.

Other IC type: BRUSH DC MOTOR CONTROLLER

The integration of a brush DC motor controller makes this IC an excellent choice for motor control applications in robotics and automation.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5 V allows for flexibility in power source choices while maintaining reliable performance.

Maximum Time At Peak Reflow Temperature (s): 30

Supporting a peak reflow time of up to 30 seconds ensures that the IC can endure quality soldering processes without damage.

Peak Reflow Temperature °C: 245

A peak reflow temperature of 245 °C is suitable for modern soldering processes, ensuring reliable, long-lasting connections.

Length: 15.9 mm

The length is optimized for various applications, balancing physical size and functionality.

Maximum Output Current: 10 A

With a maximum output current of 10 A, this IC is powerful enough for driving larger motors, making it highly effective in demanding applications.

Technology: BCDMOS

BCDMOS technology enables high performance and efficiency, critical for modern motion control tasks.

Terminal Form: GULL WING

Gull wing terminals provide better mechanical strength and are advantageous for automated assembly processes.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standard for surface mount components, facilitating easy design and layout.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates moderate risk and necessitates typical handling precautions, balancing reliability and performance.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to handle supply voltages up to 5.5 V ensures compatibility with various power supply designs while enhancing flexibility.

Technical Specifications

Motion Control ICs L9949 attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

3

No. of Terminals:

20

Maximum Output Current:

10 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Power Supplies (V):

5,8/16

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

11 mm

Trade Compliance

L9949 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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