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L9942XPTR

STMicroelectronics

L9942XPTR by STMicroelectronics

L9942XPTR by STMicroelectronics is a versatile motion control IC designed for stepper motor applications. It operates at a nominal voltage of 5V, supports up to 2.5A output current, and features a compact 24-terminal package. Ideal for space-constrained designs, it ensures efficient motor control in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,434 parts In-Stock

1+ parts

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3,434

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Digiode

USA . 3,337 parts In-Stock

1+ parts

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3,337

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Anansix

USA . 1,034 parts In-Stock

1+ parts

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1,034

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,286 parts In-Stock

1+ parts

$15.692

100+ parts

-

1k+ parts

$14.122

10k+ parts

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2,286

$15.692

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$14.122

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MKK Technologies

India . 1,631 parts In-Stock

1+ parts

$29.507

100+ parts

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1,631

$29.507

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DigiPath Technology Company

USA . 1,631 parts In-Stock

1+ parts

$29.507

100+ parts

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10k+ parts

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1,631

$29.507

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Corphita

USA . 1,434 parts In-Stock

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1,434

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Parana Technologies

USA . 1,412 parts In-Stock

1+ parts

-

100+ parts

$18.762

1k+ parts

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1,412

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$18.762

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Overview

Unlock the potential of your motion control applications with the L9942XPTR from STMicroelectronics! Renowned for its reliability and innovation, STMicroelectronics delivers this compact, high-performance IC designed to optimize stepper motor control. With exceptional power handling and versatility, the L9942XPTR ensures seamless operation in robotics, automation, and industrial systems, providing unmatched efficiency and precision that elevates your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and protection against environmental factors, enhancing the reliability of the Motion Control IC in various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of space on PCBs, facilitating compact designs and enabling higher-density assemblies.

Package Shape: RECTANGULAR

The rectangular shape offers ease of placement on printed circuit boards, which can improve manufacturing efficiency.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5 V is compatible with many common systems, making it easy to integrate into existing designs.

Power Supplies (V): 3.3/5, 7/16

Support for multiple power supply voltages allows flexibility in design and helps accommodate various application requirements.

No. of Terminals: 24

With 24 terminals, the IC can provide a variety of connection options, enhancing its functionality for complex applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The heat sink/slugs in a small outline package help manage heat dissipation effectively, ensuring reliable operation under load.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent conductivity and corrosion resistance, improving the longevity of connections.

Terminal Position: DUAL

Dual terminal positioning can facilitate better routing of traces on PCBs and potentially improves signal integrity.

Maximum Seated Height: 2.47 mm

A low maximum seated height supports compact design layouts, aiding in the development of smaller, more efficient electronic devices.

Width: 7.5 mm

This width strikes a balance between a compact design and providing enough area for effective thermal management.

Other IC type: STEPPER MOTOR CONTROLLER

Being a stepper motor controller makes it ideal for precision motion control applications, such as robotics and CNC machinery.

Minimum Supply Voltage (Vsup): 3 V

The ability to operate as low as 3 V ensures compatibility with a wide range of power sources, enhancing versatility.

Length: 10.3 mm

A moderate length enhances configurability in various layouts, ensuring adaptability across multiple designs.

Maximum Supply Current (Isup): 20 mA

A maximum supply current of 20 mA is efficient for low-power applications, extending battery life in portable devices.

Maximum Output Current: 2.5 A

The capability of delivering up to 2.5 A allows the IC to drive larger motors effectively, making it suitable for high-performance applications.

Terminal Form: GULL WING

Gull wing terminal form provides excellent soldering characteristics, ensuring reliable connections and simplified assembly.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for denser designs and improved PCB layout, making it easier to fit into compact applications.

Maximum Supply Voltage (Vsup): 5.3 V

With a maximum supply voltage of 5.3 V, this IC can handle a range of input voltages, ensuring flexibility across different systems.

Technical Specifications

Motion Control ICs L9942XPTR attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO REQUIRES 7V TO 20V SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Output Current:

2.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

3.3/5,7/16

Qualification:

Not Qualified

Maximum Seated Height:

2.47 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

20 mA

Maximum Supply Voltage (Vsup):

5.3 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

L9942XPTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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