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L6201P

STMicroelectronics

L6201P by STMicroelectronics

STMicroelectronics L6201P is a full bridge peripheral driver with 20 terminals. It operates at supply voltages ranging from 12V to 48V, featuring built-in thermal protection. With a small outline package and source/sink output current flow direction, it is ideal for driving motors in various applications.

Median Price

$10.000

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TEDSS.com

USA . 45 parts In-Stock

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$10.000

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Digiode

USA . 4,864 parts In-Stock

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Anansix

USA . 1,400 parts In-Stock

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1,400

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Vyrian

USA . 598 parts In-Stock

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Electronics Depot

USA . 352 parts In-Stock

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352

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ComSIT Distribution GmbH

Germany . 288 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 246 parts In-Stock

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Holdelec - ElecDif-Pro

France . 145 parts In-Stock

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J & M Industries LLC

USA . 33 parts In-Stock

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Goldney Electronics S.L.

Spain . 20 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 847 parts In-Stock

1+ parts

$12.913

100+ parts

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$11.622

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847

$12.913

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$11.622

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MKK Technologies

India . 1,179 parts In-Stock

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$24.282

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$24.282

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DigiPath Technology Company

USA . 1,179 parts In-Stock

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$24.282

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$24.282

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Lixinc

USA . 8,104 parts In-Stock

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Corphita

USA . 2,481 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,018 parts In-Stock

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2,018

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Parana Technologies

USA . 1,546 parts In-Stock

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$15.440

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1,546

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$15.440

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Alle Elektronik GmbH

Germany . 1,345 parts In-Stock

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Kepictronics

USA . 86 parts In-Stock

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86

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Assy Fe

Spain . 14 parts In-Stock

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Overview

Unlocking a world of possibilities, the STMicroelectronics L6201P peripheral driver is a game-changer in the industry. With a focus on quality and reliability, STMicroelectronics delivers cutting-edge technology that guarantees superior performance. This versatile product is perfect for a wide range of applications, offering customers unmatched value and benefits. Whether you're looking to enhance efficiency or improve functionality, the L6201P is your go-to solution. Trust STMicroelectronics to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material in the package body makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 48 V

The high maximum supply voltage of 48V enables this peripheral driver to be used in a wide range of voltage applications, offering versatility.

Built-in Protections: THERMAL

The built-in thermal protection ensures the safety and reliability of the peripheral driver by preventing overheating and potential damage.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline package style with a heat sink/slug design helps in efficient heat dissipation, ensuring optimal performance of the peripheral driver.

Output Characteristics: TOTEM-POLE

The totem-pole output characteristic offers both sourcing and sinking capabilities, making it suitable for driving a variety of loads.

Technology: BICMOS

The BICMOS technology used in the peripheral driver combines the advantages of both bipolar and CMOS technologies, providing high speed and low power consumption.

Maximum Supply Current: 15 mA

With a maximum supply current of 15mA, this peripheral driver operates efficiently without drawing excessive current, contributing to energy savings.

Technical Specifications

Peripheral Drivers L6201P attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

THERMAL

Input Characteristics:

STANDARD

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

15.9 mm

No. of Functions:

1

No. of Terminals:

20

Output Characteristics:

TOTEM-POLE

Output Current Flow Direction:

SOURCE AND SINK

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

48 V

Minimum Supply Voltage:

12 V

Nominal Supply Voltage:

36 V

Surface Mount:

YES

Technology:

BICMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

11 mm

Trade Compliance

L6201P Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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