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L6204D013TR

STMicroelectronics

L6204D013TR by STMicroelectronics

STMicroelectronics L6204D013TR is a full-bridge peripheral driver with 2 functions, operating from 12V to 48V. It offers transient and thermal protections, suitable for various applications requiring a source output current flow direction. The small outline package style with gull wing terminals makes it ideal for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,973 parts In-Stock

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5,973

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Chip Stock

USA . 3,475 parts In-Stock

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3,475

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Digiode

USA . 2,497 parts In-Stock

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2,497

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Anansix

USA . 1,887 parts In-Stock

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1,887

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,400 parts In-Stock

1+ parts

$3.132

100+ parts

-

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$2.819

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-

1,400

$3.132

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$2.819

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MKK Technologies

India . 228 parts In-Stock

1+ parts

$5.889

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-

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228

$5.889

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DigiPath Technology Company

USA . 228 parts In-Stock

1+ parts

$5.889

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-

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228

$5.889

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AZTECH Wire

Italy . 500 parts In-Stock

1+ parts

$10.067

100+ parts

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500

$10.067

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Microchip USA

USA . 483 parts In-Stock

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$19.118

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483

$19.118

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Ampacity Inc.

Singapore . 274 parts In-Stock

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$35.500

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274

$35.500

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Lixinc

USA . 13,367 parts In-Stock

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Corphita

USA . 4,988 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,677 parts In-Stock

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4,677

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Argo Parts USA

USA . 4,362 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,118 parts In-Stock

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Continental Prestige Electronics

USA . 1,457 parts In-Stock

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Kepictronics

USA . 989 parts In-Stock

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989

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Computer Components Inc. - USA

USA . 909 parts In-Stock

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909

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Parana Technologies

USA . 741 parts In-Stock

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$3.744

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741

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$3.744

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Unleash the power of your devices with the L6204D013TR from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality and reliability. This full bridge-based peripheral driver offers built-in protections against transients and thermal issues, ensuring smooth operation and peace of mind. With a maximum supply voltage of 48V and a minimum supply voltage of 12V, this versatile component is perfect for a wide range of applications. Upgrade your projects today with the L6204D013TR and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the peripheral driver, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 48 V

Supports a wide range of supply voltages, making it versatile for various applications.

No. of Functions: 2

Offers multiple functions in a single component, saving space and reducing the need for additional peripheral drivers.

Package Shape: RECTANGULAR

Compact design that fits well in electronic systems, optimizing space usage.

Built-in Protections: TRANSIENT; THERMAL

Ensures the peripheral driver is protected from transient voltage spikes and thermal overload, enhancing reliability.

No. of Terminals: 28

Plenty of terminals for connecting to external components, offering flexibility in system design.

Package Style (Meter): SMALL OUTLINE

Sleek and compact package style that is easy to integrate into circuit designs.

Minimum Supply Voltage: 12 V

Operates efficiently at low supply voltages, saving energy and reducing power consumption.

Terminal Finish: TIN LEAD

Provides good conductivity and solderability for secure connections with other components.

Width: 7.5 mm

Narrow width that allows for dense packing on circuit boards, maximizing component density.

Length: 17.9 mm

Optimal length for fitting into compact electronic devices without taking up too much space.

Technology: BCDMOS

Utilizes advanced BCDMOS technology for efficient performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminals provide secure mechanical and electrical connections, enhancing reliability.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy installation and compatibility with various circuit board designs.

Interface IC Type: FULL BRIDGE BASED PERIPHERAL DRIVER

Full bridge interface IC type for precise control and efficient operation of peripheral devices.

Output Current Flow Direction: SOURCE

Source output current flow direction for reliable and consistent performance in driving external components.

Technical Specifications

Peripheral Drivers L6204D013TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; THERMAL

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

17.9 mm

No. of Functions:

2

No. of Terminals:

28

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

48 V

Minimum Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

L6204D013TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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