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L6204

STMicroelectronics

L6204 by STMicroelectronics

STMicroelectronics L6204 is a full bridge peripheral driver with 2 functions, operating at 12-48V. It features transient and thermal protections, BCDMOS technology, and matte tin terminals in a rectangular package. Ideal for applications requiring source output current flow direction and a compact in-line style design.

Median Price

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Lifecycle Status

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Anansix

USA . 2,767 parts In-Stock

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Digiode

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Vyrian

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Rebound Electronics

UK . 500 parts In-Stock

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ComSIT Distribution GmbH

Germany . 146 parts In-Stock

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PC Components Company LLC

USA . 130 parts In-Stock

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Semi Source

USA . 80 parts In-Stock

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80

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Sogenti Electronics

Canada . 36 parts In-Stock

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Bristol Electronics

USA . 15 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Holdelec - ElecDif-Pro

France . 8 parts In-Stock

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LittleDiode

UK . 4 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 2 parts In-Stock

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IDEA Electronic Components Group

UK . 446 parts In-Stock

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$6.516

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$5.865

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$6.516

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AZTECH Wire

Italy . 254 parts In-Stock

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$12.078

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MKK Technologies

India . 728 parts In-Stock

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$12.254

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DigiPath Technology Company

USA . 728 parts In-Stock

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$12.254

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Ampacity Inc.

Singapore . 419 parts In-Stock

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$16.500

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Kepictronics

USA . 23,000 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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Continental Prestige Electronics

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Corphita

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A-Z Elektronik GmbH

Germany . 2,238 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,492 parts In-Stock

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Parana Technologies

USA . 1,481 parts In-Stock

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Argo Parts USA

USA . 247 parts In-Stock

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Schahn Electronic Components

Germany . 80 parts In-Stock

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Assy Fe

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Bastille Electronics

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Overview

Unlock the power of precision and reliability with the STMicroelectronics L6204. Crafted with the highest quality materials and cutting-edge technology, this full bridge based peripheral driver is a game-changer in the industry. With built-in protections for transient and thermal events, this product ensures safety and peace of mind for your applications. Whether you're in robotics, automation, or motor control, the L6204 delivers unmatched performance and efficiency. Elevate your projects with the value and benefits that only STMicroelectronics can provide. Choose the L6204 for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable applications.

Maximum Supply Voltage: 48 V

With a maximum supply voltage of 48V, this peripheral driver can handle high power requirements, making it suitable for a wide range of devices.

No. of Functions: 2

Offering 2 functions in a single device increases efficiency and saves space on a circuit board, making it a cost-effective option.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into existing designs, simplifying the installation process.

Built-in Protections: TRANSIENT; THERMAL

The built-in transient and thermal protections ensure the safety and reliability of connected devices, providing peace of mind.

No. of Terminals: 20

With 20 terminals available, this peripheral driver offers flexibility in connecting various components, making it versatile.

Package Style (Meter): IN-LINE

The in-line package style saves space on a PCB, making it suitable for compact designs where space is limited.

Minimum Supply Voltage: 12 V

The minimum supply voltage of 12V allows for flexibility in power input options, catering to a variety of power sources.

Terminal Finish: MATTE TIN

The matte tin terminal finish ensures good electrical conductivity and corrosion resistance, enhancing the product's longevity.

Terminal Position: DUAL

The dual terminal position design facilitates easy installation and maintenance, improving overall usability.

Maximum Seated Height: 5.1 mm

The maximum seated height of 5.1mm allows for a low-profile design, ideal for applications where space is at a premium.

Width: 7.62 mm

The width of 7.62mm offers a compact form factor, making it suitable for installations where space is limited.

Technology: BCDMOS

The BCDMOS technology used in this peripheral driver provides high efficiency and low power consumption, ideal for energy-efficient applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure connections, reducing the risk of loose connections and ensuring reliability.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch offers compatibility with standard connectors, making it easy to integrate into existing systems.

Interface IC Type: FULL BRIDGE BASED PERIPHERAL DRIVER

The full bridge based interface IC type enhances the performance and efficiency of the peripheral driver, making it a reliable choice for demanding applications.

Output Current Flow Direction: SOURCE

The source output current flow direction ensures compatibility with a wide range of devices, making it versatile for different applications.

Technical Specifications

Peripheral Drivers L6204 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; THERMAL

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

No. of Functions:

2

No. of Terminals:

20

Output Current Flow Direction:

SOURCE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Maximum Supply Voltage:

48 V

Minimum Supply Voltage:

12 V

Surface Mount:

NO

Technology:

BCDMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

L6204 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

3930-00-951-4025, 3930009514025, 5365-99-828-6874, 5365998286874

NIIN

009514025, 998286874

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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