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HCF4046BE

STMicroelectronics

HCF4046BE by STMicroelectronics

HCF4046BE by STMicroelectronics is a Phase Locked Loop (PLL) & Frequency Synthesis Circuit with 16 terminals. It operates at temperatures ranging from -40 °C to 85°C and requires power supplies of 5V/15V. This CMOS technology device in a rectangular package is commonly used in industrial applications for frequency synthesis and phase-locked loop circuits.

Median Price

$125.000

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 12 parts In-Stock

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Vyrian

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Rebound Electronics

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Anansix

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ECAB

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LIBRA Elektronik GmbH

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Digiode

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ComSIT Distribution GmbH

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Halfin

Belgium . 122 parts In-Stock

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ABC Electronics Ltd.

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Technoshack Inc.

Canada . 108 parts In-Stock

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Sinequanon

UK . 94 parts In-Stock

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M&R Communications

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GES GmbH

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Electronics Depot

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LWI Electronics Inc

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Electronic Expediters

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ACDS - Activité Composants Distribution Service

France . 6 parts In-Stock

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Mentor Electronics Marketing, LLC

USA . 5 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 5 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 2 parts In-Stock

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LittleDiode

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Q Components

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IDEA Electronic Components Group

UK . 544 parts In-Stock

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$4.807

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$4.326

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MKK Technologies

India . 1,305 parts In-Stock

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$9.039

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DigiPath Technology Company

USA . 1,305 parts In-Stock

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$9.039

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A-Z Elektronik GmbH

Germany . 5,802 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,868 parts In-Stock

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Corphita

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Parana Technologies

USA . 1,919 parts In-Stock

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Northwest PG Solutions

USA . 1,556 parts In-Stock

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Native Components

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Perfect Parts

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Resion (Excess)

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Kepictronics

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Assy Fe

Spain . 31 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 6 parts In-Stock

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Overview

Upgrade your electronics projects with the high-quality HCF4046BE by STMicroelectronics. This Phase Locked Loop (PLL) & Frequency Synthesis Circuit offers unmatched performance and reliability, thanks to its innovative technology and industrial-grade construction. Whether you are designing communication systems, test equipment, or audio applications, this versatile component will provide precise frequency control and synchronization. Trust STMicroelectronics for cutting-edge solutions that deliver value and efficiency to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on a PCB, making it easier to integrate into electronic systems.

Power Supplies (V): 5/15

The product is versatile in terms of power supply options, allowing for compatibility with a wide range of systems.

No. of Terminals: 16

With 16 terminals, this product can support complex frequency synthesis circuits and PLL configurations, offering versatility in design.

Package Style (Meter): IN-LINE

The in-line package style allows for easy mounting and integration in linear configurations on a PCB.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in various environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in extreme cold environments without any performance degradation.

Terminal Finish: TIN LEAD

The tin lead finish provides good solderability and ensures a reliable electrical connection in the circuit.

Terminal Position: DUAL

The dual terminal position allows for flexibility in PCB layout and facilitates easier connectivity in different circuit configurations.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can operate reliably in harsh industrial environments with temperature fluctuations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product suitable for battery-operated devices and noise-sensitive applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides mechanical stability and ease of soldering during PCB assembly, ensuring a secure connection.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch offers compatibility with standard PCB grid layouts and facilitates easy integration into existing electronic designs.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits HCF4046BE attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

PLL or Frequency Synthesis Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

HCF4046BE Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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