Loading...

HCF4046BM1

STMicroelectronics

HCF4046BM1 by STMicroelectronics

HCF4046BM1 by STMicroelectronics is a CMOS Phase Locked Loop (PLL) circuit designed for precision frequency synthesis. It operates b/w 3-20 V, with a max temp of 125 °C and features a compact 16-terminal SO package. Ideal for military applications requiring robust performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,069 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,069

-

-

-

-

Vyrian

USA . 2,719 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,719

-

-

-

-

Anansix

USA . 2,308 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,308

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,117 parts In-Stock

1+ parts

$6.548

100+ parts

-

1k+ parts

$5.893

10k+ parts

-

1,117

$6.548

-

$5.893

-

MKK Technologies

India . 2,320 parts In-Stock

1+ parts

$12.312

100+ parts

-

1k+ parts

-

10k+ parts

-

2,320

$12.312

-

-

-

DigiPath Technology Company

USA . 2,320 parts In-Stock

1+ parts

$12.312

100+ parts

-

1k+ parts

-

10k+ parts

-

2,320

$12.312

-

-

-

Native Components

USA . 186 parts In-Stock

1+ parts

$22.485

100+ parts

-

1k+ parts

-

10k+ parts

-

186

$22.485

-

-

-

Northwest PG Solutions

USA . 202 parts In-Stock

1+ parts

$24.733

100+ parts

$22.260

1k+ parts

-

10k+ parts

-

202

$24.733

$22.260

-

-

Corphita

USA . 3,270 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,270

-

-

-

-

Parana Technologies

USA . 1,106 parts In-Stock

1+ parts

-

100+ parts

$7.829

1k+ parts

-

10k+ parts

-

1,106

-

$7.829

-

-

Overview

Unlock unparalleled performance with the HCF4046BM1 from STMicroelectronics, a trusted leader in cutting-edge semiconductor solutions. This robust Phase Locked Loop (PLL) is designed for versatile applications, ensuring reliability in even the most demanding environments. With its compact size and high-quality construction, it delivers exceptional precision and efficiency, making it the perfect choice for communication systems, automotive electronics, and industrial controls. Elevate your projects with superior technology that stands the test of time!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight packaging offers reliability and ease of integration into various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space.

Package Shape: RECTANGULAR

Rectangular shape facilitates easier layout and placement on printed circuit boards.

Nominal Supply Voltage (Vsup): 5 V

Standard supply voltage provides compatibility with a wide range of electronic systems.

Power Supplies (V): 5/15

Versatility in power requirements makes it suitable for diverse applications.

No. of Terminals: 16

A sufficient number of terminals allows for enhanced connectivity and functionality.

Package Style (Meter): SMALL OUTLINE

Small outline packaging results in lower space consumption, ideal for compact devices.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance ensures reliability in demanding environments.

Minimum Operating Temperature: -55 °C

Low temperature capability supports operation in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Quality terminal finish ensures excellent conductivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB design and easier layout.

Maximum Seated Height: 1.75 mm

Low height profile maintains a streamlined design, benefitting space-constrained applications.

Width: 3.9 mm

Compact width supports efficient use of PCB real estate in tight spaces.

Other IC type: PHASE LOCKED LOOP

This type of IC is essential for frequency synthesis, making it ideal for communication systems.

Minimum Supply Voltage (Vsup): 3 V

The flexibility of lower supply voltage enhances compatibility with battery-powered devices.

Length: 9.9 mm

Compact length promotes efficient integration into miniaturized electronic designs.

Temperature Grade: MILITARY

Designed for military applications, ensuring robust performance in rigorous conditions.

Technology: CMOS

CMOS technology delivers low power consumption and high noise immunity, ideal for portable applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering.

Terminal Pitch: 1.27 mm

Standard pitch allows for compatibility with various PCB designs.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity ensures the component is suitable for a wide range of manufacturing processes.

Maximum Supply Voltage (Vsup): 20 V

Higher maximum supply voltage allows for increased flexibility in system design and application.

Technical Specifications

Phase Locked Loops (PLL) & Frequency Synthesis Circuits HCF4046BM1 attributes and parameters. Explore more Phase Locked Loops (PLL) & Frequency Synthesis Circuits devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

PLL or Frequency Synthesis Circuits

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

HCF4046BM1 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 5