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E-L6386D

STMicroelectronics

E-L6386D by STMicroelectronics

E-L6386D by STMicroelectronics is a high-side MOSFET gate driver with a max supply voltage of 17V and a nominal output peak current limit of 0.65A. It features fast turn-on/off times of just 15ns, making it ideal for efficient power management in compact applications. Its small outline package ensures easy surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,976 parts In-Stock

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5,976

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Digiode

USA . 2,035 parts In-Stock

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2,035

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Anansix

USA . 1,326 parts In-Stock

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1,326

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 899 parts In-Stock

1+ parts

$0.953

100+ parts

-

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899

$0.953

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Northwest PG Solutions

USA . 509 parts In-Stock

1+ parts

$1.048

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-

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509

$1.048

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Microchip USA

USA . 199 parts In-Stock

1+ parts

$4.899

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-

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199

$4.899

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IDEA Electronic Components Group

UK . 2,257 parts In-Stock

1+ parts

$12.303

100+ parts

-

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$11.073

10k+ parts

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2,257

$12.303

-

$11.073

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AZTECH Wire

Italy . 1,127 parts In-Stock

1+ parts

$20.010

100+ parts

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1,127

$20.010

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MKK Technologies

India . 316 parts In-Stock

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$23.135

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316

$23.135

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DigiPath Technology Company

USA . 316 parts In-Stock

1+ parts

$23.135

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316

$23.135

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Ampacity Inc.

Singapore . 648 parts In-Stock

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$24.500

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648

$24.500

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Corphita

USA . 3,490 parts In-Stock

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3,490

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Parana Technologies

USA . 1,825 parts In-Stock

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$14.710

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1,825

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$14.710

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Vigor

Singapore . 168 parts In-Stock

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168

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Overview

Elevate your designs with the E-L6386D from STMicroelectronics—a top-tier MOSFET gate driver that combines exceptional performance with reliability. Renowned for their innovation, STMicroelectronics ensures this compact solution delivers rapid turn-on and turn-off times, perfect for high-efficiency applications in automotive, industrial, and consumer electronics. Experience enhanced performance and efficiency, empowering your projects with unmatched quality and enduring value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making the driver ideal for various applications.

Surface Mount: YES

Surface mount capability allows for compact PCB designs, optimizing space and improving design flexibility.

Maximum Supply Voltage: 17 V

A maximum supply voltage of 17 V ensures compatibility with a wide range of units, making it versatile for different uses.

Package Shape: RECTANGULAR

The rectangular package shape is practical for standard PCB layouts, facilitating easier integration into existing designs.

No. of Terminals: 14

With 14 terminals, this driver provides ample connections for a rich feature set while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

Small outline package style supports efficient space utilization, especially in compact electronic devices.

Terminal Finish: TIN LEAD

The tin-lead finish enhances solderability, ensuring reliable connections during assembly and prolonged product lifespan.

Terminal Position: DUAL

Dual terminal positioning aids in flexibility of layout and design, granting easier access for routing and connections.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm contributes to a thinner profile, making it suitable for space-constrained applications.

Width: 3.9 mm

The narrow width of 3.9 mm allows for dense PCB layout while maintaining effective thermal properties.

High Side Driver: YES

The inclusion of a high side driver enables efficient switching of loads connected to the positive supply voltage.

Length: 8.65 mm

At a length of 8.65 mm, this driver strikes an optimal balance between compactness and connectivity.

Terminal Form: GULL WING

Gull wing terminals provide superior soldering characteristics and are easy to mount and inspect, improving manufacturing efficiency.

Nominal Supply Voltage: 15 V

With a nominal supply voltage of 15 V, this driver is well-suited for applications requiring stable performance at standard voltages.

Turn-on Time: 0.015 us

A rapid turn-on time of 0.015 microseconds facilitates fast switching, improving efficiency and performance in high-frequency applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standard for many applications, making it easier to integrate into existing designs.

Nominal Output Peak Current Limit: 0.65 A

A peak current limit of 0.65 A indicates that this driver can handle substantial load requirements, providing reliability in demanding applications.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

As a half bridge-based driver, it provides efficient control of high side and low side MOSFETs, making it suitable for H-bridge applications.

Turn-off Time: 0.015 us

With a turn-off time of 0.015 microseconds, it enables quick response and minimizes switching losses, benefiting high-speed applications.

Technical Specifications

MOSFET Gate Drivers E-L6386D attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Nominal Output Peak Current Limit:

.65 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

17 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.015 us

Turn-on Time:

.015 us

Width:

3.9 mm

Trade Compliance

E-L6386D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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