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E-L6385D013TR

STMicroelectronics

E-L6385D013TR by STMicroelectronics

E-L6385D013TR from STMicroelectronics is a high-side MOSFET gate driver designed for efficient power management. It supports a max supply voltage of 17V, delivers up to 0.65A output peak current, and features an 8-terminal gull-wing package. Ideal for half-bridge applications in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,042 parts In-Stock

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10,042

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Digiode

USA . 2,686 parts In-Stock

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2,686

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Anansix

USA . 557 parts In-Stock

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557

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 235 parts In-Stock

1+ parts

$1.783

100+ parts

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235

$1.783

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Northwest PG Solutions

USA . 1,188 parts In-Stock

1+ parts

$1.961

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-

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1,188

$1.961

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IDEA Electronic Components Group

UK . 44 parts In-Stock

1+ parts

$3.594

100+ parts

-

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$3.234

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44

$3.594

-

$3.234

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MKK Technologies

India . 64 parts In-Stock

1+ parts

$6.757

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64

$6.757

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DigiPath Technology Company

USA . 64 parts In-Stock

1+ parts

$6.757

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64

$6.757

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Corohmni

South Africa . 122 parts In-Stock

1+ parts

$6.999

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122

$6.999

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AZTECH Wire

Italy . 848 parts In-Stock

1+ parts

$11.620

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848

$11.620

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Microchip USA

USA . 467 parts In-Stock

1+ parts

$14.255

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467

$14.255

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$15.783

100+ parts

$14.363

1k+ parts

$12.942

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500

$15.783

$14.363

$12.942

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Component Stockers USA

USA . 295 parts In-Stock

1+ parts

$99.990

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295

$99.990

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Corphita

USA . 2,848 parts In-Stock

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2,848

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Parana Technologies

USA . 970 parts In-Stock

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$4.297

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970

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$4.297

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Vigor

Singapore . 171 parts In-Stock

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171

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Overview

Unlock the potential of your designs with the E-L6385D013TR MOSFET Gate Driver from STMicroelectronics, a leader in innovation and quality. Engineered for reliability, this compact driver excels in high-performance applications, ensuring superior efficiency and enhanced control for your circuits. Trust in STMicroelectronics’ expertise to deliver robust solutions that optimize power management while reducing design complexity, empowering you to elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers excellent insulation and is lightweight, enhancing the overall durability and performance of the device.

Surface Mount: YES

Surface mount capability allows for compact designs and simplifies the PCB assembly process, making it suitable for modern electronics.

Maximum Supply Voltage: 17 V

A high maximum supply voltage provides versatility, allowing the driver to be used in a range of applications without risk of damage.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient, allowing for easier integration into various circuit layouts while maintaining optimal performance.

No. of Terminals: 8

Having 8 terminals facilitates multiple connections and functionality, increasing design flexibility and connectivity options.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps save board space, making it ideal for compact electronic devices and efficient designs.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures good solderability and reliable connections, enhancing long-term performance of the device.

Terminal Position: DUAL

Dual terminal positioning allows for more effective layout on PCB and easier routing of traces, optimizing the design process.

Maximum Seated Height: 1.75 mm

A low seated height contributes to a slim profile, enabling better airflow and thermal management in high-density applications.

Width: 3.9 mm

A narrow width helps in fitting the component into tighter spaces without compromising performance, making it versatile for various applications.

High Side Driver: YES

As a high side driver, it is excellent for driving loads that require higher voltages, enhancing its application range.

Length: 4.9 mm

Compact length helps in maintaining a tight layout while ensuring effective performance in space-constrained environments.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and soldering characteristics, ensuring reliability in assembly.

Nominal Supply Voltage: 15 V

The nominal voltage rating of 15V ensures compatibility with standard circuits, making it ideal for a range of applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for efficient spacing between terminals, reducing the risk of short circuits during PCB design.

Nominal Output Peak Current Limit: 0.65 A

The current limit of 0.65 A is sufficient for driving many loads, providing reliable control without excessive power loss.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

Being a half bridge driver enhances flexibility and integration with various MOSFET configurations, making it suitable for diverse applications.

Technical Specifications

MOSFET Gate Drivers E-L6385D013TR attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Nominal Output Peak Current Limit:

.65 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

17 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

E-L6385D013TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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