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E-L6386D013TR

STMicroelectronics

E-L6386D013TR by STMicroelectronics

E-L6386D013TR by STMicroelectronics is a high-side MOSFET driver with a max supply voltage of 17V and a nominal output peak current limit of 0.65A. It features fast turn-on and turn-off times of just 15ns, making it ideal for efficient power management in compact applications. Its small outline package ensures easy surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,855 parts In-Stock

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7,855

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Digiode

USA . 3,944 parts In-Stock

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3,944

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Anansix

USA . 2,433 parts In-Stock

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2,433

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Distributors (Availability)

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Native Components

USA . 724 parts In-Stock

1+ parts

$1.301

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-

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724

$1.301

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Northwest PG Solutions

USA . 1,889 parts In-Stock

1+ parts

$1.431

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-

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1,889

$1.431

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Advanced Electronics

New Zealand . 2,829 parts In-Stock

1+ parts

$3.464

100+ parts

$3.152

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$2.840

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-

2,829

$3.464

$3.152

$2.840

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IDEA Electronic Components Group

UK . 112 parts In-Stock

1+ parts

$4.570

100+ parts

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$4.113

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112

$4.570

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$4.113

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MKK Technologies

India . 1,321 parts In-Stock

1+ parts

$8.593

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1,321

$8.593

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DigiPath Technology Company

USA . 1,321 parts In-Stock

1+ parts

$8.593

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1,321

$8.593

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Corohmni

South Africa . 96 parts In-Stock

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$14.061

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96

$14.061

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AZTECH Wire

Italy . 383 parts In-Stock

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$15.670

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383

$15.670

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Microchip USA

USA . 5,732 parts In-Stock

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5,732

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Corphita

USA . 3,368 parts In-Stock

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Parana Technologies

USA . 1,304 parts In-Stock

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$5.464

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1,304

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$5.464

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Vigor

Singapore . 436 parts In-Stock

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436

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Overview

Elevate your designs with the E-L6386D013TR from STMicroelectronics, a leading innovator in the semiconductor industry. This high-performance MOSFET gate driver seamlessly enhances efficiency and reliability in various applications, from automotive to industrial controls. Its compact design and rapid switching capabilities empower engineers to achieve superior performance while optimizing space. Trust in STMicroelectronics' commitment to quality and innovation for unparalleled value in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The robust plastic/epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Surface mount capability facilitates compact designs and efficient PCB space utilization.

Maximum Supply Voltage: 17 V

A maximum supply voltage of 17V allows for versatility in powering applications that require higher voltage levels.

Package Shape: RECTANGULAR

The rectangular shape enhances compatibility with standard PCB layouts and optimizes component placement.

No. of Terminals: 14

With 14 terminals, the device can support complex circuitry while maintaining a manageable footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package allows for efficient use of space, making it ideal for compact electronic designs.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides excellent solderability and long-term reliability.

Terminal Position: DUAL

Dual terminal positioning enhances connectivity options, making integration into different circuit designs easier.

Maximum Seated Height: 1.75 mm

A low seated height ensures compatibility with slim profile applications, maintaining a sleek design.

Width: 3.9 mm

Narrow width aids in high-density designs, allowing for closer component placement on the PCB.

High Side Driver: YES

The inclusion of a high side driver enhances the ability to control load devices effectively, providing flexibility in design.

Length: 8.65 mm

Moderate length ensures sufficient pin counts while fitting well within compact design constraints.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and are easy to solder, enhancing assembly reliability.

Nominal Supply Voltage: 15 V

A nominal supply voltage of 15V allows efficient operation in applications requiring moderate power consumption.

Turn-on Time: 0.015 µs

Extremely fast turn-on time ensures rapid switching, enhancing performance in high-frequency applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard, aiding in compatibility with a broad range of PCB layouts.

Nominal Output Peak Current Limit: 0.65 A

A peak current limit of 0.65A supports a variety of load requirements, enabling the driver to cater to multiple applications.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

Being a half bridge based MOSFET driver provides capabilities for driving high and low side MOSFETs effectively in switching applications.

Turn-off Time: 0.015 µs

Quick turn-off time further enhances the device's performance by reducing power loss during the switching cycle.

Technical Specifications

MOSFET Gate Drivers E-L6386D013TR attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Nominal Output Peak Current Limit:

.65 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

17 V

Nominal Supply Voltage:

15 V

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.015 us

Turn-on Time:

.015 us

Width:

3.9 mm

Trade Compliance

E-L6386D013TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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